The Transactions of the Korean Institute of Electrical Engineers C (대한전기학회논문지:전기물성ㆍ응용부문C)

The Korean Institute of Electrical Engineers (대한전기학회)
권호 표지

THe Novel Silicon MEMS Package for MMICS

초고추파 집적 회로를 위한 새로운 실리콘 MEMS 패키지

  • 권영수 (아주대 공대 전자공학부 대학원) ;
  • 이해영 (아주대 공대 전자공학부 정) ;
  • 박재영 (LG전자기술원 소자재료연구소) ;
  • 김성아 (LG전자기술원 소자재료연구소)
  • Published : 2002.06.01
Download PDF
⟨ Previous Next ⟩

Abstract

In this paper, a MEMS silicon package is newly designed, fabricated for HMIC, and characterized for microwave and millimeter-wave device applications. The proposed package is fabricated by using two high resistivity silicon substrates and surface/bulk micromachining technology. It has a good performance characteristic such as -20㏈ of $S_11$/ and -0.3㏈ of $S_21$ up to 20㎓, which is useful in microwave region. It has also better heat transfer characteristics than the commonly used ceramic package. Since the proposed silicon MEMS package is easy to fabricate and wafer level chip scale packaging is also possible, the production cost can be much lower than the ceramic package. Since it will be a promising low-cost package for mobile/wireless applications.

Keywords

References

  1. Qun Wu Bumman Kim, 'MEMS Technology Moves Increasingly Toward Microwave Applications,' Microwave&RF July 2001 pp. 97-104
  2. D. S. Wein, 'Advanced Creramic Packaging For Microwave And Millimeter Wave Applications,' IEEE Trans. Antennas Propagat., vol. 43, Sept. 1995 pp. 940-948 https://doi.org/10.1109/8.410210
  3. Y. C. Shih, K. Kasel and L. Fong et. al, 'A High Performance Quartz Package For Millimeter-wave Applications,' IEEE MTT-S Int. Symp. Dig., 1991 pp. 1063-1066 https://doi.org/10.1109/MWSYM.1991.147197
  4. J.G. Yook, L.P.B. Katehi, et. al., 'Experimental and Theoretical Study of Parasitic Leakage/Resonance in a K/Ka-Band MMIC Package,' IEEE Trans. on Microwave Theory and Techniques, Vol. 44, No. 12, December 1996
  5. A. C. Reyes, S. M. El-Ghazaly, and S. Dorn et. al, 'Silicon As A Microwave Substrate,' IEEE MTT-S Int. Symp. Dig., 1994 pp. 1759-1762
  6. K.E. Petersen, 'Silicon as a Mechanical Material,' Proceedings of the IEEE, Vol. 70, No.5, May 1982 https://doi.org/10.1109/PROC.1982.12331
  7. J.E. Licari, 'Multichip Module Design, Fabrication and Testing,' Mc-Graw Hill, Inc., New York, 1995
  8. R. M. Henderson, and L. P. B. Katehi, 'Silicon-Based Micromachined Packages for High Frequency Applications,' IEEE Trans. Microwave Theory Tech., vol. 47, pp. 1563-1569 Aug. 1999 https://doi.org/10.1109/22.780409
  9. W. B. Choi, B. K. Ju, et. al, 'Anodic Bonding Technique under Low-Temperature and Low-Voltage using Evaporated Glass,' Vacuum Microelectronics Conference;IVMC'96, 9th International, 1996 pp. 427 -430 https://doi.org/10.1109/IVMC.1996.601857