• 제목/요약/키워드: work package

검색결과 385건 처리시간 0.027초

산촌개발사업 조성이후의 마을시설현황에 따른 주민만족도 평가에 관한 연구 (A Study on the Status of Village Facility and the Resident Satisfaction after Composition of Mountain Village Package Development Work)

  • 이상홍;신용호;서희숙
    • 한국주거학회논문집
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    • 제17권3호
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    • pp.71-78
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    • 2006
  • The purpose of this study is to grasp effectiveness of Mountain Village Package Development Work. Mountain Village Package Development Work was started for the welfare and economic activation plan of residents of village from 1995. We want to grasp a practical economic and welfare of residents of village through the village that is enforced Mountain Village Package Development Work after two-three years. The process of this study is as follows. First, we select the village that Mountain Village Package Development Work finished. Second, we grasp the status of Mountain Village Package Development Work through a field study on destination village. Third, we investigate the resident satisfaction.

The Effect of Manipulating Package Construct and Leadframe Materials on Fracture Potential of Plastically Encapsulated Microelectronic Packages During Thermal Cycling

  • Lee, Seong-Min
    • Transactions on Electrical and Electronic Materials
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    • 제2권3호
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    • pp.28-32
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    • 2001
  • It was studied in the present work how the thermal cycling performance of LOC (lead on chip) packages depends on the package construct or leadframe materials. First, package body thickness and Au wire diameter were manipulated for the selection of proper package design. Secondly, two different types of leadframe materials (i.e. copper and 52%Fe-48%Ni alloy) were tested to determine the better material for improved reliability margin of plastically encapsulated microelectronic packages. This work shows that manipulating package body thickness was more effective than an increase of Au wire from 23$\mu\textrm{m}$ to 33$\mu\textrm{m}$ for the prevention of wire debonding failure. Further, this work indicates that the LOC packages including the copper leadframes can be more susceptible to thermal cycling reliability degradation due to chip cracking than those including the alloy leadframes.

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리드 온 칩 패키징 기술을 이용하여 조립된 반도체 제품에서 패시베이션 박막의 TC 신뢰성에 영향을 미치는 요인들 (Factors to Influence Thermal-Cycling Reliability of Passivation Layers in Semiconductor Devices Utilizing Lead-on-Chip (LOC) Die Attach Technique)

  • 이성민;이성란
    • 한국재료학회지
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    • 제19권5호
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    • pp.288-292
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    • 2009
  • This article shows various factors that influence the thermal-cycling reliability of semiconductor devices utilizing the lead-on-chip (LOC) die attach technique. This work details how the modification of LOC package design as well as the back-grinding and dicing process of semiconductor wafers affect passivation reliability. This work shows that the design of an adhesion tape rather than a plastic package body can play a more important role in determining the passivation reliability. This is due to the fact that the thermal-expansion coefficient of the tape is larger than that of the plastic package body. Present tests also indicate that the ceramic fillers embedded in the plastic package body for mechanical strengthening are not helpful for the improvement of the passivation reliability. Even though the fillers can reduce the thermal-expansion of the plastic package body, microscopic examinations show that they can cause direct damage to the passivation layer. Furthermore, experimental results also illustrate that sawing-induced chipping resulting from the separation of a semiconductor wafer into individual devices might develop into passivation cracks during thermal-cycling. Thus, the proper design of the adhesion tape and the prevention of the sawing-induced chipping should be considered to enhance the passivation reliability in the semiconductor devices using the LOC die attach technique.

Magnetic and Thermal Evaluation of a Magnetic Tunneling Junction Current Sensor Package

  • Rhod, Eduardo;Peter, Celso;Hasenkamp, Willyan;Grion, Agner
    • 마이크로전자및패키징학회지
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    • 제23권4호
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    • pp.49-55
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    • 2016
  • Nowadays there are magnetic sensors in a wide variety of equipment such as computers, cars, airplanes, medical and industrial instruments. In many of these applications the magnetic sensors offer safe and non-invasive means of detection and are more reliable than other technologies. The electric current in a conductor generates a magnetic field detected by this type of sensor. This work aims to define a package dedicated to an electrical current sensor using a MTJ (Magnetic Tunnel Junction) as a sensing device. Four different proposals of packaging, three variations of the chip on board (CoB) package type and one variation of the thin small outline package (TSOP) were analyzed by COMSOL modeling software by simulating a brad range of current injection. The results obtained from the thermal and magnetic analysis has proven to be very important for package improvements, specially for heat dissipation performance.

Passive Temperature Compensation Package for Optical Long Period Fiber Gratings

  • Lee, Sang-Mae;Gu, Xijia
    • Journal of the Optical Society of Korea
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    • 제3권2호
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    • pp.74-79
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    • 1999
  • We present a simple design rule for a passive temperature-compensating optical package. We also present experimentally that a package fabricated by using the design rule compensates the temperature dependence of the resonant wavelength of an optical long period fiber grating by varying the strain inside the fiber, The package fabricated in this work consists of two pieced of brass tube, 10 mm long, and a piece of nylon rod, 45.4 mm long. It is shown that the package can compensate the temperature-induce wavelength shifts of the long period grating to a range of 6.8 pm/$^{\circ}C$, compared with 0..48 nm/$^{\circ}C$ for an uncompensated grating. The reduced strength of the fiber caused by exposure to ultraviolet limits the performance of the package to the range operating temperature form -3 $^{\circ}C$ to 7$0^{\circ}C$.

작업환경개선을 위한 목재포장공정에 있어서의 양끝절단포장적재장치 개발 (The package loading equipment development cutting both ends in the process of packaging lumber for improving the working environments)

  • 강지호;홍동표
    • 산업경영시스템학회지
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    • 제29권1호
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    • pp.135-142
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    • 2006
  • The package loading process of tile lumbering industry is an operation that after a pair of workers binds three or six lumber into a unit and cut the both ends of the lumber, carry and pack and load the weight cargo of 30-50kg. The package loading process causes lots of noise and wood dust when the lumber are cut and brings about the main cause of the musculoskeletal disorder when workers carry the heavy goods. Therefore, we developed the monolithic package loading equipment cutting both ends that is enable to improve the working method and environments of the existing package loading process. The noise and wood dust were reduced by developing the device and the main cause of shirking duties on working place was solved by preventing the musculoskeletal disorder and improving the working environments as excluding the work of carrying heavy goods.

원자력발전소 Work Breakdown Structure 개발 (Development of Work Breakdown Structure for Nuclear Power Plant)

  • 조영혁;양명덕
    • 한국건축시공학회:학술대회논문집
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    • 한국건축시공학회 2014년도 춘계 학술논문 발표대회
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    • pp.52-53
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    • 2014
  • The Work Breakdown Structure (WBS) is a primary tool which provides a framework that defines clear scope of all deliverables throughout the project life cycle. Once the WBS is established in projects, it should allow project team members to measure and manage work performances by the WBS; further, it should provide a reference point when any work scope needs to be redefined. Based on the project information in the Progress and Performance Measurement System (PPMS) of UAE's Barakha Nuclear Power Plant (BNPP) projects, an attempt was made to develop a new WBS which provides hierarchical and systematical decomposition of the total work scope of NPP construction projects while avoiding from the preexistence concept in Korean NPP projects that the WBS is a combination of Physical Breakdown Structure (PBS) and Functional Breakdown Structure (FBS). The unique features of the new WBS are as follows: (1) defined the definition of each level of the WBS, (2) subdivided the WBS into 5 hierarchical levels, and (3) adopted globally used general coding structure. The new WBS provides a basic hierarchical structure for the project scope and can be used as a basic tool for schedule control, performance measurement, project status monitoring, and communication among project participants. In addition, by putting the Work Package (WP) under the WBS, the Earned Value Management System (EVMS) per WP can be utilized for the project.

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BASIC RESEARCH OF SUB-PACKAGE PROBLEM IN KOREAN CONSTRUCTION INDUSTRY

  • Jinho Shin;Furusaka Shuzo
    • 국제학술발표논문집
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    • The 3th International Conference on Construction Engineering and Project Management
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    • pp.635-641
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    • 2009
  • In the building construction, the specialist contractors play the important roles in the point of the quality securing. Therefore, it is very important for the construction industry to study the sub-package problem. The sub-package problem includes two problems which should be solved. One is to decide the scope of works of each specialist contractor, and another one is to decide the particular specialist contractor which carries out the work. However, the sub-package problem in Korea is not clarified yet, although the circumstance around it has changed rapidly. Many factors influence to the sub-package problem regardless of internal factors or external factors of the project. The general contractor usually decides the sub-package under considering the project conditions. In case of the internal factors, each general contractor manages the organization and materials. But the external factors are relatively more difficult to control and predict than internal ones. But out of the external factors, the legal system has very close relationship with a sub-package problem especially in Korean construction system. So, this paper clarifies relationship between the legal system relating subcontracting and the state of sub-package.

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사례기반추론을 이용한 공동주택의 월간투입비용 예측모델 개발에 관한 연구 (A Study on Developing a Case-based Forecasting Model for Monthly Expenditures of Residential Building Projects)

  • 이준성
    • 한국건설관리학회논문집
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    • 제7권2호
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    • pp.138-147
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    • 2006
  • 건설업은 타산업, 특히 제조업 분야와 비하여 시장구성이 분절적이며 시장상황의 변동이 지극히 유동적이다. 그간 많은 연구자들이 기존의 비용예측 기법들을 통해 이러한 건설부문의 특성을 반영, 그 예측력을 높이기 위하여 많은 노력을 경주해오고 있다. 본 연구에서는 공동주택 비용투입 형태를 예측함에 있어서 사례기반추론(Case-Based Reasoning : CBR)을 이용, 기존 사업에 대한 실적데이터를 활용함에 있어서 유사한 프로젝트를 일정기준에 의하여 선별, 해당 비용정보만을 참조하여 향후 비용투입을 예측함으로써 그 정확도를 향상시키고자 하였다. 비용예측모델의 정확도를 제고하기 위해 비교 프로젝트간의 유사성을 비교함에 있어서, 비용정보는 세 가지 수준의 공종분류, 즉 전체프로젝트 수준, 7개 대공종 분류, 총 20개 세부공종별 분류에 따라 분석하였다. 본 연구의 결론은 데이터베이스화된 자료 중, 유사성을 계량화한 후 유사성평가 상위 $12{\sim}19%$의 프로젝트의 정보만을 참조하는 것이 그 예측도를 극대화시킬 수 있는 것으로 판명되었다.

웨딩 미니어쳐의 상품 개발에 관한 연구 (A Study on the Product Development for Wedding Miniature)

  • 김소영;백천의
    • 한국의상디자인학회지
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    • 제13권4호
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    • pp.153-165
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    • 2011
  • The purpose of this study is to take into consideration the package products of wedding miniature dress. The method of the research was mainly focused on precedent research data and general references. Furthermore the data on wedding dresses was mainly collected from internet sites. Ai; reflection customer's demands, more personal and distinctive design was planned reflecting trend in the sector of wedding dress. The results of the research is the following. First, the first consideration for designing product in wedding miniature was designed with the focus on what consumers are easy to make and on brilliance when having made. 8 pairs for barbie miniature and 2 pairs for ball joints were designed. Among these things, it designed colorfully with 6 pairs for wedding dress and 4 pairs for shooting, which are used in the right size. Second, as a result of seeing consumers' response by up-loading totally 10 pieces of miniature clothes on wedding miniature. com site, and were the most popular products. The aim is to suggest package product based on these two works. The design-based pattern, the fabric of being used, lace material, beads, and several trimmings are offered to 2 wedding miniature package products. Consumers can make own collection with a handicraft-based feeling by using this.

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