• Journal of the Korean housing association
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• v.17 no.3
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• pp.71-78
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• 2006

The purpose of this study is to grasp effectiveness of Mountain Village Package Development Work. Mountain Village Package Development Work was started for the welfare and economic activation plan of residents of village from 1995. We want to grasp a practical economic and welfare of residents of village through the village that is enforced Mountain Village Package Development Work after two-three years. The process of this study is as follows. First, we select the village that Mountain Village Package Development Work finished. Second, we grasp the status of Mountain Village Package Development Work through a field study on destination village. Third, we investigate the resident satisfaction.

• Transactions on Electrical and Electronic Materials
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• v.2 no.3
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• pp.28-32
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• 2001

It was studied in the present work how the thermal cycling performance of LOC (lead on chip) packages depends on the package construct or leadframe materials. First, package body thickness and Au wire diameter were manipulated for the selection of proper package design. Secondly, two different types of leadframe materials (i.e. copper and 52%Fe-48%Ni alloy) were tested to determine the better material for improved reliability margin of plastically encapsulated microelectronic packages. This work shows that manipulating package body thickness was more effective than an increase of Au wire from 23$\mu\textrm{m}$ to 33$\mu\textrm{m}$ for the prevention of wire debonding failure. Further, this work indicates that the LOC packages including the copper leadframes can be more susceptible to thermal cycling reliability degradation due to chip cracking than those including the alloy leadframes.

• Korean Journal of Materials Research
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• v.19 no.5
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• pp.288-292
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• 2009

This article shows various factors that influence the thermal-cycling reliability of semiconductor devices utilizing the lead-on-chip (LOC) die attach technique. This work details how the modification of LOC package design as well as the back-grinding and dicing process of semiconductor wafers affect passivation reliability. This work shows that the design of an adhesion tape rather than a plastic package body can play a more important role in determining the passivation reliability. This is due to the fact that the thermal-expansion coefficient of the tape is larger than that of the plastic package body. Present tests also indicate that the ceramic fillers embedded in the plastic package body for mechanical strengthening are not helpful for the improvement of the passivation reliability. Even though the fillers can reduce the thermal-expansion of the plastic package body, microscopic examinations show that they can cause direct damage to the passivation layer. Furthermore, experimental results also illustrate that sawing-induced chipping resulting from the separation of a semiconductor wafer into individual devices might develop into passivation cracks during thermal-cycling. Thus, the proper design of the adhesion tape and the prevention of the sawing-induced chipping should be considered to enhance the passivation reliability in the semiconductor devices using the LOC die attach technique.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.49-55
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• 2016

Nowadays there are magnetic sensors in a wide variety of equipment such as computers, cars, airplanes, medical and industrial instruments. In many of these applications the magnetic sensors offer safe and non-invasive means of detection and are more reliable than other technologies. The electric current in a conductor generates a magnetic field detected by this type of sensor. This work aims to define a package dedicated to an electrical current sensor using a MTJ (Magnetic Tunnel Junction) as a sensing device. Four different proposals of packaging, three variations of the chip on board (CoB) package type and one variation of the thin small outline package (TSOP) were analyzed by COMSOL modeling software by simulating a brad range of current injection. The results obtained from the thermal and magnetic analysis has proven to be very important for package improvements, specially for heat dissipation performance.

• Journal of the Optical Society of Korea
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• v.3 no.2
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• pp.74-79
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• 1999

We present a simple design rule for a passive temperature-compensating optical package. We also present experimentally that a package fabricated by using the design rule compensates the temperature dependence of the resonant wavelength of an optical long period fiber grating by varying the strain inside the fiber, The package fabricated in this work consists of two pieced of brass tube, 10 mm long, and a piece of nylon rod, 45.4 mm long. It is shown that the package can compensate the temperature-induce wavelength shifts of the long period grating to a range of 6.8 pm/$^{\circ}C$, compared with 0..48 nm/$^{\circ}C$ for an uncompensated grating. The reduced strength of the fiber caused by exposure to ultraviolet limits the performance of the package to the range operating temperature form -3 $^{\circ}C$ to 7$0^{\circ}C$.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.29 no.1
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• pp.135-142
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• 2006

The package loading process of tile lumbering industry is an operation that after a pair of workers binds three or six lumber into a unit and cut the both ends of the lumber, carry and pack and load the weight cargo of 30-50kg. The package loading process causes lots of noise and wood dust when the lumber are cut and brings about the main cause of the musculoskeletal disorder when workers carry the heavy goods. Therefore, we developed the monolithic package loading equipment cutting both ends that is enable to improve the working method and environments of the existing package loading process. The noise and wood dust were reduced by developing the device and the main cause of shirking duties on working place was solved by preventing the musculoskeletal disorder and improving the working environments as excluding the work of carrying heavy goods.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2014.05a
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• pp.52-53
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• 2014

The Work Breakdown Structure (WBS) is a primary tool which provides a framework that defines clear scope of all deliverables throughout the project life cycle. Once the WBS is established in projects, it should allow project team members to measure and manage work performances by the WBS; further, it should provide a reference point when any work scope needs to be redefined. Based on the project information in the Progress and Performance Measurement System (PPMS) of UAE's Barakha Nuclear Power Plant (BNPP) projects, an attempt was made to develop a new WBS which provides hierarchical and systematical decomposition of the total work scope of NPP construction projects while avoiding from the preexistence concept in Korean NPP projects that the WBS is a combination of Physical Breakdown Structure (PBS) and Functional Breakdown Structure (FBS). The unique features of the new WBS are as follows: (1) defined the definition of each level of the WBS, (2) subdivided the WBS into 5 hierarchical levels, and (3) adopted globally used general coding structure. The new WBS provides a basic hierarchical structure for the project scope and can be used as a basic tool for schedule control, performance measurement, project status monitoring, and communication among project participants. In addition, by putting the Work Package (WP) under the WBS, the Earned Value Management System (EVMS) per WP can be utilized for the project.

• International conference on construction engineering and project management
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• 2009.05a
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• pp.635-641
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• 2009

In the building construction, the specialist contractors play the important roles in the point of the quality securing. Therefore, it is very important for the construction industry to study the sub-package problem. The sub-package problem includes two problems which should be solved. One is to decide the scope of works of each specialist contractor, and another one is to decide the particular specialist contractor which carries out the work. However, the sub-package problem in Korea is not clarified yet, although the circumstance around it has changed rapidly. Many factors influence to the sub-package problem regardless of internal factors or external factors of the project. The general contractor usually decides the sub-package under considering the project conditions. In case of the internal factors, each general contractor manages the organization and materials. But the external factors are relatively more difficult to control and predict than internal ones. But out of the external factors, the legal system has very close relationship with a sub-package problem especially in Korean construction system. So, this paper clarifies relationship between the legal system relating subcontracting and the state of sub-package.

• Korean Journal of Construction Engineering and Management
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• v.7 no.2 s.30
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• pp.138-147
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• 2006

The objective of this research is to explore a more precise forecasting method by applying Case-based Reasoning (CBR). The newly suggested method in this study enables project managers to forecast monthly expenditures with less time and effort by retrieving and referring only projects of a similar nature, while filtering out irrelevant cases included in database. For the purpose of accurate forecasting, 1) the choice of the numbers of referring projects and 2) the better selection among three levels ? which include a 20-work package level, a 7-major work package level, and a total sum level analysis, were investigated in detail. It is concluded that selecting similar projects at $12{\sim}19%$ out of the whole database will produce a more precise forecasting. The new forecasting model, which suggests the predicted values based on previous projects, is more than just a forecasting methodology; it provides a bridge that enables current data collection techniques to be used within the context of the accumulated information. This will eventually help all the participants in the construction industry to build up the knowledge derived from invaluable experience.

• Journal of the Korea Fashion and Costume Design Association
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• v.13 no.4
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• pp.153-165
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• 2011

The purpose of this study is to take into consideration the package products of wedding miniature dress. The method of the research was mainly focused on precedent research data and general references. Furthermore the data on wedding dresses was mainly collected from internet sites. Ai; reflection customer's demands, more personal and distinctive design was planned reflecting trend in the sector of wedding dress. The results of the research is the following. First, the first consideration for designing product in wedding miniature was designed with the focus on what consumers are easy to make and on brilliance when having made. 8 pairs for barbie miniature and 2 pairs for ball joints were designed. Among these things, it designed colorfully with 6 pairs for wedding dress and 4 pairs for shooting, which are used in the right size. Second, as a result of seeing consumers' response by up-loading totally 10 pieces of miniature clothes on wedding miniature. com site, and were the most popular products. The aim is to suggest package product based on these two works. The design-based pattern, the fabric of being used, lace material, beads, and several trimmings are offered to 2 wedding miniature package products. Consumers can make own collection with a handicraft-based feeling by using this.