• Journal of information and communication convergence engineering
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• 제1권2호
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• pp.67-69
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• 2003

The experimental studies for the etch properties of the oxide grown on silicon substrate, which is in diluted hydrogen fluoride (HF) solution, are presented. Using different ion implantation dosages, dopants and energies, silicon substrate was implanted. The wet etching in diluted HF solution is used as a mean of wafer cleaning at various steps of VLSI processing. It is shown that the wet etch rate of oxide grown on various implanted silicon substrates is a strong function of ion implantation dopants, dosages and energies. This phenomenon has never been reported before. This paper shows that the difference of wet etch rate of oxide by ion implantation conditions is attributed to the kinds and volumes of dopants which was diffused out into $SiO_2$ from implanted silicon during thermal oxidation.

• 한국정밀공학회지
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• 제23권8호
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• pp.47-53
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• 2006

The purpose of this study was to investigate the significant characteristics in spray of industrial etch-nozzle for the design of process. The experiment was carried out with different spray pressure and industrial nozzle in wet etch. The characteristics of liquid spray, such as axial velocity and sauter mean diameter measurements were obtained by PDA. And impact force was calculated from spray characteristics. It was found that the fluid with higher spray pressure resulted in the smaller SMD and the higher droplet velocity and impact force. The depth of etch was increased in case of high spray pressure. In the case of injection angle oscillated between $20^{\circ}$, the result indicated constant effect of etch. The correlation between the spray characteristics and etch ones were analyzed. The depth of etch had good positive correlation with axial velocity and impact force. The result clearly shows that the characteristics in wet etch are strongly related to the spray characteristics with process.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.1408-1411
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• 2009

This paper describes organic acid-based wet chemical etching behaviors of amorphous Ga-doped zinc oxide (GZO) thin film sputter-deposited at low temperature (room temperature). Wet etch parameters such as etching time, temperature, and etchant concentration are investigated for formic and citric acid etchants, and their effects on the etch rate, etch residue and the feature of edge line are compared.

• 한국전기전자재료학회논문지
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• 제24권9호
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• pp.687-692
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• 2011

Hafnium oxide ($HfO_2$) was very advantageous for substitute material of gate on existing transistor. $HfO_2$ has been widely studied due to high contact with polysilicon and thermal stability and also, it is easily etched by using HF solution. In this study, $HfO_2$ and thermal oxide films were etched by wet etch method using chemical etchant. Etch rate of $HfO_2$ and thermal oxide was linearly increased with increasing concentration of HF and temperature but etch rate of $HfO_2$ was higher than thermal oxide due to $H^+$, $F^-$, and $HF_2^-$ ions at below 0.5% concentration of HF. And also, etch selectivity was improved by adding Hydrazine as additive.

• Restorative Dentistry and Endodontics
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• 제40권1호
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• pp.68-74
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• 2015

Objectives: This study examined the effects of additional acid etching on the dentin bond strength of one-step self-etch adhesives with different compositions and pH. The effect of ethanol wetting on etched dentin bond strength of self-etch adhesives was also evaluated. Materials and Methods: Forty-two human permanent molars were classified into 21 groups according to the adhesive types (Clearfil SE Bond [SE, control]; G-aenial Bond [GB]; Xeno V [XV]; Beauti Bond [BB]; Adper Easy Bond [AE]; Single Bond Universal [SU]; All Bond Universal [AU]), and the dentin conditioning methods. Composite resins were placed on the dentin surfaces, and the teeth were sectioned. The microtensile bond strength was measured, and the failure mode of the fractured specimens was examined. The data were analyzed statistically using two-way ANOVA and Duncan's post hoc test. Results: In GB, XV and SE ($pH{\leq}2$), the bond strength was decreased significantly when the dentin was etched (p < 0.05). In BB, AE and SU (pH 2.4 - 2.7), additional etching did not affect the bond strength (p > 0.05). In AU (pH = 3.2), additional etching increased the bond strength significantly (p < 0.05). When adhesives were applied to the acid etched dentin with ethanol-wet bonding, the bond strength was significantly higher than that of the no ethanol-wet bonding groups, and the incidence of cohesive failure was increased. Conclusions: The effect of additional acid etching on the dentin bond strength was influenced by the pH of one-step self-etch adhesives. Ethanol wetting on etched dentin could create a stronger bonding performance of one-step self-etch adhesives for acid etched dentin.

• 한국결정성장학회지
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• 제22권6호
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• pp.261-264
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• 2012

본 연구에서는 HVPE법으로 사파이어 기판(0001) 위에 성장시킨 GaN epilayer의 etching에 따른 표면변화 특성을 조사하였다. 주사전자 현미경(SEM) 관찰 결과, 3가지 형태를 갖는 육각형 모양의 etch pit(edge, screw, mixed) 들이 GaN epilayer의 두께 변화에 따라서 형성되었다. 이러한 관통전위들은(TDs) epilayer의 두께가 얇고, etch pit density가 높을수록 screw and mixed type TDs이 많이 관찰되었고, 두께가 증가할수록 etch pit density가 낮아지면서 edge and mixed type TDs들이 주로 존재하는 것을 관찰 할 수 있었다.

• 전자공학회논문지A
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• 제28A권11호
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• pp.902-909
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• 1991

A reproducible selective dry etch process of GaAs/AlGaAs Heterostructures for High Electron Mobility Transistor(HEMT) Device fabrication is developed. Using RIE mode with $CCl_{2}F_{2}$ as the basic process gas, the observed etch selectivity of GaAs layer with respect to GaAs/$Al_{0.3}Ga_{0.7}$As is about 610:1. Severe polymer deposition problem, parialy generated from the use of $CCl_{2}F_{2}$ gas only, has been significantly reduced by adding a small amount of He gas or by $O_{2}$ plasma ashing after etch process. In order to obtain an optimized etch process for HEMT device fabrication, we com pared the properties of the wet etched Schottky contact with those of the dry etched one, and set dry etch condition to approach the characteristics of Schottky diode on wet etched surface. By applying the optimized etch process, the fabricated HEMT devices have the maximum transconductance $g_{mext}$ of 224 mS/mm, and have relatively uniform distribution across the 2inch wafer in the value of 200$\pm$20mS/mm.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1998년도 제14회 학술발표회 논문개요집
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• pp.105-106
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• 1998

Evaluation of def3ects by etch-ppit formation was studied. A NaOH(30 mol%) etchant was found useful for etch-ppit developpment on ZnSe-based eppilayers grown on (001) gaAs. And a H3ppO4(85 mol%) was used in order to developp etch-ppits on GaN-base eppilayers grown on (0001) Al2O3 After etch-ppit formation on the surfsce. Transmission Electron Microscoppy(TEM) was cppmdicted. By etch-ppit developpment and TEM observation we could determine the defect typpes by etch-ppit configurfations and found origin of etch-ppit in the cse of ZnSe-based materials. Based uppon these results we can do defect identification by etch-ppit test simpply. In the case of GaN-based materials we could evaluate nanoppippe density. however high density of threading dislocations in GaN eppilayers were not revealed by etch-ppit developpment. Based uppon these results we can evaluate the nanoppippe density which difficult to evaluate using TEM beacause of its small size(diameter). And at ppresent status direct matching of etch-ppit density to dislocation density would make severe mistake.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.363-363
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• 2010

After oxide wet etch with BOE(Buffered Oxide Etchant), triangle type defect maps were inspected and SEM image showed them unetch of oxide layer. As decreasing design rule, oxide unetch has become a crucial issue and has affected the yield and quality.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2004년도 춘계학술대회 논문집
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• pp.245-249
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• 2004

Transparent materials such as fused silica are important materials in optical and optoelectronics field because of its outstanding properties, such as transparency in a wide wavelength range, strong damage resistance for laser irradiation, and high thermal and chemical stability. However, these properties make it difficult to micromachine silica in micro-sized quantities. In this study, we fabricated a micro patterns on the surface of fused silica plate using laser induced wet etching. KrF excimer laser was used as a light source. There were no burrs and micro cracks on the etched surface of fused silica and the flatness of the etched surface was fairly good. We investigated the influence of etchant upon the etch rate and quality in laser induced wet etching. Pyrene-acetone, toluene, and pyrene-toluene solution were used as etchant. In the side of etch rate, toluene and pyrene-toluene solution were better than pyrene-acetone solution.