• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
• /
• pp.431-431
• /
• 2013

Flexible Organic Light Emitting Diode (OLED) displays are required for future devices. It is possible that plastic substrates are instead of glass substrates. But the plastic substrates are permeable to moisture and oxygen. This weak point can cause the degradation of fabricated flexible devices; therefore, encapsulation process for flexible substrate is needed to protect organic devices from moisture and oxygen. Y.G. Lee et al.(2009) [1] reported organic and inorganic multilayer structure as an encapsulation barrier for enhanced reliability and life-time.Flowable Oxide process is a low-temperature process which shows the excellent gap-fill characteristics and high deposition rate. Besides, planarization is expected by covering dust smoothly on the substrate surface. So, in this research, Bi-layer structured is used for encapsulation: Flowable Oxide Thin film by PECVD process and Al2O3 thin film by ALD process. The samples were analyzed by water vapor transmission rate (WVTR) using the Calcium test and film cross section images were obtained by FE-SEM.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2010년도 제39회 하계학술대회 초록집
• /
• pp.160-160
• /
• 2010

Organic electronic devices require a passivation layer to ensure sufficient lifetime. Specifically, flexible organic electronic devices need a barrier layer that transmits less than $10^{-6}\;g/m^2/day$ of water and $10^{-5}\;g/m^2/day$ of oxygen. To increase the lifetime of organic electronic device, therefore, it is indispensable to protect the organic materials from water and oxygen. Severe groups have reported on multi-layerd barriers consisting inorganic thin films deposited by plasma enhenced chemical deposition (PECVD) or sputtering. However, it is difficult to control the formation of granular-type morphology and microscopic pinholes in PECVD and sputtering. On the contrary, atomic layer deoposition (ALD) is free of pinhole, highly uniform, conformal films and show good step coverage. In this study, the passivation layer was deposited using single-process PEALD. The passivation layer, in our case, was a bilayer system consisting of $Al_2O_3$ films and a $TiO_2$ buffer layer on a poly (ether sulfon) (PES) substrate. Because the deposition temperature and plasma power have a significant effect on the properties of the passivation layer, the characteristics of the $Al_2O_3$ films were investigated in terms of density under different deposition temperatures and plasma powers. The effect of the $TiO_2$ buffer layer also was also addressed. In addition, the water vapor transmission rate (WVTR) and organic light-emitting diode (OLEDs) lifetime were measured after forming a bilayer composed of $Al_2O_3/TiO_2$ on a PES substrate.

• 한국식품과학회지
• /
• 제31권1호
• /
• pp.99-105
• /
• 1999

Methylcellulose (MC), hydroxypropylmethylcellulose-15 (HPMC-15)와 hydroxypropyl-methylcellulose-50 (HPMC-50)필름과 이에 칼슘을 첨가한 식용필름을 제조하여 이화학적 특성을 비교 연구하였다. 제조된 필름은 모두 $2.38{\sim}3.55$의 운도를 나타내며, 백색의 투명한 필름을 형성하였다. 인장강도는 MC필름이 HPMC필름보다 높았으며, 칼슘의 첨가에 의하여 증가하였고, 신장율은 HPMC-15와 이에 칼슘을 첨가한 필름군만 유의적으로 낮았다. 용해도는 HPMC의 점도의 증가에 따라 감소하였으며, MC필름과 HPMC-15필름 사이에는 유의적인 차이를 나타내지 않았고 칼슘의 첨가에 의하여 영향을 나타내지 않았다. 칼슘첨가에 의하여 투습도는 유의적인 차이를 나타내지 않았으며, MC필름이 HPMC-50 필름보다 낮았고, HPMC필름은 점도의 증가에 따라 증가하였다. 가스투과도는 MC필름이 HPMC필름보다 적었으며, 칼슘 첨가로 이산화탄소와 산소의 투과계수의 비가 낮게 측정되었다. 주사현미경으로 표면형상을 관찰한 결과 칼슘을 첨가한 MC필름이 더욱 균일한 표면형상을 나타냄을 알 수 있었다. 이상의 결과로서 HPMC와 MC필름은 Ca을 첨가함으로서 제조방법의 차이는 없었으나 인장강도가 증가하고 균일한 표면형상을 나타내어 HPMC와 MC필름 보다 내구성이 있는 필름을 제조할 수 있었다.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
• /
• pp.162-162
• /
• 2016

We present multifunctional indium tin oxide (ITO) thin films formed at room temperature by a normal sputtering system equipped with a plasma limiter which effectively blocks the bombardment of energetic negative oxygen ions (NOIs). The ITO thin film possesses not only low resistivity but also high gas diffusion barrier properties even though it is deposited on a plastic substrate at room temperature without post annealing. Argon neutrals incident to substrates in the sputtering have an optimal energy window from 20 to 30 eV under the condition of blocking energetic NOIs to form ITO nano-crystalline structure. The effect of blocking energetic NOIs and argon neutrals with optimal energy make the resistivity decrease to $3.61{\times}10-4{\Omega}cm$ and the water vapor transmission rate (WVTR) of 100 nm thick ITO film drop to $3.9{\times}10-3g/(m2day)$ under environmental conditions of 90% relative humidity and 50oC, which corresponds to a value of ~ 10-5 g/(m2day) at room temperature and air conditions. The multifunctional ITO thin films with low resistivity and low gas permeability will be highly valuable for plastic electronics applications.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
• /
• pp.973-976
• /
• 2006

In this paper, the inorganic multi-layer encapsulation of thin film was newly adopted to protect the organic layer from moisture and oxygen. Using the electron beam, Sputter, inorganic multi-layer thin-film encapsulation was deposited onto the Ethylene Terephthalate(PET) and their interface properties between inorganic and organic layer were investigated. In this investigation, the SiON $SiO_2$ and parylene layer showed the most suitable properties. Under these conditions, the water vapor transmission rate (WVTR) for PET can be reduced from level of $0.57g/m^2/day$ (bare substrate) to $1^{\ast}10^{-5}g/m^2/day$ after application of a SiON and $SiO_2$ layer. These results indicate that the $PET/SiO_2/SiON/Parylene$ barrier coatings have high potential for flexible organic light-emitting diode(OLED) applications.

• Transactions on Electrical and Electronic Materials
• /
• 제8권1호
• /
• pp.36-40
• /
• 2007

Inorganic layers, such as SiOxNy and SiOx deposited using plasma sublimation method, were tested as passivation layer for organic thin-film-transistors (OTFTs). OTFTs with bottom-gate and bottom-contact structure were fabricated using pentacene as organic semiconductor and an organic gate insulator. SiOxNy layer gave little change in characteristics of OTFTs, but SiOx layer degraded the performance of OTFTs severely. Inferior barrier properties related to its lower film density, higher water vapor transmission rate (WVTR) and damage due to process environment of oxygen of SiOx film could explain these results. Polyurea and polyvinyl acetates (PVA) were tested as organic passivation layers also. PVA showed good properties as a buffer layer to reduce the damage come from the vacuum deposition process of upper passivation layers. From these results, a multilayer structure with upper SiOxNy film and lower PVA film is expected to be a superior passivation layer for OTFTs.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 2006년도 제37회 하계학술대회 논문집 C
• /
• pp.1412-1413
• /
• 2006

In this research, an organic thin 13 passivation layer was newly adopted to prefect the organic layer from ambient moisture and oxygen. As the organic thin film passivation layer, poly methyl methacrylate thin films (ppMMA) were deposited using a plasma polymerization technique. In order to their passivation performance for OLEDs, water vapor transmission rate (WVTR) of the ppMMAs were analyzed and luminance-current-voltage (L-I-V)/luminance-time (L-T) characteristics of the OLEDs with and without ppMMA passivation layer were investigated. The OLEDs had a structure of ITO/TPD (HTL)/Alq3(EML&ETL)/Al. The OLED with ppMMA passivation layer showed improved L-T performance than that of without ppMMA passivation layer.

• 마이크로전자및패키징학회지
• /
• 제24권4호
• /
• pp.79-84
• /
• 2017

태양전지와 같은 광전소자의 특성 및 신뢰성 유지하기 위해서는 수분과 산소 등으로 부터 소자 내부가 보호되어야 한다. 본 연구는 여러 연성(flexible) 플라스틱 기판위에 유 무기 복합 보호막을 스프레이코팅 방법으로 형성하여 공정조건(노즐 위치, 박막 두께, 기판 구성)에 따른 소자의 보호특성을 연구하였다. 사용된 복합 보호막 재료로서 PVA (polyvinyl alcohol)와 SA(sodium alginate) 혼합 유기 물질(P.S)에 $Al_2O_3$($P.S+Al_2O_3$)과 $SiO_2$($P.S+SiO_2$) 나노 분말을 혼합하여 유 무기 복합 보호막 용액을 합성하였다. 플라스틱 기판 위에 코팅한 보호막의 두께가 $5{\mu}m$에서 91%의 투과율을 나타내었으며 $78{\mu}m$에서 $178{\mu}m$로 두께가 증가할 경우 광 투과율은 81.6%에서 73.6%으로 감소하였다. 또한 합성한 $P.S+Al_2O_3$ 복합재료를 사용하여 PEN(polyethylene naphthalate), PC(polycarbonate) 단일 플라스틱 기판과 Acrylate film과 PC 이중막(Acrylate film/PC double layer) 구조와 $Al_2O_3$ 무기박막과 PEN 이중막($Al_2O_3$ film/PEN double layer) 구조의 기판 위에 $P.S+Al_2O_3$ 용액을 사용하여 수분투과도(water vapor transmission rate, WVTR)와 표면형상 등을 측정하여 최적의 보호막 구조를 확인하였다. 즉, $Al_2O_3$ film/PEN 이중막 기판위에 형성한 보호막의 수분투과 값은 $0.004gm/m^2-day$로 가장 우수한 내 투습 특성을 나타내었다.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
• /
• pp.100-101
• /
• 2012

The plasma damage free and room temperature processedthin film deposition technology is essential for realization of various next generation organic microelectronic devices such as flexible AMOLED display, flexible OLED lighting, and organic photovoltaic cells because characteristics of fragile organic materials in the plasma process and low glass transition temperatures (Tg) of polymer substrate. In case of directly deposition of metal oxide thin films (including transparent conductive oxide (TCO) and amorphous oxide semiconductor (AOS)) on the organic layers, plasma damages against to the organic materials is fatal. This damage is believed to be originated mainly from high energy energetic particles during the sputtering process such as negative oxygen ions, reflected neutrals by reflection of plasma background gas at the target surface, sputtered atoms, bulk plasma ions, and secondary electrons. To solve this problem, we developed the NBAS (Neutral Beam Assisted Sputtering) process as a plasma damage free and room temperature processed sputtering technology. As a result, electro-optical properties of NBAS processed ITO thin film showed resistivity of $4.0{\times}10^{-4}{\Omega}{\cdot}m$ and high transmittance (>90% at 550 nm) with nano- crystalline structure at room temperature process. Furthermore, in the experiment result of directly deposition of TCO top anode on the inverted structure OLED cell, it is verified that NBAS TCO deposition process does not damages to the underlying organic layers. In case of deposition of transparent conductive oxide (TCO) thin film on the plastic polymer substrate, the room temperature processed sputtering coating of high quality TCO thin film is required. During the sputtering process with higher density plasma, the energetic particles contribute self supplying of activation & crystallization energy without any additional heating and post-annealing and forminga high quality TCO thin film. However, negative oxygen ions which generated from sputteringtarget surface by electron attachment are accelerated to high energy by induced cathode self-bias. Thus the high energy negative oxygen ions can lead to critical physical bombardment damages to forming oxide thin film and this effect does not recover in room temperature process without post thermal annealing. To salve the inherent limitation of plasma sputtering, we have been developed the Magnetic Field Shielded Sputtering (MFSS) process as the high quality oxide thin film deposition process at room temperature. The MFSS process is effectively eliminate or suppress the negative oxygen ions bombardment damage by the plasma limiter which composed permanent magnet array. As a result, electro-optical properties of MFSS processed ITO thin film (resistivity $3.9{\times}10^{-4}{\Omega}{\cdot}cm$, transmittance 95% at 550 nm) have approachedthose of a high temperature DC magnetron sputtering (DMS) ITO thin film were. Also, AOS (a-IGZO) TFTs fabricated by MFSS process without higher temperature post annealing showed very comparable electrical performance with those by DMS process with $400^{\circ}C$ post annealing. They are important to note that the bombardment of a negative oxygen ion which is accelerated by dc self-bias during rf sputtering could degrade the electrical performance of ITO electrodes and a-IGZO TFTs. Finally, we found that reduction of damage from the high energy negative oxygen ions bombardment drives improvement of crystalline structure in the ITO thin film and suppression of the sub-gab states in a-IGZO semiconductor thin film. For realization of organic flexible electronic devices based on plastic substrates, gas barrier coatings are required to prevent the permeation of water and oxygen because organic materials are highly susceptible to water and oxygen. In particular, high efficiency flexible AMOLEDs needs an extremely low water vapor transition rate (WVTR) of $1{\times}10^{-6}gm^{-2}day^{-1}$. The key factor in high quality inorganic gas barrier formation for achieving the very low WVTR required (under ${\sim}10^{-6}gm^{-2}day^{-1}$) is the suppression of nano-sized defect sites and gas diffusion pathways among the grain boundaries. For formation of high quality single inorganic gas barrier layer, we developed high density nano-structured Al2O3 single gas barrier layer usinga NBAS process. The NBAS process can continuously change crystalline structures from an amorphous phase to a nano- crystalline phase with various grain sizes in a single inorganic thin film. As a result, the water vapor transmission rates (WVTR) of the NBAS processed $Al_2O_3$ gas barrier film have improved order of magnitude compared with that of conventional $Al_2O_3$ layers made by the RF magnetron sputteringprocess under the same sputtering conditions; the WVTR of the NBAS processed $Al_2O_3$ gas barrier film was about $5{\times}10^{-6}g/m^2/day$ by just single layer.

• 센서학회지
• /
• 제28권6호
• /
• pp.402-406
• /
• 2019

Recently, semiconducting organic materials have been spotlighted as next-generation electronic materials based on their tunable electrical and optical properties, low-cost process, and flexibility. However, typical organic semiconductor materials are vulnerable to moisture and oxygen. Therefore, an encapsulation layer is essential for application of electronic devices. In this study, SiN_x thin films deposited at process temperatures below 150 ℃ by plasma-enhanced chemical vapor deposition (PECVD) were characterized for application as an encapsulation layer on organic devices. A single structured SiN_x thin film was optimized as an organic light-emitting diode (OLED) encapsulation layer at process temperature of 80 ℃. The optimized SiN_x film exhibited excellent water vapor transmission rate (WVTR) of less than 5 × 10^-5 g/㎡·day and transmittance of over 87.3% on the visible region with thickness of 1 ㎛. Application of the SiN_x thin film on the top-emitting OLED showed that the PECVD process did not degrade the electrical properties of the device, and the OLED with SiN_x exhibited improved operating lifetime