• BMB Reports
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• v.44 no.11
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• pp.747-752
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• 2011

To investigate the effects of disulphide bond position on the salt resistance and lipopolysaccharide (LPS)-neutralizing activity of ${\alpha}$-helical homo-dimeric antimicrobial peptides (AMPs), we synthesized an ${\alpha}$-helical model peptide ($K_6L_4W_1$) and its homo-dimeric peptides (di-$K_6L_4W_1$-N, di-$K_6L_4W_1$-M, and di-$K_6L_4W_1$-C) with a disulphide bond at the N-terminus, the central position, and the C-terminus of the molecules, respectively. Unlike $K_6L_4W_1$ and di-$K_6L_4W_1$-M, the antimicrobial activity of di-$K_6L_4W_1$-N and di-$K_6L_4W_1$-C was unaffected by 150 mM NaCl. Both di-$K_6L_4W_1$-N and di-$K_6L_4W_1$-C caused much greater inhibitory effects on nitric oxide (NO) release in LPS-induced mouse macrophage RAW 264.7 cells, compared to di-$K_6L_4W_1$-M. Taken together, our results indicate that the presence of a disulphide bond at the N- or C-terminus of the molecule, rather than at the central position, is more effective when designing salt-resistant ${\alpha}$-helical homo-dimeric AMPs with potent antimicrobial and LPS-neutralizing activities.

• East Asian mathematical journal
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• v.36 no.3
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• pp.425-435
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• 2020

We explore the Pauli table C^(-1) and nonzero Pauli table W. Recurrence rules and interrelationships of any k slope diagonal sums over C^(-1) and W are studied in connection with diagonal sums of the Pascal table C⁽¹⁾. Since diagonal sums of C⁽¹⁾ are Fibonacci numbers, any k slope diagonal sums over C^(-1) and W are explained by Fibonacci numbers.

• Journal of the Korean Graphic Arts Communication Society
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• v.14 no.2
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• pp.65-80
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• 1996

Ink trap is one of the important factors to determine the color in multi-color overprints. This study was carried out for the purpose for analyzing the relationships between ink traps and color differences in two-color solid overprints. The specimens were printed under four different conditions that the overprinting ink sequence of M(Magenta) or C(Cyan) and the overprinting method of W(Wet-on-Wet) or D(Wet-on-Dry) were changed altermately, that is M+C-W or C+M-W and M+C-D or C+M-D.

• Bulletin of the Korean Mathematical Society
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• v.47 no.1
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• pp.195-209
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• 2010

In this paper, we prove the generalized Hyers-Ulam stability of bi-homomorphisms in $C^*$-ternary algebras and of bi-derivations on $C^*$-ternary algebras for the following bi-additive functional equation f(x + y, z - w) + f(x - y, z + w) = 2f(x, z) - 2f(y, w). This is applied to investigate bi-isomorphisms between $C^*$-ternary algebras.

• Korean Journal of Food Science and Technology
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• v.20 no.6
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• pp.820-826
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• 1988

The freezing point$(t_f)$, latent heat of freezing$({\triangle}\;H_f)$ and kinetic constant of fleering$(k_f)$ were determined from DSC thermogram at cooling rate $-2.5^{\circ}C/min{\sim}-10.0^{\circ}C/min$. The freezing point of various starches was decreased with an increase in cooling rate, and that of whole starches were lower than defatted starches. Changes of the latent heat of freezing was not observed at above cooling rate $-2.5^{\circ}C/min$. The latent heat of freezing$({\triangle}\;H_f)$ could be deduced as a function of water content(W) as follows: ${\triangle}\;H_f=0.700W-13.048$, (Kcal/kg) $(35%{\leqq}W{\leqq}70%)\;{\triangle}\;H_f=1.569W-73.861,\;(Kcal/kg)\;(W{\geqq}70%$) In the water content range $35{\sim}90$(wt %), the activation energy of various starches in freezing process was determined $126{\sim}270$ Kcal/mol.

• Journal of the Korean Society for Heat Treatment
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• v.16 no.4
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• pp.197-204
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• 2003

Honeycomb structure has been fabricated by brazing method using 0.1 wt%C and 1.0wt%C carbon steel core and STS304 stainless steel face sheet. Core shear strength ratio in W and L directions was 1:1.03 in 7 mm cell size, whereas 1:1.45 in 4 mm cell size. Flexural strength on face sheet was 166.4 MPa (0.1 wt%C, W direction), 171.1 MPa (0.1 wt%C, L direction), and 120.2 MPa (1.0 wt%C, W direction) in 7 mm cell size. And in 4mm cell size specimen, it was 169.2 MPa (0.1 wt%C, W direction), 224.2 MPa (0.1 wt%C, L direction). This means that flexural strength of 0.1 wt%C core material was higher than that of 1.0wt%C core material, which was contrary to expectation. SEM and EDS analysis represented that grain boundary diffusion had occurred in0.1 wt%C core, but no grain boundary diffusion in 1.0 wt%C core. And corrugated surface of 0.1 wt%C core was flat, whereas that of 1.0 wt%C core was not flat. As a result, contact area between two 1.0 wt%C cores was much less than that of 0.1 wt% cores, It is thought to be main reason for lower flexural strength of 1.0 wt%C core.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.156-157
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• 2008

반도체 소자 회로의 집적도가 높아짐에 따라 선폭이 감소하였고 고온 공정이 필요하게 되었다. 기존의 반도체 회로 배선 재료인 Al을 사용할 경우 소자의 속도가 느려져서 소자의 신뢰도가 떨어지고 고온공정에서의 문제가 발생되어 이를 해결하기 위한 차세대 배선 물질로 비저항이 낮은 Cu의 사용이 요구되고 있다. 하지만 Cu는 Si와의 확산이 잘 일어나기 때문에 그 사이에서 확산을 막아주는 확산방지막에 대한 필요성이 제기되었고 연구가 활발히 진행되고 있다. 본 논문에서는 Cu와 Si사이의 확산을 방지하기 위한 W-C-N 확산방지막을 물리적 기상 증착법(PVD)중 하나인 RF Magnetron Sputtering 방식을 사용하여 증착하였다. 고온 공정에서의 안정성을 알아보기 위해 $600^{\circ}C$ 부터 $900^{\circ}C$ 까지 $100^{\circ}C$ 단위로 열처리를 하였고 4-point probe 장치를 사용하여 열처리 온도에 따른 비저항 측정을 통해 W-C-N 확산방지막의 특성을 분석하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.1079-1082
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• 2004

CuPc와 ZnPc를 이용하여 이종 접합 구조에서의 광기전 특성을 연구하였다. $CuPc/C_{60}$, $XnPc/C_{60}$의 이종 접합 구조에서 $C_{60}$의 접합 두께 비율을 1:1 (20nm:20nm), 1:2 (20nm:40nm), 1:3 (20nm:60nm)로 가변하여 두께와 물질에 따른 광기전 특성 및 엑시톤 억제층의 효과를 분석하였다. 광원은 500W Xe lamp를 이용하였으며, 광원의 세기는 보정된 radiometer/photometer와 Si-photodiode로 dark, 10, 25, 60, 80 그리고 100mW/$cm^2$로 주사하였다.

• Tribology and Lubricants
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• v.15 no.1
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• pp.77-82
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• 1999

The processing conditions fur the synthesis of platelet W $S_2$ lubricant powder through a solid-gas reaction were optimized. The mixture of tungsten and sulfur powders were sealed in a vacuum of 10$^{-6}$ torr, prior to heat-treating at 85$0^{\circ}C$ fur 8 days. The reaction product showed a well-developed platelet W $S_2$ powder with an average size of 3.8 ${\mu}{\textrm}{m}$. The TGA/DTA analysis of the synthesized W $S_2$ powder was performed up to 120$0^{\circ}C$ at a rate of 1$0^{\circ}C$/min in flowing air (100 ${\mu}{\textrm}{m}$/min) atmosphere. The weight loss was about 6% up to 120$0^{\circ}C$ compared to the original weight. A rapid weight loss of about 5% occurred in the temperature range of 44$0^{\circ}C$ to 66$0^{\circ}C$ and an exothermic peak observed due to the transition of W $S_2$ to W $O_3$. The synthesized W $S_2$powder was coated on the commercial deep grooved ball bearing (No. 6203) to examine the effect of W $S_2$, coating layer on the noise and endurance of the ball bearing. The level of noise obtained from W $S_2$, coated-ball bearing (56 ㏈) was higher. than the value (32 ㏈) occurred in the case of greece lubrication. The endurance of the ball-bearing assembled after the coating of W $S_2$ powder onto each part increased 50 times compared to the non-coated ball-bearing..

• Korean Journal of Materials Research
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• v.5 no.6
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• pp.627-632
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• 1995

W-Cu composites utilize the high electrical conductivity of copper and arc erosion resistance of tungsten to provide properties better suited to electrical contact applications than either tungsten or copper alone. W-Cu composite materials were milled in an attritor with an impeller speed of 300rpm for various milling times. The milled powders were compacted at 300MPa into cylinders, 16m in diameter, and approximately 4m high. Sintering was performed in dry H$_2$at temperature ranging from 1200$^{\circ}C$ to 1400$^{\circ}C$. Samples were sectioned and were polished for scanning electron microscopy (SEM) of microstructures. Homogeneous W-Cu composites were formed after 10 hours mechanical alloying and could be attained 99% density at 1330$^{\circ}C$. As mechanical alloying time increased, Fe-concentration was increased linearly. Intermetallic compound formation interupted the growth of W particles Increased hardness.