• Title/Summary/Keyword: von-mises

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Analysis of Stress Contour Plot of Implant Depending on Masticatory Force, Length, and Diameter (저작압, 직경, 길이 변화에 따른 임플란트 응력 분포 분석)

  • Nam, Young Jun;Yoon, Seung Hyun
    • Proceeding of EDISON Challenge
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    • 2016.03a
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    • pp.240-245
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    • 2016
  • In this paper, stress contour plots depending on length, load, and diameter of the implant are presented. Depending on the condition and amount of cortical bone, process of implanting can be difficult and stress becomes important. Therefore deciding the right length and diameter of implant is critical. When analyzing stress in the implant, Von-mises yield criterion is often used; however, due to hardship of acquiring the actual material property of surrounding bones, simplified model of a implant was adapted in finite element analysis program of EDISON. The result acquired from EDISON program was then compared with results of different research papers.

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An Experimental Study on the Fatigue Behavior and Stress Interaction of Arbitrarily Located Defects (II) (For Variable Loads and Distances between Defects) (불규칙하게 분포된 미소결함사이의 응력간섭 및 피로균열 거동에 대한 실험적 연구 (II) (결함간의 거리 및 하중변화를 중심으로))

  • Song, Sam-Hong;Bae, Jun-Su;Choe, Byeong-Ho
    • Journal of the Korean Society for Precision Engineering
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    • v.18 no.1
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    • pp.201-212
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    • 2001
  • If defects are located far apart, fatigue cracks are independently initiated from them and gradually approach other cracks so that the fatigue life becomes influenced by the crack growth behavior of those interacting cracks. In this study, the effect of the stress interaction between defects on the fatigue crack propagation behavior is investigated experimentally and these results are verified by finite element method. In addition, fatigue crack propagation behaviors under micro hole interaction field are studied.

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Stress Analysis in Cooling Process for Thermal Nanoimprint Lithography with Imprinting Temperature and Residual Layer Thickness of Polymer Resist

  • Kim, Nam Woong;Kim, Kug Weon
    • Journal of the Semiconductor & Display Technology
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    • v.16 no.4
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    • pp.68-74
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    • 2017
  • Nanoimprint lithography (NIL) is a next generation technology for fabrication of micrometer and nanometer scale patterns. There have been considerable attentions on NIL due to its potential abilities that enable cost-effective and high-throughput nanofabrication to the display device and semiconductor industry. Up to now there have been a lot of researches on thermal NIL, but most of them have been focused on polymer deformation in the molding process and there are very few studies on the cooling and demolding process. In this paper a cooling process of the polymer resist in thermal NIL is analyzed with finite element method. The modeling of cooling process for mold, polymer resist and substrate is developed. And the cooling process is numerically investigated with the effects of imprinting temperature and residual layer thickness of polymer resist on stress distribution of the polymer resist. The results show that the lower imprinting temperature, the higher the maximum von Mises stress and that the thicker the residual layer, the greater maximum von Mises stress.

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The exponential generalized log-logistic model: Bagdonavičius-Nikulin test for validation and non-Bayesian estimation methods

  • Ibrahim, Mohamed;Aidi, Khaoula;Alid, Mir Masoom;Yousof, Haitham M.
    • Communications for Statistical Applications and Methods
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    • v.29 no.1
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    • pp.1-25
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    • 2022
  • A modified Bagdonavičius-Nikulin chi-square goodness-of-fit is defined and studied. The lymphoma data is analyzed using the modified goodness-of-fit test statistic. Different non-Bayesian estimation methods under complete samples schemes are considered, discussed and compared such as the maximum likelihood least square estimation method, the Cramer-von Mises estimation method, the weighted least square estimation method, the left tail-Anderson Darling estimation method and the right tail Anderson Darling estimation method. Numerical simulation studies are performed for comparing these estimation methods. The potentiality of the new model is illustrated using three real data sets and compared with many other well-known generalizations.

The behavior of adhesive joints affected by the geometry and stacking sequence of composite materials

  • Ait Kaci Djafar;Zagane Mohammed El Sallah;Moulgada Abdelmadjid;Sahli Abderahmane
    • Structural Engineering and Mechanics
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    • v.88 no.6
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    • pp.609-623
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    • 2023
  • The objective of this study is to investigate the distribution of von Mises stress, peeling stress, and shear stress in the adhesive layer used to bond two composite panels, considering various parameters using a three-dimensional finite element method. The stiffness of the materials and the effect of the stacking order on the amount of load transferred to the adhesive layer were examined to determine which type of laminate generates less stress at the bond line. The study analyzed six different stacking sequences, all with a common first layer in contact with the adhesive and a 0° orientation. Additionally, the impact of using hybrid composites on reducing bond line stress was investigated.

STRESS ANALYSIS OF A HUMAN MANDIBLE UNDER VARIOUS LOADS USING FINITE ELEMENT METHOD (하악골의 부위별 충격시 발생되는 응력에 대한 유한 요소법적 연구)

  • Kim Sung-Rae;Park Tae-Won
    • Journal of Korean Academy of Oral and Maxillofacial Radiology
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    • v.22 no.1
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    • pp.7-22
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    • 1992
  • The stress distributions on a human mandible for 18 load cases under two different boundary conditions (mouth open and closed), using the three dimensional finite element modeling were studied. Also, the expected fracture loads for each load cases were calculated by using the Von-Mises yield criterion. The model of a mandible with all teeth was composed of 2402 hexahedron elements and 3698 nodes. CAD techniques were used to analyze the 3-dimensional results. The conclusions of this study were as follows: 1. In the mouth open state, the maximum stress occured at the condyle neck; when the lateral load was exerted, the maximum stress occured at the load side condyle. 2. In the mouth closed state, when the loads were exerted on the mandibular body and chin, the maximum stress occured at the loaded area, and when the loads were exerted on the angle and ramus, the maximum stress occured at the condyle neck. 3. The expected fracture loads in each load case were calculated using the Von-Mises yield criterion, and it was confirmed that the mandible in the mouth open state was more easily fractured than that in the mouth closed state, and the expected fracture loads are lesser in the cases that load direction is parallel at mandibular plane than 45°. 4. The magnitudes of the expected fracture loads increased in the order of angle, ramus, body and chin in case of the mouth closed state, while chin, body, angle and ramus in case of the mouth open state. 5. The Von-Mises stress concentration regions analyzed by F.E.M. corresponded well with the results of clinical studies.

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Study on Behavior Characteristics of Embedded PCB for FCCSP Using Numerical Analysis (수치해석을 이용한 FCCSP용 Embedded PCB의 Cavity 구조에 따른 거동특성 연구)

  • Cho, Seunghyun;Lee, Sangsoo
    • Journal of the Microelectronics and Packaging Society
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    • v.27 no.1
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    • pp.67-73
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    • 2020
  • In this paper, we used FEM technique to perform warpage and von Mises stress analysis on PCB according to the cavity structures of embedded PCB for FCCSP and the types of prepreg material. One-half substrate model and static analysis are applied to the FEM. According to the analysis results of the warpage, as the gap between the cavity and the chip increased, warpage increased and warpage increased when prepreg material with higher modularity and thermal expansion coefficient was applied. The analysis results of the von Mises stress show that the effect of the gap between the cavity and the chip varies depending on prepreg material. In other words, when material whose coefficient of thermal expansion is significantly higher than that of core material, the stress increased as the gap between the cavity and the chip increased. When the prepreg with the coefficient of thermal expansion lower than the core material is applied, the result of stress is opposite. These results indicate that from a reliability perspective, there is a correlation between the structure of the cavity where embedded chips are loaded and prepreg material.

Stress distributions in peri-miniscrew areas from cylindrical and tapered miniscrews inserted at different angles

  • Choi, Sung-Hwan;Kim, Seong-Jin;Lee, Kee-Joon;Sung, Sang-Jin;Chun, Youn-Sic;Hwang, Chung-Ju
    • The korean journal of orthodontics
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    • v.46 no.4
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    • pp.189-198
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    • 2016
  • Objective: The purpose of this study was to analyze stress distributions in the roots, periodontal ligaments (PDLs), and bones around cylindrical and tapered miniscrews inserted at different angles using a finite element analysis. Methods: We created a three-dimensional (3D) maxilla model of a dentition with extracted first premolars and used 2 types of miniscrews (tapered and cylindrical) with 1.45-mm diameters and 8-mm lengths. The miniscrews were inserted at $30^{\circ}$, $60^{\circ}$, and $90^{\circ}$ angles with respect to the bone surface. A simulated horizontal orthodontic force of 2 N was applied to the miniscrew heads. Then, the stress distributions, magnitudes during miniscrew placement, and force applications were analyzed with a 3D finite element analysis. Results: Stresses were primarily absorbed by cortical bone. Moreover, very little stress was transmitted to the roots, PDLs, and cancellous bone. During cylindrical miniscrew insertion, the maximum von Mises stress increased as insertion angle decreased. Tapered miniscrews exhibited greater maximum von Mises stress than cylindrical miniscrews. During force application, maximum von Mises stresses increased in both groups as insertion angles decreased. Conclusions: For both cylindrical and tapered miniscrew designs, placement as perpendicular to the bone surface as possible is recommended to reduce stress in the surrounding bone.

Undrained Analysis of Soft Clays Using an Anisotropic Hardening Constitutive Model: I. Constitutive Model (비등방경화 구성모델을 적용한 연약 지반의 비배수 거동 해석: I. 구성모델)

  • 오세붕
    • Journal of the Korean Geotechnical Society
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    • v.15 no.6
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    • pp.121-130
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    • 1999
  • The objective of this study is to perform finite element analyses(FEA) using the anisotropic hardening constitutive model on the basis of the total stress concept. An anisotropic hardening model was then developed to solve the problem and its mathematical formulations and experimental verifications were also described. In a companion paper, the constitutive equation will be formulated for accurate and efficient solutions of FEA, and coded into a nonlinear analysis program, and finally a field problem will be analyzed. The proposed model includes the failure criterion of a von Mises type and the anisotropic hardening rule based on the generalized isotropic hardening description, which can model the nonlinearity and the anisotropy of the stress-strain relationship. As a result this study could verty the experimental results for UU triaxial tests, CU triaxial tests for overconsolidated samples, and anisotropic loading tests with the rotation of principal stress axes for $K_0$consolidated samples.

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Optimization Design of a Gas Valve for a LPG Cylinder Using a Taguchi's Experimental Method (다구찌 실험법을 이용한 액화석유가스 용기용 밸브의 최적설계에 관한 연구)

  • Kim, Chung-Kyun;Oh, Kyoung-Seok
    • Journal of the Korean Institute of Gas
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    • v.10 no.4 s.33
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    • pp.23-28
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    • 2006
  • This paper presents the strength safety and the weight reduction analysis of nine gas valve models for a LPG cylinder using a finite element analysis program, MARC and Taguchi's experimental method. The maximum Von Mises stress of a gas valve body represents a safety of a brass valve structure for the given gas pressure of $91kg/cm^2$, which considered a safety factor of a LPG gas cylinder. The weight reduction analysis is very important for reducing a gas flow friction loss and a manufacturing cost as a design parameter. The calculated results present an design model 9 as an optimized design data with 10mm radius of a lower part gas flow pipe A, 6mm radius of an upper part gas flow pipe B and a connecting length 2 mm of tapered pipe D between lower and upper pipes.

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