• Journal of the Optical Society of Korea
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• v.18 no.5
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• pp.507-516
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• 2014

We present a hybrid method for spectral reflectivity recovery, using 3D extrapolation as a supplemental method for 3D interpolation. The proposed 3D extrapolation is an extended version of 3D interpolation based on the barycentric algorithm. It is faster and more accurate than the conventional spectral-recovery techniques of principal-component analysis and nonnegative matrix transformation. Four different extrapolation techniques (based on nearest neighbors, circumcenters, in-centers, and centroids) are formulated and applied to recover spectral reflectivity. Under the standard conditions of a D65 illuminant and 1964 $10^{\circ}$ observer, all reflectivity data from 1269 Munsell color chips are successfully reconstructed. The superiority of the proposed method is demonstrated using statistical data to compare coefficients of correlation and determination. The proposed hybrid method can be applied for fast and accurate spectral reflectivity recovery in image processing.

• Journal of Multimedia Information System
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• v.6 no.4
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• pp.203-208
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• 2019

Fast operation of a CNN based object detection is important in many application areas. It is an efficient approach to reduce the size of an input image. However, it is difficult to find an area that includes a target object with minimal computation. This paper proposes a ROI detection method that is fast and robust to noise. The proposed method is not affected by a flicker line noise that is a kind of aliasing between camera and LED light. Fast operation is achieved by using down-sampling efficiently. The accuracy of the proposed ROI detection method is 92.5% and the operation time for a frame with a resolution of 640 × 360 is 0.388msec.

• 제어로봇시스템학회:학술대회논문집
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• 2001.10a
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• pp.152.4-152
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• 2001

We investigate, in this paper, the use of FPGA(Field Programmable Gate Array) architectures for real-time processing of digital linescan camera. The use of FPGAS for low-level processing represents an excellent tradeoff between software and special purpose hardware implementations. A library of modules that implement common low-level machine vision operations is presented. These modules are designed with gate-level hardware components that are compiled into the functionality of the FPGA chips. This new synchronous unidirectional interface establishes a protocol for the transfer of image and result data between modules. This reduces the design complexity and allows several different low-level operations to be applied to the same input image ...

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.763-768
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• 2005

Bare-chip packaging becomes more popular along with the miniaturization of IT components. In this paper, we have studied flip-chip process, and developed automated bonding system. Among the several bonding method, NCP bonding is chosen and batch-type equipment is manufactured. The dual optics and vision system aligns the chip with the substrate. The bonding head equipped with temperature and force controllers bonds the chip. The system can be easily modified for other bonding methods such as ACF In bonding process, the bonding forte and temperature are known as the most dominant bonding parameters. A parametric study is performed for these two parameters. For the test sample, we used standard flip-chip test kit which consists of FR4 boards and dummy flip-chips. The bonding test was performed fur two types of flip-chips with different chip size and lead pitch. The bonding temperatures are chosen between $25^{\circ}C\;to\;300^{\circ}C$. The bonding forces are chosen between 5N and 300N. The bonding strength is checked using bonding force tester. After the bonding force test, the samples are examined by microscope to determine the failure mode. The relations between the bonding strength and the bonding parameters are analyzed and compared with bonding models. Finally, the most suitable bonding condition is suggested in terms of temperature and force.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.6
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• pp.708-714
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• 2016

In today's semiconductor industry, manufacturing technology is being developed for the purpose of processing large amounts of data and improving the speed of data processing. The packaging process in semiconductor manufacturing is utilized for the purpose of protecting the chips from the external environment and supplying electric power between the terminals. Nowadays, the WLP (Wafer-Level Packaging) process is mainly used in semiconductor manufacturing because of its high productivity. All of the silicon dies on the wafer are subjected to a high pressure and temperature during the molding process, so that die shift and warpage inevitably occur. This phenomenon deteriorates the positioning accuracy in the subsequent re-distribution layer (RDL) process. In this study, in order to minimize the die shift, a vision inspection system is developed to collect the die shift measurement data.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.10 s.241
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• pp.1416-1429
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• 2005

In order to meet the increasing competitive pressures coupled with higher demands for component quality, whirling machines have been at the cutting edge of the automobile industry for more than 25 years. The hard whirling process can save on machining time and operation elimination. Hard whirling is done dry, without coolant. The chips carry away nearly all of the heat during cutting, leaving the workpiece cool and minimizing any thermal geometry variations. The surface finish and profile accuracy are close to grinding quality. Whirling machines usually consist of four major parts; 1) loading system that requires the necessary axial speeds, 2) head stock that needs high precision clamping and positioning system at the chuck and tailstock, 3) whirling unit that demands the high cutting speeds and cutting power fer cutting deep thread profiles and 4) unloading system that requires an easy workpiece unloading. Also, capabilities of the whirling machine can be improved by attaching a vision system to the machine. Most of whirling machines in Korean automobile industry are imported from the Leistritz company, Germany and the Hasegawa company, Japan. Tn this paper, a basic research will be performed to improve and enhance the existing whirling machines. Finally, a new Korean whirling machine will be proposed and developed.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.14 no.8
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• pp.1737-1744
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• 2010

The Image sensor needs various image processing to improve image quality. ISP(Image Signal Processor) performs various image processing. Conventional vision cameras have own software ISP functions and perform in PC instead of using commercial ISP chips. However these methods have problems such as large computation for image processing. In this paper, we proposed ISP that significantly reduced chip area by efficient sharing of hardware and software. Large operation blocks are designed to hardware for high performances, and we used hardware simultaneously with software considering the size of the hardware. The implemented ISP can process VGA(640*4800) images and has 91450 gate sizes in 0.35um process.

• KIPS Transactions on Software and Data Engineering
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• v.10 no.10
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• pp.385-390
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• 2021

The gantry is a device that moves fine chips from the feeder to the PCB. While the gantry is moving the part, the camera checks the condition of the part. The purpose of this paper is to find the path with the shortest travel time of the gantry and calculate the travel time according to the path. stop_motion is a way to check the status of the parts currently in use. This paper presents the moving_motion method and the fly_motion method with maximum speed in front of the camera. In addition the signature method was used to inspect the condition of the parts. When comparing the moving time of the three types of gantry, the moving_motion method improved by 9.42% and the fly_motion method by 17.73% compared to stop_motion. When the fly_motion method proposed in this paper is used for the gantry movement path, it is expected that productivity will be improved.

• Korean Journal of Optics and Photonics
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• v.29 no.1
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• pp.19-27
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• 2018

A change in object distance would generally change the magnification of an optical system. In this paper, we have proposed and designed a double-Gauss optical system with a fixed magnification and image surface regardless of any change in object distance, according to moving the lens groups a little bit to the front and rear of the stop, independently parallel to the direction of the optical axis. By maintaining a constant size of image formation in spite of various object-distance changes in a projection system such as a head-up display (HUD) or head-mounted display (HMD), we can prevent the field of view from changing while focusing in an HUD or HMD. Also, to check precisely the state of the wiring that connects semiconductor chips and IC circuit boards, we can keep the magnification of the optical system constant, even when the object distance changes due to vertical movement along the optical axis of a testing device. Additionally, if we use this double-Gauss optical system as a vision system in the testing process of lots of electronic boards in a manufacturing system, since we can systematically eliminate additional image processing for visual enhancement of image quality, we can dramatically reduce the testing time for a fast test process. Also, the Gaussian bracket method was used to find the moving distance of each group, to achieve the desired specifications and fix magnification and image surface simultaneously. After the initial design, the optimization of the optical system was performed using the Synopsys optical design software.