• Tribology and Lubricants
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• v.18 no.1
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• pp.42-48
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• 2002

Experiments were conducted to determine the structural dynamic characteristics of bump foil bearing. The housing of the bearing on the journal was driven by two shakers which were used to simulate dynamic forces acting on the bump foil strips. Three different bump foils(Cu-coated bump, silicon bump, viscoelastic bump) are tested and the dynamic coefficients of three bump foils compared, based on the experimental measurements for a wide range of operating conditions. From the test results, the high damping coefficients of viscoelastic bump are achieved and the possibility of the super-bending-critical operation is suggested.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2001.11a
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• pp.282-289
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• 2001

Experiments were conducted to determine the structural dynamic characteristics of bump foil bearing. The housing of the bearing on the journal was driven by two shakers which were used to simulate dynamic forces acting on the bump foil strips. Three different bump foils(Cu-coated bump, silicon bump, viscoelastic bump) are tested and the dynamic coefficients of three bump foils compared, based on the experimental measurements for a wide range of operating conditions. From the test results, the high damping coefficients of viscoelastic bump are achieved and the possibility of the super-bending-critical operation is suggested.

• Journal of Welding and Joining
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• v.21 no.5
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• pp.534-539
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• 2003

An efficient soldering process using the longitudinal ultrasonic vibration is introduced in this work for electronic packaging. The effects of the process parameters such as the ultrasonic frequency, amplitude, dimension of the metal bump and solder are analyzed through a viscoelastic lumped model. The viscoelastic properties of the eutectic solder were measured for calculation and evaluation of heat generation capability of the solder. Experiments were conducted to verify the possibility of the proposed ultrasonic soldering method by inserting the Cu and Au bumps into the solder block. Localized heating due to ultrasonic vibration melts the solder near the metal bump, which demonstrates the applicability of the ultrasonic soldering method to the high-density electronic packaging.

• The KSFM Journal of Fluid Machinery
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• v.5 no.3 s.16
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• pp.7-14
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• 2002

A new foil bearing, ViscoElastic Foil Bearing(VEFB) is suggested with the need for a high damping foil bearing. Sufficient damping capacity is a key technical hurdle to super-bending-critical operation as well as widespread use of foil bearings into turbomachinery. The super-bending-critical operation of the conventional bump foil bearing and the VEFB is examined, as well as the structural dynamic characteristics. The structural dynamic test results show that the equivalent viscous damping of the VEFB is much larger than that of the bump bearing, and that the structural dynamic stiffness of the VEFB is comparable or larger than that of the bump bearing. The results of super-bending-critical operation of the VEFB indicate that the enhanced structural damping of the viscoelastic foil dramatically reduces the vibration near the bending critical speed. With the help of increased damping resulting from the viscoelasticity, the suppression of the asynchronous orbit is possible beyond the bending critical speed.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.43-48
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• 2022

In this study, simulation method was developed to improve the accuracy of the warpage simulation based on the equivalent anisotropic viscoelastic model. First, a package with copper traces and bumps was modeled to implement anisotropic viscoelastic behavior. Then, equivalent anisotropic viscoelastic properties and thermal expansion coefficient for the bump region were derived through the representative volume element model. A thermal cycle of 0 to 125 degrees was applied to the package based on the derived mechanical properties, and the warpage according to the thermal cycle was simulated. To verify the simulation results, the actual package was manufactured, and the warpage with respect to the thermal cycle was measured through shadow moiré interferometer. As a result, by applying the equivalent anisotropic viscoelastic model, it was possible to calculate the warpage of the package within 5 ㎛ error and predict the shape of the warpage.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2004.11a
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• pp.186-194
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• 2004

Experiments were conducted to determine the structural static and dynamic characteristics of air foil bearings. The housing of the bearing on the journal was driven by an impact hammer which was used to simulate dynamic forces acting on the bump loll with various leading condition. Two different bump foils (Cu-coated bump and viscoelastic bump) were tested and the static and dynamic coefficients of two bump foils compared, based on the experimental measurements for a wide range of operating conditions. The static and dynamic characteristics of air foil bearings were extracted 0rpm the frequency response function by least square method and IV(Instrumental Variable) method. The experiment was tested at 0rpm and $10,000\~16,000rpm$, and loaded on $50\~150N$. From the test results, the possibility of the application of high load and high speed condition is suggested.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.2
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• pp.31-43
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• 2019

In this study, polymer elastic bumps were fabricated for the flexible electronic package flip chip bonding and the viscoelastic and viscoplastic behavior of the polymer elastic bumps according to the temperature and load were analyzed using FEM and experiments. The polymer elastic bump is easy to deform by the bonding load, and it is confirmed that the bump height flatness problem is easily compensated and the stress concentration on thin chip is reduced remarkably. We also develop a spiral cap type and spoke cap type polymer elastic bump of $200{\mu}m$ diameter to complement Au metal cap crack phenomenon caused by excessive deformation of polymer elastic bump. The proposed polymer elastic bumps could reduce stress of metal wiring during bump deformation compared to metal cap bump, which is completely covered with metal wiring because the metal wiring on these bumps is partially patterned and easily deformable pattern. The spoke cap bump shows the lowest stress concentration in the metal wiring while maintaining the low contact resistance because the contact area between bump and pad was wider than that of the spiral cap bump.

• Proceedings of the KWS Conference
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• 2003.05a
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• pp.224-227
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• 2003

The longitudinal thermosonic bonding method is investigated in this work for its application to the soldering process for electronic packaging. The effect of the ultrasonic is analyzed through lumped modeling, and the material properties of a viscoelastic model are measured experimentally. The thermosonic bonding method is verified by inserting the Cu pin and Au bump into solder block. As the solder thickness decreases, temperature of the solder is calculated to increase rapidly because of larger strain. Localized heating due to ultrasonic vibration is observed to melt the solder near the pin, which is adequate to the high density electronic package and Pb-free solder having high melting temperature.