• Food Science of Animal Resources
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• v.33 no.2
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• pp.276-280
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• 2013

Obesity, the leading metabolic disease, is a prevalent health problem in industrialized countries and is closely associated with coronary heart disease, hypertension, diabetes, and even cancer. In this study, we investigated the effects of dip-sauce for meat containing Garcinia cambogia extract (GC) on the lipid accumulation and body weight reduction in rats fed high-fat diet for three months. Eighteen Sprague Dawley male rats of five-week-old were randomly assigned to one of three groups; normal chew diet (NCD) group, high-fat diet plus GC-noncontaining dip-sauce (HFD) group, and HFD plus GC-containing dip-sauce (HFD+GC) group. Co-administration of GC-containing dip-sauce (5 g/kg body weight/day) with HFD significantly attenuated cumulative body weight gain, compared with NCD or HFD groups. Both epididymal and perirenal fat pad weights in the HFD plus GC group were significantly lower than those of HFD or NCD groups. Administration of GC-containing dip-sauce also resulted in significant reduction in the serum levels of total cholesterol, total lipid, and triglyceride, compared with NCD or HFD groups. Thus, GC-containing dip-sauce confers beneficial effects to pathological states associated with metabolic disorder via its anti-obesity and lipid lowering properties.

• Journal of the Korea institute for structural maintenance and inspection
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• v.17 no.2
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• pp.1-9
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• 2013

In recent years, numerous mega-size and complex civil infrastructures have been constructed worldwide. For the more precise construction and maintenance process management of these civil infrastructures, the application of a variety of smart sensor-based structural health monitoring (SHM) systems is required. The efficient management of both sensors and collected databases is also very important. Recently, several kinds of database access technologies using Quick Response (QR) code and Augmented Reality (AR) applications have been developed. These technologies provide software tools incorporated with mobile devices, such as smart phone, tablet PC and smart pad systems, so that databases can be accessed very quickly and easily. In this paper, an AR-based structural health monitoring technique is suggested for sensor management and the efficient access of databases collected from sensor networks that are distributed at target structures. The global positioning system (GPS) in mobile devices simultaneously recognizes the user location and sensor location, and calculates the distance between the two locations. In addition, the processed health monitoring results are sent from a main server to the user's mobile device, via the RSS (really simple syndication) feed format. It can be confirmed that the AR-based structural health monitoring technique is very useful for the real-time construction process management of numerous mega-size and complex civil infrastructures.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.11 no.6
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• pp.235-245
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• 2011

EBooks refer to electronic versions of books which are accessible via internet with forms of digital texts. In recent years, Amazon's Kindle digital eBooks has revealed the possibilities of success of the e-book market, which leads other companies to launch eBook service such as Google's eBook stores and Apple's iPad and eBook service. These reveal that the eBook market is finally showing a substantial amount of growth. Although the issue of technical support of eBook copyright protection emerges from the fast growing eBook marketplace, current technic of commercial DRM for protecting eBook copyright protection still has problems of non-comparability. Therefore, with the current technical status, DRM comparability problems, which have already occurred in music DRM environment, would also happen in eBook environment. This study suggests a standard framework to support eBook DRM comparability. When development of the standard reference software for eBook DRM comparability is completed, the sources will be registered as shareware to be open to public.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.6
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• pp.395-399
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• 2017

The LPI fuel filter housings used in automobiles were made from conventional die castings but have recently been developed by cold forging to improve the weight and durability. On the other hand, a sink may develop at the core of the forged product due to the resulting T-shape, which not only reduces the aesthetics, but also increases the post-processing cost of the product. Therefore, this research focused on methods to predict and mitigate sink development and progression during the T-shape forging process. Finite element analysis of the forging process was first performed to determine the optimal initial workpiece devoid of burrs and underfills. An accurate sink prediction was then obtained via metal flow analysis, which was a result of the finite element simulation. Through finite element analysis, it was confirmed that sink development is a product of the differences in nodal velocities arising from the T-shaped forging process. Consequently, a pad was inserted beneath the sink to minimize these velocity differences. The results yielded significant improvement with regard to the sink defect. This method was practically applied to an industrial site to validate the sink improvement.

• Korean Journal of Materials Research
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• v.12 no.9
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• pp.750-760
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• 2002

In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.22 no.6
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• pp.121-127
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• 2022

Smart mirror is an IoT device that attaches a display and an embedded computer to the mirror and provides various information to the useer along with the mirror function. This paper went beyond the form of dealing with smart mirrors only stand alone device the provide information to users, and constructed a network in which smart mirrors are connected, and proposed and implemented a CoMirror system that allows users to talk and share information with other smart mirror users. The CoMirror system has a structure in which several CoMirror clients are connected on one CoMirror server. The CoMirror client consists of Raspberry Pi, a mirror film, a touch pad, a display device, an web camera, etc. The server has functions such as face learning and recognition, user management, a relay role for exchanging messages between clients, and setting up for video call. Users can communicate with other CoMirror users via the server, such as text, image, and audio messages, as well as 1:1 video call.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.3
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• pp.1-7
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• 2021

In this paper, by embedding a bare-die chip-type drive amplifier into the PCB composed of ABF and FR-4, it implements an embedded active device that can be applied in 28 GHz band modules. The ABF has a dielectric constant of 3.2 and a dielectric loss of 0.016. The FR-4 where the drive amplifier is embedded has a dielectric constant of 3.5 and a dielectric loss of 0.02. The proposed embedded module is processed into two structures, and S-parameter properties are confirmed with measurements. The two process structures are an embedding structure of face-up and an embedding structure of face-down. The fabricated module is measured on a designed test board using Taconic's TLY-5A(dielectric constant : 2.17, dielectric loss : 0.0002). The PCB which embedded into the face-down expected better gain performance due to shorter interconnection-line from the RF pad of the Bear-die chip to the pattern of formed layer. But it is verified that the ground at the bottom of the bear-die chip is grounded Through via, resulting in an oscillation. On the other hand, the face-up structure has a stable gain characteristic of more than 10 dB from 25 GHz to 30 GHz, with a gain of 12.32 dB at the center frequency of 28 GHz. The output characteristics of module embedded into the face-up structure are measured using signal generator and spectrum analyzer. When the input power (P_in) of the signal generator was applied from -10 dBm to 20 dBm, the gain compression point (P_1dB) of the embedded module was 20.38 dB. Ultimately, the bare-die chip used in this paper was verified through measurement that the oscillation is improved according to the grounding methods when embedding in a PCB. Thus, the module embedded into the face-up structure will be able to be properly used for communication modules in millimeter wave bands.