• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.743-744
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• 2008

• 한국ITS학회:학술대회논문집
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• 2004.11a
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• pp.85-88
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• 2004

• The Bulletin of The Korean Astronomical Society
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• v.35 no.1
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• pp.79-79
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• 2010

To investigate whether the present-day active galaxies follow the same black hole mass vs. stellar velocity dispersion (MBH-$\sigma*$) relation as quiescent galaxies, we measured the velocity dispersions of a sample of local Seyfert 1 galaxies, for which black hole masses were measured via reverberation mapping. We measured stellar velocity dispersions from high S/N optical spectra centered on the Ca II triplet region (${\sim}8500^{\circ}A$), obtained at the Keck, Palomar, and Lick Observatories. For two objects, in which the Ca II triplet region was contaminated by nuclear emission, we used high-quality H-band spectra obtained with the OH-Suppressing Infrared Imaging Spectrograph and laser-guide star adaptive optics at the Keck-II Telescope. Combining our new measurements with data from the literature, we assemble a sample of 24 active galaxies with stellar velocity dispersions and reverberation MBH in the range of black hole mass 106< MBH /$M{\odot}$ < 109,toobtainthefirstreverberationmappingconstraintsontheslopeandintrinsicscatteroftheMBH- $\sigma*$ relation of active galaxies. Assuming a constant virial coefficient f for the reverberation MBH, we find a slope ${\beta}=3.55{\pm}0.60$ and the intrinsic scatter ${\sigma}int=0.43{\pm}0.08$ dex in the relation log (MBH/M${\odot}$)=$\alpha+\beta$ log(${\sigma}*$/200 km s-1), which are consistent with those found for quiescent galaxies. We derive an updated value of the virial coefficient f by finding the value which places the reverberation masses in best agreement with the MBH - $\sigma*$ relation of quiescent galaxies; using the quiescent MBH - $\sigma*$ relation determined by Gultekin et al. we find log f=0.72+0.09 (or $0.71{\pm}0.10$) with an intrinsic scatter of $0.44{\pm}0.07$ (or 0.46+0.07) dex. No correlations between f and parameters connected to the physics of accretion (such as the Eddington ratio or line-shape measurements) are found. The uncertainty of the virial coefficient remains one of the main sources of the uncertainty in black hole mass determination using reverberation mapping, and therefore also in single-epoch spectroscopic estimates of black hole masses in active galaxies.

• Composites Research
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• v.24 no.4
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• pp.23-28
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• 2011

Recently CFRP laminate joints process by bolts and nets are developed rapidly in aircraft industries. However, there are serious drawback during jointing process. Many hole processes are needed for the manufacturing and structural applications using composite materials. Generally, very durable polycrystalline crystalline diamond (PCD) drill has been used for the CFRP hole process. However, due to the expensive price and slow process speed, chemical vapor deposition (CVD) diamond drill has been used increasingly which are relatively-low durability but easily-adjustable process speed via drill shape change and price is much lower. In this study, the comparison of hole process between PCD and CVD diamond coated drills was done. First of all, CFRP hole processbility was evaluated using the equations of hole processing conditions (feed amount per blade, feed speed). The comparison on thermal damage occurring from the CFRP specimen was also studied during drilling process. Empirical equation was made from the temperature photo profile being taken during hole process by infrared thermal camera. In addition, hole processability was compared by checking hole inside condition upon chip exhausting state for two drills. Generally, although the PCD can exhibit better hole processability, hole processing speed of CVD diamond drill exhibited faster than PCD case.

• Journal of the Korean institute of surface engineering
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• v.46 no.4
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• pp.153-157
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• 2013

The defect like the void or seam is frequently generated in the PCB (Printed Circuit Board) Via-Filling plating inside via hole. The organic additives including the accelerating agent, inhibitor, leveler, and etc. are needed for the copper Via-Filling plating without this defect for the plating bath. However, the decomposition of the organic additive reduces the lifetime of the plating bath during the plating process, or it becomes the factor reducing the reliability of the Via-Filling. In this paper, the interaction of each organic additives and the decomposition of additive were discussed. As to the accelerating agent, the bis (3-sulfopropyl) disulfide (SPS) and leveler the Janus Green B (JGB) and inhibitor used the polyethlylene glycol 8000 (PEG). The research on the interaction of the organic additives and decomposition implemented in the galvanostat method. The additive decomposition time was confirmed in the plating process from 0 Ah/l (AmpereHour/ liter) to 100 Ah/l with the potential change.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.11 no.3
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• pp.379-387
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• 2000

In this paper, to transmit and receive the differently polarized wideband signals simultaneously with a single antenna system, the wideband, dual-frequency and dual-polarized(WDFDP) microstrip array antenna is proposed and designed. This antenna operates simultaneously at 14.25 GHz and 12.50 GHz. To extend to two dimensional array, microstrip feed line and coaxial probe through via-hole are used. The experimental results show that the proposed WDFDP microstrip antenna can be used in the compact portable terminals with a single antenna system and the characteristic of the resonators in this antenna produces a greatly enhanced bandwidth.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.1
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• pp.149-156
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• 2017

Graphene nanoplatelet (GNP)-reinforced alumina ($Al_2O_3$) is a promising material for micro-partapplications, particularly micro-nozzle shapes, because of its excellent wearresistance. In this study, a $Al_2O_3$/GNPcomposite with 15 vol% graphene nanoplatelets (GNP) was highly densified and fabricated via spark plasma sintering for micro-electrical discharge drilling (Micro-ED drilling) and the wear resistance property of the composite is evaluated via the ball-on-disk method. In addition, the diameter and shape of the micro-electrodes machined by wire electrical discharge grinding (WEDG), block electrical discharge grinding (BEDG), and new linear block moving electrical discharge grinding (LBMEDG) methods are systematically compared and analyzed to observe the micro-hole machining in the micro-ED drilling of the $Al_2O_3$/15vol% GNP composite.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.40-44
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• 2010

Laser drilling is an enabling technology for Through Silicon Via (TSV) interconnect applications. Recent advances in picoseconds laser drilling of blind, micron sized vias in silicon is presented here highlighting some of the attractive features of this approach such as excellent sidewall quality. In this study, we dealt with comparison of heat affection around drilled hole between a picosecond laser and a nanosecond laser process under the UV wavelength. Points which special attention should be paid are that picosecond laser process lowered experimentally recast layer, surface debris and micro-crack around hole in comparison with nanosecond laser process. These finding suggests that laser TSV process has possibility to drill under $10{\mu}m$ via. Finally, the laser drilling platform was constructed successfully.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.15 no.2
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• pp.172-177
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• 2004

In this paper, DGS(Defected Ground Structure) is applied to multi-layer structure using LTCC(Low Temperature Co-fired Ceramics). Sprial DGS is adopted in order for size-reduction and higher quality factor, the multi-layer DGS has the same characteristics as the planar DGS. Multi-layer bandpass filter of new shape is confiured using two multi-layer spiral DGS and is designed with no via-hole for the simple process. 5.25 GHz Wireless LAN bandpass filter is designed and fabricated, the insertion loss of the filter is measured less than 1.5 dB, and the size is 2.0 mm${\times}$1.2 mm${\times}$1.1 mm(L${\times}$W${\times}$H).

• Journal of the Semiconductor & Display Technology
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• v.10 no.4
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• pp.53-59
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• 2011

Recently there have been considerable attentions on nanoimprint lithography (NIL) by the display device and semiconductor industry due to its potential abilities that enable cost-effective and high-throughput nanofabrication. Although one of the current major research trends of NIL is large-area patterning, the technical difficulties to keep the uniformity of the residual layer become severer as the imprinting area increases more and more. In this paper we focused on the deformation of the $2^{nd}$ generation TFT-LCD sized ($370{\times}470mm^2$) large-area soft mold in the UV imprinting process. A mold was fabricated with PDMS(Poly-dimethyl Siloxane) layered glass back plate(t0.5). Besides, the mold includes large surrounding wall type protrusions of 1.9 mm width and the via-hole(7 ${\mu}m$ diameter) patterend area. The large surrounding wall type protrusions cause the proximity effect which severely degrades the uniformity of residual layer in the via-hole patterend area. Therefore the deformation of the mold was calculated by finite element analysis to assess the effect of large surrounding wall type protrusions and the flexiblity of the mold. The deformation of soft mold was verified by the measurements qualitatively.