• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.256-259
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• 2003

To develop cleaning process various particles should be deposited on wafer surfaces to measure particle removal efficiencies. The purpose of the article in to evaluate, removal efficient)r of silica and alumina particles from wafer surfaces when they are deposited by dry and wet method. Dry deposition in air and wet spray deposition using solutions are used. van der Waals are considered to calculate the adhesion force of particles on surfaces. Higher adhesion force is measured on alumina particles on silicon when particles are deposited in air.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.6 s.237
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• pp.852-859
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• 2005

Molecular dynamics simulations of nanoimprint lithography in which a stamp with patterns is pressed onto amorphous poly-(methylmethacrylate) (PMMA) surface are performed to study the deformation of polymer. Force fields including bond, angle, torsion, inversion, van der Waals and electrostatic potential are used to describe the intermolecular and intramolecular force of PMMA molecules and stamp. Periodic boundary condition is used in horizontal direction and Nose-Hoover thermostat is used to control the system temperature. As the simulation results, the adhesion forces between stamp and polymer are calculated and the mechanism of deformation are investigated. The effects of the adhesion and friction forces on the polymer deformation are also studied to analyze the pattern transfer in nanoimprint lithography. The mechanism of polymer deformation is investigated by means of inspecting the indentation process, molecular configurational properties, and molecular configurational energies.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1560-1565
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• 2003

Tapping mode atomic force microscopy (TM-AFM) utilizes the dynamic response of a resonating probe tip as it approaches and retracts from a sample to measure the topography and material properties of a nanostructure. We present recent results based on nonlinear dynamical systems theory, computational continuation techniques and detailed experiments that yield new perspectives and insight into AFM. A dynamic model including van der Waals and Derjaguin-Muller-Toporov (DMT) contact forces demonstrates that periodic solutions can be represented with respect to the approach distance and excitation frequency. Turning points on the surface lead to hysteretic amplitude jumps as the tip nears/retracts from the sample. Experiments are performed using a tapping mode tip on a graphite sample to verify the predictions.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2011.04a
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• pp.447-452
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• 2011

This paper predicted the dynamic behaviors of a cantilevered carbon nanotube(CNT) incorporating the electrostatic force, van der Waals interactions between the CNT and ground plane. The structural model of the CNT includes geometric and inertial nonlinearities for predicting various phenomena of nonlinear responses of the CNT due to the electrostatic force. In order to solve the problem, we used Galerkin's approximation and the numerical integration techniques and as a result, we predicted characteristics of nonlinear response of nano resonator. The cantilevered CNT shows complex dynamic responses and instabilities due to the applied ac and ac voltages, and driving frequencies. The results investigated in this paper are helpful to the modeling of nanotube based electromechanical devices such as nano-resonators and nano-sensors.

• Transactions of the Society of Information Storage Systems
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• v.2 no.2
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• pp.105-110
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• 2006

Study for toner adhesion is 3non as an important role in electrophotography. In this research, a centrifugal detachment method was used to measure the adhesion force of several hundred particles simultaneously and to determine its sensitivity to particle size. For uncharged toner particles, we estimated the van der Waals force based on the centrifugal force experiments. Then for charged toner particles, the centrifugal force experiments were carried out. The difference between the results for charged toner particles and the results for uncharged toner particles was compared with the image force calculated from a model which assumed that the toner charge was located at the center of the particle. In the calculations, experimental data obtained by E-SPART (Electrical-Single Particle Aerodynamic Relaxation Time) analyzer were used. The adhesion force of micro-sized toner particles deposited on the DR surface was found to be approximately $1{\sim}3$ nN.

• 정보저장시스템학회:학술대회논문집
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• 2005.10a
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• pp.75-80
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• 2005

Study for toner adhesion is known as an important role in electrophotography. In this research, a centrifugal detachment method was used to measure the adhesion force of several hundred particles simultaneously and to determine its sensitivity to particle size. For uncharged toner particles, we estimated the van der Waals force based on the centrifugal farce experiments. Then for charged toner particles, the centrifugal force experiments were carried out. The difference between the results for charged toner particles and the results for uncharged toner particles was compared with the image force calculated from a model which assumed that the toner charge was located at the center of the particle. In the calculations, experimental data obtained by E-SPART (Electrical- Single Particle Aerodynamic Relaxation Time) analyzer were used. The adhesion force of micro-sized toner particles deposited on the DR surface was found to be approximately 1${\~}$3 nN.

• 대한공업교육학회지
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• v.30 no.2
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• pp.115-122
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• 2005

For an analysis of dynamic behavior in carbon nanotube(CNT) which is widely used as micro and nano-sensors, an electrostatic force of CNT was investigated. For larger gaps in between sensor and electrode the van der Waals force can be ignored. The boundary condition in the CNT was assumed to clamped-clamped case at both ends. In this paper electrostatic force is expressed as linear equation along deflection using Taylor series. The first and second terms(${\zeta}_0$ and ${\zeta}_1$) of the linear equation are analyzed. Based on the simulation results nondimensional number ${\Phi}_0$ and ${\Phi}_1$ which came from ${\zeta}_0$ and ${\zeta}_1$ were decreased according to the increment of the gap. Reduction ratio of the second term ${\zeta}_1$ is increased up to 99% along to the increment of the gap. The higher order terms can be ignored and therefore, electrostatic force can be expressed using the first two terms of the linear equation. This results play an important role in analyzing the nonlinear dynamic behavior of the CNT as well as the pull-in voltage of simply supported switches.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.12
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• pp.1092-1100
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• 2005

We investigated a carbon nanotube (CNT) oscillator controlled by the thermal gas expansion using classical molecular dynamics simulations. When the temperature rapidly increased, the force on the CNT oscillator induced by the thermal gas expansion rapidly increased and pushed out the CNT oscillator. As the CNT oscillator extruded from the outer nanotube, the suction force on the CNT oscillator increased by the excess van der Waals(vdW) energy. When the CNT oscillator reached at the maximum extrusion point, the CNT oscillator was encapsulated into the outer nanotube by the suction force. Therefore, the CNT oscillator could be oscillated by both the gas expansion and the excess vdW interaction. As the temperature increased, the amplitude of the CNT oscillator increased. At the high temperatures, the CNT oscillator escaped from the outer nanotube, because the force on the CNT oscillator due to the thermal gas expansion was higher than the suction force due to the excess vdW energy. By the appropriate temperature controls, such as the maximum temperature, the heating rate, and the cooling rate, the CNT oscillator could be operated.

• Transactions on Electrical and Electronic Materials
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• v.13 no.4
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• pp.212-214
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• 2012

Both the electrically positive and negative particles in a cell of quick response-liquid powder display (QR-LPD) are surrounded by conductive electrodes on the upper and lower substrate and the dielectric materials of the barrier ribs. Particles in a cell are attached to or detached from the other materials by image force, electric field, Coulomb's force, and Van der Waals' force. Through these forces, the moving particles form an image but induce clumping phenomena. Particles having a large kinetic energy by a large q/m value crash into the opposite electrode with high speed at a large driving voltage and quickly lose electrically charged material. As a result, these particles are clumped and degrade panel performance. The clumped particles in a cell are observed by microscopic photographs and ascertained by a response time. When the bias voltage is increased to 0.68-0.76 $V/{\mu}m$, particle clumping occurs abruptly and the response time increases sharply. This particle clumping is similarly observed after the number of driving times at the driving voltage (0.42-0.64 $V/{\mu}m$).

• Laser Solutions
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• v.6 no.3
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• pp.29-35
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• 2003

In semiconductor processing, there are two types of particle contaminated onto the wafer, i.e. dry and wet state particles. In order to evaluate the cleaning performance of laser shock wave cleaning method, the removal of 1 m sized alumina particle at different particle conditions from silicon wafer has been carried out by laser-induced shock waves. It was found that the removal efficiency by laser shock cleaning was strongly dependent on the particle condition, i.e. the removal efficiency of dry alumina particle from silicon wafer was around 97％ while the efficiencies of wet alumina particle in DI water and IPA are 35％ and 55％ respectively. From the analysis of adhesion forces between the particle and the silicon substrate, the adhesion force of the wet particle where capillary force is dominant is much larger than that of the dry particle where Van der Waals force is dominant. As a result, it is seen that the particle in wet condition is much more difficult to remove from silicon wafer than the particle in dry condition by using physical cleaning method such as laser shock cleaning.