• Journal of the Korean Wood Science and Technology
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• 제35권5호
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• pp.67-75
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• 2007

As a part of abating the formaldehyde emission of urea-formaldehyde (UF) resin adhesive by lowering formaldehyde to urea (F/U) mole ratio, this study was conducted to investigate properties of UF resin adhesive with different F/U mole ratios. UF resin adhesives were synthesized at different F/U mole ratios of 1.6, 1.4, 1.2, and 1.0. Properties of UF resin adhesives measured were non-volatile solids content, pH level, viscosity, water tolerance, specific gravity, gel time and free formaldehyde content. In addition, a linear relationship between non-volatile solids content and sucrose concentration measured by a refractometer was established for a faster determination of the non-volatile solids content of UF resin. As F/U mole ratio was lowered, non-volatile solids content, pH, specific gravity, water tolerance, and gel time increased while free formaldehyde content and viscosity were decreased. These results suggested that the amount of free formaldehyde strongly affected the reactivity of UF resin. Lowering F/U mole ratio of UF resin as a way of abating formaldehyde emission consequently requires improving its reactivity.

• Journal of the Korean Wood Science and Technology
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• 제26권4호
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• pp.92-97
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• 1998

Four urea-formaldehyde (UF) resins were synthesized as a particleboard (PB) binder with the four different initial formaldehyde/urea mole ratio and the final mole ratio of 1.15. The UF resins were characterized according to the standard method of resin adhesive analysis. PBs were manufactured using liquid UF resins at 5 minutes press time and 6% resin solids levels on an ovendry particle weight basis. A total of 20 PBs was fabricated for 5 panel replication per UF resin types. The panels were tested for physical strength properties per the procedure ASTM D 1037. The formaldehyde emission levels from the PBs bonded with the UF resins were tested according to 2-hour desiccator test method ASTM D 5582. There were no significant differences among UF resin types for internal bond strength of PBs. But there were significant differences among UF resin types for formaldehyde emission level of PBs. The results showed that the formaldehyde emission level was influenced by the UF resin types without reducing the adhesive performance.

• Journal of the Korean Wood Science and Technology
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• 제35권5호
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• pp.76-86
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• 2007

This study was conducted to investigate the effects of formaldehyde to urea (F/U) mole ratio on thermomechanical curing of UF resin adhesives with different F/U mole ratios. Thermomechanical curing of these UF resin adhesives was characterized using parameters of dynamic mechanical analysis (DMA) such as the gel temperature, maximum storage modulus, and peak temperatures of storage and loss modulus. As the F/U mole ratio decreased, the gel temperature of UF resin adhesives increased. The maximum storage modulus as an indicator of the rigidity of UF resin adhesives decreased with decreasing F/U mole ratio. The peak temperature of tan $\delta$ increased with decreasing F/U mole ratio, indicating that the vitrification occurred faster for high F/U mole ratio of UF resin adhesives than for the one of lower F/U mole ratio. These results partially explained the reason why UF resin adhesives with lower F/U mole ratio resulted in relatively poor adhesion performance when they were applied.

• Journal of the Korean Wood Science and Technology
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• 제36권2호
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• pp.63-72
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• 2008

As a part of abating formaldehyde emission of urea-formaldehyde (UF) resin adhesive, this study was conducted to investigate chemical structures of UF resin adhesives with different formaldehyde/urea (F/U) mole ratios, using carbon-13 nuclear magnetic resonance ($^{13}C$-NMR) spectroscopy. UF resin adhesives were synthesized at four different F/U mole ratios such as 1.6, 1.4, 1.2, and 1.0 for the analysis. The analysis $^{13}C$-NMR spectroscopy showed that UF resin adhesives with higher F/U mole ratios (i.e., 1.6 and 1.4) had two distinctive peaks, indicating the presence of dimethylene ether linkages and methylene glycols, a dissolved form of free formaldehyde. But, these peaks were not detected at the UF resins with lower F/U mole ratios (i.e., 1.2 and 1.0). These chemical structures present at the UF resins with higher F/U mole ratios indicated that UF resin adhesive with higher F/U mole ratio had a greater contribution to the formaldehyde emission than that of lower F/U mole ratio. Uronic species were detected for all UF resins regardless of F/U mole ratios.

• Journal of the Korean Wood Science and Technology
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• 제42권5호
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• pp.605-614
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• 2014

This study investigated microstructural changes of cured urea-formaldehyde (UF) resins mixed with aqueous rubber latex emulsion after intentional acid etching. Transmission electron microscopy (TEM) was used in order to better understand a hydrolytic degradation process of cured UF resins responsible for the formaldehyde emission from wood-based composite panels. A liquid UF resin with a formaldehyde to urea (F/U) molar ratio 1.0 was mixed with a rubber latex emulsion at three different mixing mass ratios (UF resin to latex = 30:70, 50:50, and 70:30). The rate of curing of the liquid modified UF resins decreased with an increase of the rubber latex proportion as determined by differential scanning calorimetry (DSC) measurement. Ultrathin sections of modified and cured UF resin films were exposed to hydrochloric acid etching in order to mimic a certain hydrolytic degradation. TEM observation showed spherical particles and various cavities in the cured UF resins after the acid etching, indicating that the acid etching had hydrolytically degraded some part of the cured UF resin by acid hydrolysis, also showing spherical particles of cured UF resin dispersed in the latex matrix. These results suggested that spherical structures of cured UF resin might play an important role in hindering the hydrolysis degradation of cured UF resin.

• 농업과학연구
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• 제36권1호
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• pp.11-18
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• 2009

The purpose of this study is to examine a proper amount of addition and a proper point for addition of titanium dioxide for the manufacture of E0 type of urea-formaldehyde resin (UF). The reduction of free formaldehyde from UF resin treated particle board was also investigated. $TiO_2$ content was 0.5%, 1% and 3% on the dry basis of UF resin. UV light was used to initiate reaction. The results of this study are as follows: 1. During UF resin manufacturing process, the second adding step of urea was proper point for $TiO_2$ addition. 2. 1 % addition of $TiO_2$ gave good values for the Eo type urea-formaldehyde resin. 3. There was no significant difference between physical properties of particle board, but the higher the adding content of titanium dioxide resulted in the lower the mechanical properties.

• Journal of the Korean Wood Science and Technology
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• 제45권2호
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• pp.223-231
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• 2017

This work was conducted to investigate on the effect of urea-formaldehyde (UF) resin viscosity on plywood adhesion. The viscosity of UF resin was controlled either by adjusting the condensation reaction during its synthesis to obtain different target viscosities (100, 200 and 300 mPa.s) at two levels of formaldehyde/urea (F/U) mole ratios (1.0 and 1.2) or by adding different amounts (10, 20 and 30%) of wheat flour into the resins for the manufacture of plywood. When the viscosity of UF resin increased by the condensation reaction, the adhesion strength of plywood bonded with UF resin of 1.2 F/U mole ratio consistently increased, while those bonded with the 1.0 F/U mole ratio resin slightly decreased, suggesting a difference in the adhesion in plywood. However, the adhesion strength of plywood decreased as the viscosity increased by adding wheat flour, regardless of F/U mole ratio. The manipulation of UF resin viscosity by adjusting the condensation reaction was much more efficient than by adding wheat flour in improving the adhesion performance of plywood. These results indicated that a way of controlling the viscosity of UF resin adhesives has a great influence to their adhesion in plywood.

• Journal of the Korean Wood Science and Technology
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• 제34권5호
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• pp.42-51
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• 2006

The this study, the effect of rice husk flour (RHF) as scavenger on formaldehyde emission rate and formaldehyde content from urea-formaldehyde (UF) resin bonded RHF content wood particleboards (PB). Two type of particle size ($30{\mu}m$ and $300{\mu}m$) of RHF was premixed with the UF resin at 5% and 15% by weight. The performance of UF resins is greatly influenced by the curing characteristics in their curing processing. The curing behavior was monitored activation energy ($E_a$) by DSC and pH variation according to RHF contents. PB with dimensions of $27cm{\times}27cm{\times}0.7cm$ was prepared at a specific gravity of 0.75 using $E_1$ and $E_2$ class UF resins. Formaldehyde emission and formaldehyde content from RHF filled PB bonded with UF resin was measured by 24 h desiccator and perforator method, respectively. RHF causes an increased pH of UF resin. $E_a$ of the modified UF resin decreased independently of RHF particle size. As the pH and the $E_a$ variation of the UF resin containing RHF increased, the amount of formaldehyde content decreased. The formaldehyde emission and formaldehyde content levels of the PB bonded with 15 wt% of $30{\mu}m$ RHF and $E_2$ type UF resin were low and satisfied grade $E_1$, as measured by 24 h desiccator and perforator method. The result of a comparison between 24 h desiccator and perforator test using PB showed that the linear regression analyses show a good correlation between the results for the 24 h desiccator and the perforator tests. The linear regression of a correlation between the desiccator and the perforator was Y=4.842X-0.064 ($R^2=0.989$). RHF was effective at reducing formaldehyde emission and formaldehyde content in urea-formaldehyde adhesives when used as scavenger.

• 한국응용과학기술학회지
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• 제26권1호
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• pp.18-23
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• 2009

Curing behavior and structural property of an inorganic compound added urea-formaldehyde(UF) and urea-melamine-formaldehyde(UMF) were studied. In addition, tensile strength and formaldehyde emission of plywoods made of those resin binders were studied. Curing temperature and structure were not changed, but tensile strengths of plywoods manufactured both with a UF resin and a UMF resin were decreased slightly as increased amount of inorganic compound. Formaldehyde emissions from plywoods were reduced as increased amount of inorganic compound. Wheat flour as an extender was helped to reduce of formaldehyde emission. From the result of this study it might be estimated that using appropriate amount of inorganic compound and proper resin system can be strengthened bond strength and reduced formaldehyde emission.

• Journal of the Korean Wood Science and Technology
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• 제33권2호통권130호
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• pp.29-39
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• 2005

Formaldehyde emissions from wood-based panels bonded with pine and wattle tannin-based adhesives, urea-formaldehyde resin (UF), melamine-formaldehyde resin (MF), and co-polycondensed resin of urea-melamine-formaldehyde (UMF) were measured by the Japanese standard method using a desiccator (JIS A 1460) and the EN 120 (European Committee For Standardization, 1991) method using the perforator value. In formaldehyde emission, all particleboards made using the wattle tannin-based adhesive with three different hardeners, paraformaldehyde, hexamethylenetetramine, and tris(hydroxyl)nitromethan (TN), satisfied the requirements of grade $E_1$. But only those made using the pine tannin-based adhesive with the hexamine as hardener met the grade $E_1$ requirements. Hexamine was effective in reducing formaldehyde emission in tannin-based adhesives when used as the hardener. While the UF resin showed a desiccator value of $7.1mg/{\ell}$ and a perforator value of 12.1 mg/100 g, the MF resin exhibited a desiccator value of $0.6mg/{\ell}$ and a perforator value of 2.9 mg/100 g. According to the Japanese Industrial Standard and the European Standard, the formaldehyde emission level of the MDF panels made with UF resin in this study came under grade $E_2$. The formaldehyde emission level was dramatically reduced by the addition of MF resin. The desiccator and perforator methods produced proportionally equivalent results. Gas chromatography, a more sensitive and advanced method, was also used. The samples for gas chromatography were gathered during the experiment involving the perforator method. The formaldehyde contents measured by gas chromatography were directly proportional to the perforator values.