• Title/Summary/Keyword: underfill

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An Analysis of Closed Die Forging of Laser Printer Shaft by Finite Element Method (레이저 프린터용 샤프트 밀폐단조 성형해석)

  • Cho, S.H.;Shin, M.S.;Kim, J.H.;Ra, S.W.;Kim, J.B.
    • Transactions of Materials Processing
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    • v.18 no.2
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    • pp.150-155
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    • 2009
  • A shaft for laser printers has to be produced with high dimensional accuracy of a few micrometers. Most companies produce the shaft, therefore, by machining. These days, forging process is tried to be employed in manufacturing the shaft for productivity. In this study, the dimensional inaccuracy of straightness is studied and the underfill is not focused because the shaft shape is simple and the load capacity of press is sufficient. The straightness and concentricity of the shaft is important for the operation of a laser printer. Many design parameters such as preform shapes, tooling dimensions, forging load, and billet geometries may affect on the dimensional accuracy. In the forging process of shafts, a billet which is cut from wires is used. The billet, therefore, may be a little bit curved but not always straight. The elastic recovery is considered to cause the dimensional inaccuracy. Therefore, the effect of the forging load on the elastic recovery and straightness is investigated through the finite element analyses using DEFORM-3D and ABAQUS.

Measurements of Flow Meniscus Movement in a Micro Capillary Tube (마이크로 원형 모세관에서 계면 이동 현상의 측정)

  • Lee, Sukjong;Sung, Jaeyong;Lee, Myeong Ho
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.22 no.1
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    • pp.15-21
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    • 2013
  • In this paper, a high-speed imaging and an image processing technique have been applied to detect the position of a meniscus as a function of time in the micro capillary flows. Two fluids with low and high viscosities, ethylene glycol and glycerin, were dropped into the entrance well of a circular capillary tube. The filling times of the meniscus in both cases of ethylene glycol and glycerin were compared with the theoretical models - Washburn model and its modified model based on Newman's dynamic contact angle equation. To evaluate the model coefficients of Newman's dynamic contact angle, time-varying contact angles under the capillary flows were measured using an image processing technique. By considering the dynamic contact angle, the estimated filling time from the modified Washburn model agrees well with the experimental data. Especially, for the lower-viscosity fluid, the consideration of dynamic contact angle is more significant than for the higher-viscosity fluid.

A Study of Process Parameters Optimization Using Genetic Algorithm for Nd:YAG Laser Welding of AA5182 Aluminum Alloy Sheet (AA5182 알루미늄 판재의 Nd:YAG 레이저 용접에서 유전 알고리즘을 이용한 공정변수 최적화에 대한 연구)

  • Park, Young-Whan;Rhee, Se-Hun;Park, Hyun-Sung
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.1322-1327
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    • 2007
  • Many automotive companies have tried to apply the aluminum alloy sheet to car body because reducing the car weight can improve the fuel efficiency of vehicle. In order to do that, sheet materials require of weldablity, formability, productivity and so on. Aluminum alloy was not easy to join these metals due to its material properties. Thus, the laser is good heat source for aluminum alloy welding because of its high heat intensity. However, the welding quality was not good by porosity, underfill, and magnesium loss in welded metal for AA5182 aluminum alloy. In this study, Nd:YAG laser welding of AA 5182 with filler wire AA 5356 was carried out to overcome this problem. The weldability of AA5182 laser welding with AA5356 filler wire was investigated in terms of tensile strength and Erichsen ratio. For full penetration, mechanical properties were improved by filler wire. In order to optimize the process parameters, model to estimate tensile strength by artificial neural network was developed and fitness function was defined in consideration of weldability and productivity. Genetic algorithm was used to search the optimal point of laser power, welding speed, and wire feed rate.

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Die Design for Shape Drawing to Improve the Dimensional Accuracy of a Hollow LM-Guide Rail (중공형 LM-Guide Rail의 치수정밀도 향상을 위한 형상인발 금형 설계)

  • Park, J.H.;Lee, K.H.;Kim, S.M.;Kim, H.J.;Kim, S.J.;Kim, B.M.
    • Transactions of Materials Processing
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    • v.24 no.5
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    • pp.340-347
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    • 2015
  • Multi-pass shape drawing is used to manufacture long products of arbitrary cross-sectional shapes. This process allows smooth surface finishes and closely controlled dimensions of the cross-sectional shape. Tube shape drawing for hollow type products provides material savings and weight reduction. The intermediate die shapes are very important in multi-pass tube shape drawing. In the current paper, the design method for the intermediate dies in a tube shape drawing process is developed using a die offset for corner filling (DOCF) method. Underfill defects are related to the radial velocity distribution of each divided section in the deformation zone. The developed intermediate die shape design was applied to the two-pass tube shape drawing with fixed mandrel for manufacturing a hollow linear motion (LM) guide rail. The proposed design method led to uniform and steady metal flow at each divided section. FE-simulations and experiments were conducted to validate the effectiveness of the proposed method in multi-pass tube shape drawing process.

An Analysis on the Thermal Shock Characteristics of Pb-free Solder Joints and UBM in Flip Chip Packages (플립칩 패키지에서 무연 솔더 조인트 및 UBM의 열충격 특성 해석)

  • Shin, Ki-Hoon;Kim, Hyoung-Tae;Jang, Dong-Young
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.16 no.5
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    • pp.134-139
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    • 2007
  • This paper presents a computer-based analysis on the thermal shock characteristics of Pb-free solder joints and UBM in flip chip assemblies. Among four types of popular UBM systems, TiW/Cu system with 95.5Sn-3.9Ag-0.6Cu solder joints was chosen for simulation. A simple 3D finite element model was first created only including silicon die, mixture between underfill and solder joints, and substrate. The displacements due to CTE mismatch between silicon die and substrate was then obtained through FE analysis. Finally, the obtained displacements were applied as mechanical loads to the whole 2D FE model and the characteristics of flip chip assemblies were analyzed. In addition, based on the hyperbolic sine law, the accumulated creep strain of Pb-free solder joints was calculated to predict the fatigue life of flip chip assemblies under thermal shock environments. The proposed method for fatigue life prediction will be evaluated through the cross check of the test results in the future work.

Effect of B Contents on Hardness Characteristic of Disk Laser Beam Welded CP Steels (CP강의 디스크레이저 용접부의 경도특성에 미치는 B 함유량의 영향)

  • Park, Tae-Jun;Yu, Jung-Woo;Kang, Jun-Il;Han, Tae-Kyo;Chin, Kwang-Keun;Kang, Chung-Yun
    • Journal of Welding and Joining
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    • v.29 no.1
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    • pp.107-114
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    • 2011
  • CP steel was developed to reduce the weight and increase the strength of car body. When it was welded using state-of-the-art disk laser welding, the effected of boron on the microstructure and hardness were investigated. Welding power was fixed at 3.5kW and welding speeds were 4,8 and 12m/min. Full penetration occurred in welding speed of 12m/min and weld bead was almost unchanged with boron contents. But the welding speed increased, the upper and lower bead were narrowed. In a welding speed of more than 8m/min, underfill defects were formed on the bead bottom. The hardness of weld zone was somewhat fluctuation in fusion zone and HAZ showed the highest hardness values. The hardness of each region showed little change with the boron contents, and softening phenomenon occurred in the HAZ near the base metal regardless of the boron contents.

Processing and Electrical Properties of COG(Chip on Glass) Bonding Using Fine-pitch Sn-In Solder Bumps (미세피치 Sn-In 솔더범프를 이용한 COG(Chip on Glass) 본딩공정 및 전기적 특성)

  • Choe Jae Hun;Jeon Seong U;Jeong Bu Yang;O Tae Seong;Kim Yeong Ho
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2003.11a
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    • pp.103-105
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    • 2003
  • COG (Chip on Glass) technology using solder bump reflow has been investigated to attach IC chip directly on glass substrate of LCD panel. As It chip and LCD panel have to be heated to reflow temperature of the so]der bumps for COG bonding, it is necessary to use low-temperature solders to prevent the damage of liquid crystals of LCD panel. In this study, using the Sn-52In solder bumps of $40{\mu}m$ pitch size, solder joints between Si chip and glass substrate were made at temperature below $150^{\circ}C$. The contact resistance of the solder joint was $8.58m\Omega$, which was much lower than that of the joint made using the conventional ACF bonding technique. The Sn-52In solder joints with underfill showed excellent reliability at a hot humid environment.

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Drawing Process with Rotational Die for Forming Grooves in a Tube (돌기 튜브 성형을 위한 회전 금형 인발공정에 관한 연구)

  • Park, Joon-Hong;Byon, Sang-Min
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.17 no.4
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    • pp.123-129
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    • 2018
  • A rotational drawing die which can form a long tube with spiral grooves on the surface is presented. The main feature of the proposed die is a rotation insert that is embedded into the die container for the die to freely rotate with respect to the drawing centerline as the materials are drawn. We employed a three-dimensional finite element model to investigate the effects of the rotational die on the material filling of spiral grooves. The material used in the finite element analysis was stainless 304. We also performed a pilot drawing test to verify the usefulness of the proposed rotational drawing die. Results reveal that the material filling of spiral grooves by the proposed rotational drawing die was in good agreement for both the finite element analysis and the drawing test. We found that the underfill in a conventional drawing die was reduced in the proposed rotational drawing die.

Development of Statistical Model and Neural Network Model for Tensile Strength Estimation in Laser Material Processing of Aluminum Alloy (알루미늄 합금의 레이저 가공에서 인장 강도 예측을 위한 회귀 모델 및 신경망 모델의 개발)

  • Park, Young-Whan;Rhee, Se-Hun
    • Journal of the Korean Society for Precision Engineering
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    • v.24 no.4 s.193
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    • pp.93-101
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    • 2007
  • Aluminum alloy which is one of the light materials has been tried to apply to light weight vehicle body. In order to do that, welding technology is very important. In case of the aluminum laser welding, the strength of welded part is reduced due to porosity, underfill, and magnesium loss. To overcome these problems, laser welding of aluminum with filler wire was suggested. In this study, experiment about laser welding of AA5182 aluminum alloy with AA5356 filler wire was performed according to process parameters such as laser power, welding speed and wire feed rate. The tensile strength was measured to find the weldability of laser welding with filler wire. The models to estimate tensile strength were suggested using three regression models and one neural network model. For regression models, one was the multiple linear regression model, another was the second order polynomial regression model, and the other was the multiple nonlinear regression model. Neural network model with 2 hidden layers which had 5 and 3 nodes respectively was investigated to find the most suitable model for the system. Estimation performance was evaluated for each model using the average error rate. Among the three regression models, the second order polynomial regression model had the best estimation performance. For all models, neural network model has the best estimation performance.

Preform Design of a Forged Punch by Approximate Optimization (근사 최적화 기법을 이용한 펀치 단조품의 예비성형체 설계)

  • Park, Sangkun
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.15 no.7
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    • pp.4057-4064
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    • 2014
  • In this paper, attempts were made to design a preform for a final punch inexpensively using the proposed approximate optimization method or metamodel-based simulation optimization. The design objective of this work is to achieve a uniform distribution of effective strains, the angle dimension of the preformed punch is chosen as a design variable, and maximum underfill ratio is used as a constraint. For this optimization, a computer simulation of a practical punch forging process is run using DEFORM software, in which a preformed punch(workpiece), a master punch(upper die), and a bottom die are dealt with. A validation method is introduced to determine if the simulation results match the actual forging process. In addition, this work presents the detailed design optimization procedure consisting of (i) generation of an initial metamodel, (ii) metamodel optimization, (iii) validation of metamodel-predicted optimum, and (iv) metamodel improvement.