• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년도 춘계 학술대회 개요집
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• pp.21-23
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• 2006

The microstructural investigation and thermo-mechanical reliability evaluation of the Sn-3.0Ag-0.5Cu solder bumped flip chip package were carried out during the thermal shock test of the package. In the initial reaction, the reaction product between the solder and Cu mini bump of chip side was Cu6Sn5 layer, while the two phases which were (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 were formed between the solder and Ni-P layer of the package side. The cracks were occurred at the corner solder joints after the thermal shocks of 400 cycles. The primary failure mechanism of the solder joints in this type of package was confirmed to be thermally activated solder fatigue failure.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 춘계학술대회논문집A
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• pp.873-878
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• 2000

Semiconductor packaging technology is changed rapidly according to the trends of the micro miniaturization of multimedia and information equipment. For I/O limitation and fine pitch limitation, DIP and SOP/QFP are replaced by BGA/CSP. This is one of the surface mount technology(SMT). Solder ball is bumped n the die pad and connected onto mounting board. In ball bump formation, vacuum suction type ball alignment process is widely used, However this type has some problems such as ionization, static electricity and difficulty of fifo(first-input first-out) of solder balls. Seesaw type is reducing these problems and has a structural simplicity and economic efficiency. Ball cartridge velocity and ball aligned plate angle are Important variables to improve the ball alignment Process. In this paper, seesaw-type CSP solder ball loader is developed and the optimal velocity and plate angle are proposed.

• 한국컴퓨터정보학회논문지
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• 제13권6호
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• pp.279-286
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• 2008

우리 IT산업은 2007년 현재 GDP에서 차지하는 비중이 약 17%에 이를 정도로 국가 경제에 중추적 역할을 하고 있다. 그러나 최근 미국發글로벌 경기침체가 지속되면서, 이에 따른 소비위축으로 IT수요가 부진을 보이고 있다. IT수요의 부진은 IT공급과잉으로 이어져, 결국 IT가격의 경쟁심화로까지 나타나면서, IT산업 전체의 위기감이 고조되고 있다. 따라서 기존 수출품목 및 대상국가의 다변화와 그에 따른 차별화된 수출전략에 대한 요구가 높아지고 있기에 차별화된 수출전략을 위하여 전략품목 및 국가에 대하여 대기업과 중소기업간, 산업간, 연계사업간 등의 다양한 IT분야 패키지형 해외진출 방안을 제시해 보고자 한다. IT산업은 앞으로도 우리 경제의 큰 버팀목으로 자리잡고 발전해 나아갈 것이며, IT분야의 패키지형 해외진출 방안이 일조를 해 나아갈 것이다.

• 전기학회논문지P
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• 제67권2호
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• pp.63-69
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• 2018

In this paper, the operation principle of a bi-directional switch type resonant AC link snubber circuit was described, together with the practical design procedure, which employs in the proposed power module bridge package type resonant AC link snubber. The novel prototype of power module bridge package type resonant AC link snubber-assisted voltage type sinewave soft switching PWM inverter using IGBT power module was demonstrated herein. It was verified that both the auxiliary power switches in this resonant AC link snubber circuit and the main power switches commutate under the condition of soft switching commutation principle. In addition, the power losses of the new soft switching inverter treated here were analyzed by implementing the experimental data of the IGBT and diode v-i characteristics in addition to switching power loss characteristics into our original computer simulation software developed by the authors. Then, the voltage type sinewave soft switching PWM inverter was high efficiency than that of hard switching PWM inverter, along with performance operation waveforms. In the future, the comparative feasibility study of power module bridge type resonant AC link snubber and its related soft switching inverter in addition to the other types resonant snubber assisted soft switching inverter should be done from a practical point of view.

• 전자공학회논문지C
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• 제36C권11호
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• pp.18-28
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• 1999

RFIC 설계를 위한 새로운 패키지(SOP, Small Outline Package) 등가 회로 모델을 제시한다. RF 영역의 패키지에서 패들(paddle)은 이상적인 그라운드(ground)로 동작하지 못하며 패들과 MMIC 다이(die) 사이의 커플링(coupling) 문제 및 손실에 의한 기생 효과로 인해 MMIC 회로에 심각한 영향을 준다. 패키지의 전기적 효과에 대한 새로운 등가 회로 모델과 파라미터(parameter) 추출 방법을 SOP 패키지를 예로 들어 제시한다. 제시한 모델의 정확성은 상용 full-wave solver와 제시한 모델을 HSPICE 시뮬레이션하여 구한 5-파라미터를 상호 비교함으로써 모델의 정확성을 평가하고 모델이 약 8㎓까지 full-wave 해석 결과와 일치함을 보인다.

• 한국융합학회논문지
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• 제8권12호
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• pp.23-29
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• 2017

본 논문은 1mm 이하의 극소형 패키지 개발을 위한 금형 기술을 소개한다. 또한 이 금형 기술을 사용하여 산출된 결과들의 오류 패턴을 분석한다. 기존의 극소형 금형 구조는 일체형이었는데 EDM의 표면이 거칠어 오류율을 증가시키는 원인이 되었다. 이 원인으로 인해 금형의 크기를 더 줄이는데 방해요소로 작용하였다. 이에 반해 제안하는 금형기술은 기존의 일체형 방식에서 벋어나 조립식 방법을 사용하여 일체식의 한계를 극복하고자 한다. 또한 새로 제안된 금형 구조를 이용해 산출한 결과에 결함 패턴을 분류하고, 각 패턴의 발생 확률을 분석하여 검출기를 개발하려는 기초 자료로 사용하려 한다.

• 반도체디스플레이기술학회지
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• 제19권1호
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• pp.29-35
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• 2020

The cure characteristics of three kinds of naphthalene type epoxy resins(NET-OH, NET-MA, NET-Epoxy) with a 2-methyl imidazole(2MI) catalyst were investigated for preparing sheet epoxy molding compound(SEMC) for wafer level package(WLP) applications, comparing with diglycidyl ether of bisphenol-A(DGEBA) and 1,6-naphthalenediol diglycidyl ether(NE-16) epoxy resin. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The NET-OH epoxy resin represented an n-th order cure mechanism as like NE-16 and DGEBA epoxy resins, however, the NET-MA and NET-Epoxy resins showed an autocatalytic cure mechanism. The NET-OH and NET-Epoxy resins showed higher cure conversion rates than DGEBA and NE-16 epoxy resins, however, the lowest cure conversion rates can be seen in the NET-MA epoxy resin. Although the NETEpoxy and NET-MA epoxy resins represented higher cure reaction conversions comparing with DGEBA and NE-16 resins, the NET-OH showed the lowest cure reaction conversions. It can be figured out by kinetic parameter analysis that the lowest cure conversion rates of the NET-MA epoxy resin are caused by lower collision frequency factor, and the lowest cure reaction conversions of the NET-OH are due to the earlier network structures formation according to lowest critical cure conversion.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 International Symposium
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• pp.21-30
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• 2002

According the difference of flex substrate, (reel tape), there are three kind assembly types of LCD driver IC is COG, TCP and COF, respectively. The TCP is the maturest in these types for stability of raw material supply and other specification. And TCP is the major assembly type of LCD driver IC and the huge demand from Taiwan's large TFT LCD panel house since this spring. But due to its package structure and the raw material applied in this package, there is some limitation in fine pitch application of this package type, (TCP). So, COF will be very potential in compact and portable application comparison with TCP in the future. There are three kinds assembly methods in COF, one is ACF by using the anisotropic conductive film to connect the copper lead of tape and gold bump of IC, another is eutectic bonding by using the thermo-pressure to joint the copper lead of tape and gold bump of IC, and last is NCP by using non-conductive paste to adhere the copper lead of tape and gold bump of IC. To have a global realization, this paper will briefly review the status of Taiwan's large TFT panel house, the internal driver IC design house, and the back-end assembly house in the beginning. The different material property of raw material, PI tape is also compared in the paper. The more detail of three kinds of COF assembly method will be described and compared in this paper.

• 대한기계학회논문집
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• 제18권8호
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• pp.2158-2166
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• 1994

In order to understand the package crack emanating from the edge of leadframe after the delamination between leadframe and epoxy molding compound in an electronic packaging of surface mounting type, the M-integral and J-integral in fracture mechanics are obtained. The effects of geometry, material properties and molding process temperature on the package crack are investigated taking into account the temperature dependence of the material properties, which simulates a more realistic condition. If the temperature dependence of the material properties is considered the result of analysis conforms with observations that the crack is kinked at between 50 and 65 degree. However, in case of constant material properties at the room temperature it is found that the J-integral is underestimated and the kink crack angle is different form the observation. The effects of the material properties and molding process temperature on J-integral and crack angle are less significant that the chip size for the cases considered here. It is suggested that the geometric factors such as ship size, leadframe size are to be well designed in order to prevent(or control) the occurrence and propagation of the package crack.

• 마이크로전자및패키징학회지
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• 제27권3호
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• pp.35-39
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• 2020

Nonwet (Head in Pillow) 불량은 SMT(surface mount technology) 공정 불량 유형 중 하나로 이 불량은 solder paste misalign, reflow 조건, package warpage, package ball size 등과 같은 인자에 따라 불량이 발생을 한다. 이에 본 논문은 Nonwet 발생 인자 중 ① reflow 조건 ② package ball & solder paste misalign ③ package ball 크기 type에 대한 인자를 선정하여 nonwet 실험을 진행하였다. 먼저 reflow 조건의 경우 soldering 시간이 길 경우 nonwet risk가 증가를 하나, reflow 공정에 N₂를 적용할 시 solder ball 산화 억제에 따른 nonwet 개선을 확인 할 수 있었다. 또한 package ball과 solder paste misalign 발생 시 ball과 paste의 접촉 깊이가 20 ㎛ 이하의 경우 nonwet에 취약 했으며, package ball 체면적이 작을수록 nonwet 관점 개선됨을 확인 할 수 있었다.