• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.10
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• pp.9-15
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• 2002

We propose a new transit time device to extend the operating frequency to submillimeter-wave(extreme infrared) ranges by utilizing velocity overshoot effects in the drift region. We name it a velocity overshoot transit time (OVTT) diode. This device adopts fast heterostructure tunneling as injection mechanism and a short drift region to optimize the velocity overshoot effects. To enhance dc-to-RF conversion efficiencym the drift region is designed with a bandgap grading method. Simulation results demonstrate that a VOTT diode can be operated at THz ranges.

• Proceedings of the KIPE Conference
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• 2001.10a
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• pp.44-46
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• 2001

Increase of gate leakage current causes decrease of gain and increase of noise. In this paper, gate leakage current of GaAs MESEFTs' has been traced with different temperatures from $27^{\circ}C\;to\;350^{\circ}C$ to obtain the zero voltage saturation current $J_s$ which is critical to the temperature dependency of total current. From the results, thermal leakage current coefficient has been proposed to compensate for the total current due to the thermionic emission, tunneling, generation and/or hole injection.

• Tunnel and Underground Space
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• v.7 no.4
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• pp.299-309
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• 1997

Soil and rock improvement and reinforcement techniques are applied to achieve safe tunnel excavation in difficult geological conditions. The Umbrella Arch Method(UAM), one of the auxiliary techniques, is used to reduce ground permeability and improve stabtility of the tunnel by inserting a series of steel pipes into ground around the crown inclined to the longitudinal axis of the tunnel. Additionally, multi-step grouting is added through the steel pipes. UAM combines the advantages of a modern forepoling system with the grouting injection method. This technique has been applied in subway, road and utility tunneling sites for the last few years in Korea. This paper presents the results of analysis of the case studies on ground movements associated with UAM used in the Seoul Subway line 5 constructon site. Improvement of tunnel stability and decrease of ground settlement expected with pipe insertion are also discussed. Finally, the method to minimize ground settlements caused by NATM tunnelling are suggested.

• Electrical & Electronic Materials
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• v.11 no.10
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• pp.94-99
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• 1998

Suitable replacement materials for ultrathin SiO2 in deeply scaled MOSFETs such as lattice polarizable films, which have much higherpermittivities than SiO2, have bandgaps of only 3.0 to 4.0 eV. Due to these small bandgaps, the reliability of these films as a gate insulator is a serious concern. Ramped voltage, time dependent dielectric breakdown, and hot carrier effect measurements were done on 190 layers of TiO2 which were deposited through the metal-organic chemical vapor deposition of titanium tetrakis-isopropoxide (TTIP). Measurements of the high and low frequency capacitance indicate that virtually no interface state are created during constant current injection stress. The increase in leakage upon electrical stress suggests that uncharged, near-interface states may be created in the TiO2 film near the SiO2 interfacial layer that allow a tunneling current component at low bias.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 1998.11a
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• pp.165-168
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• 1998

Re-oxidized nitrided oxides which have been investigated as alternative gate oxide for Metal- Oxide -Semiconductor field effect devices were grown by conventional furnace process using pure NH$_3$ and dry $O_2$ gas, and were characterized via a Fowler-Nordheim Tunneling electron injection technique. We studied Ig-Vg characteristics, leakage current, $\Delta$Vg under constant current stress from electrical characteristics point of view and TDDB from reliability point of view of MOS capacitors with SiO$_2$, NO, ONO dielectrics. Also, we studied the effect of stress temperature (25, 50, 75, 100, and 1$25^{\circ}C$). Overall, our results indicate that optimized re-oxidized nitrided oxide shows improved Ig-Vg characteristics, leakage current over the nitrided oxide and SiO$_2$. It has also been shown that re-oxidized nitrided oxide have better TDDB performance than SiO$_2$ while maintaining a similar temperature and electric field dependence. Especially, the Qbd is increased by about 1.5 times.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.49-55
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• 2016

Nowadays there are magnetic sensors in a wide variety of equipment such as computers, cars, airplanes, medical and industrial instruments. In many of these applications the magnetic sensors offer safe and non-invasive means of detection and are more reliable than other technologies. The electric current in a conductor generates a magnetic field detected by this type of sensor. This work aims to define a package dedicated to an electrical current sensor using a MTJ (Magnetic Tunnel Junction) as a sensing device. Four different proposals of packaging, three variations of the chip on board (CoB) package type and one variation of the thin small outline package (TSOP) were analyzed by COMSOL modeling software by simulating a brad range of current injection. The results obtained from the thermal and magnetic analysis has proven to be very important for package improvements, specially for heat dissipation performance.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1992.11a
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• pp.11-13
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• 1992

The dielectric reliability of the Thin $SiO_2$ films of wet oxidation on n-type Si substrates has been studied by using self-healing method of breakdown and according to injection time high frequence C-V tests. These experiments have been performed to investigate the dielectric breakdown mechanism of a thin film in which positive charge generation during high-field Fowler-Nordheim tunneling are considered. In addition, The weak spots and robust areas are distinguished so that the localized dielectric breakdown could be described.

• Proceedings of the KSR Conference
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• 1999.05a
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• pp.375-382
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• 1999

The use of compaction grouting system(C.G.S) evolved in the 1950's to correct structural settlement of buildings. Over the almost 50 years, the technology has developed and is currently used in wide range of applications. Compaction Grouting, the injection of a very stiff 'zero-slump' mortar grout under relatively high pressure, displaces and compacts soils. It can effectively repair natural or man-made soil strength deficiencies in variety of soil formations. Major uses of Compaction Grouting include densifying loose soils or fill voids caused by sinkholes, poorly compacted fills, broken utilities, improper dewatering, or soft ground tunneling excavation. Other application include preventing liquefaction, re-leveling settled structures, and using compaction grout bulbs as structural elements of minipiles or underpinning. So, on the basis of the case history constructed in recent year, a study has been performed to analyze the basic mechanism of the Compaction Grouting and verify the effectiveness of the ground improvement.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.2
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• pp.228-235
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• 2004

In this thesis, it is designed efficient electrode formation on the organic luminescent device. ITO electrode is treated with $O_2$plasma. In order to inject hole efficiently, there is proposed the shape of anode that inserted plasma polymerized films as buffer layer between anode and organic layer using thiophene monomer. It is realized efficiently electron injection to aluminum due to introduce the quantum well in cathode. In the case of device inserted the buffer layer by using the plasma poiymerization after $O_2$plasma processing for ITO transparent electrode, since it forms the stable interface and reduce the moving speed of hole, the recombination of hole and electronic ate made in the omitting layer. Compared with the devices without buffer layer, the turn-on voltage was lowered by 1.0(V) doc to the introduction of buffer layer Since the quantum well structure is formed in front of cathode to optimize the tunneling effect, there is improved the power efficiency more than two times.

• Proceeding of EDISON Challenge
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• 2016.03a
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• pp.299-304
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• 2016

2차원 반도체 소재의 경우 물질종류마다 내포하고 있는 고유결함에 의해서 Fermi-Level Pinning 이 발생하여 이로 인한 Schottky Barrier transistor로 동작을 하게 되며, 이는 접합부에 Carrier Injection 정도와 Schottky Barrier을 통과하는 Tunneling 정도에 의해서 소자의 특성이 결정 된다. 본 연구에서는 시뮬레이션을 통하여 2차원 반도체인 $MoS_2$소자를 설계하고, S/D Doping에 따라 접촉 저항 개선 효과와 소자의 동작특성이 어떠한 영향을 미치는지 연구하여 최대 $250cm^2/V{\cdot}sec$의 field effect mobility 의 결과를 얻었다. 또한 S/D doping 에 따라 각 저항 성분의 영향을 분석하였으며 면저항 및 접촉 저항 둘 다 doping 농도가 증가함에 따라 감소하는 결과를 나타내며, S/D doping의 영향은 접촉저항에서 더 크게 나타났다. 더불어 2차원 반도체의 Resistance network model 을 제안하여 subthreshold 영역에서는 $R_{ic}$, saturation 영역에서는 $R_{ish}$ 가 전체저항에서 주요한 변수로 전체저항식에 포함되어야 한다는 것을 시뮬레이션을 통해서 검증하였다.