• Title/Summary/Keyword: tungsten effect

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A Study on the Prediction Model of Surface Roughness by the Orthogonal Design for Turning Process (선반작업에서 직교계획법을 이용한 표면 거칠기 예측모델에 관한 연구)

  • 홍민성;염철만
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.10 no.2
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    • pp.89-94
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    • 2001
  • This paper presents a study of surface roughness prediction model by orthogonal design in turning operation. Regression analysis technique has been used to study the effects of the cutting parameters such as cutting speed, feed depth of cut, and nose radius on surface roughness. An effect of interaction between two parameters on surface roughness has also been investigated. The experiment has been conducted using coated tungsten carbide inserts without cutting fluid. The reliability of the surface roughness model as a function of the cutting parameters has been estimated. The results show that the experimental design used in turning process is a method to estimate the effects of cutting parameters on sur-face roughness.

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CMP properties of $SnO_2$ thin film ($SnO_2$ 박막의 CMP 특성)

  • Choi, Gwon-Woo;Lee, Woo-Sun;Ko, Pil-Ju;Kim, Tae-Wan;Seo, Yong-Jin
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.04b
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    • pp.93-96
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    • 2004
  • As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and nonuniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between partical size and CMP with partical size analysis of used slurry.

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A Study on the Development of ppb Level Dissolved Silica Measuring System (ppb Level 실리카 측정시스템 개발에 관한 연구)

  • 정경열;오상훈;이후락;동은석;이수태;류길수
    • Proceedings of the Korean Society of Marine Engineers Conference
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    • 2000.11a
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    • pp.143-151
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    • 2000
  • Dissolved silica is make some critical trouble at steam turbine. And, we must measure it to ppb level. We were looking for the best measuring method of the silica. Via this study, we could found it in the N-IR spectroscopy technology. This dissertation have been discuss about system structure, system fundamentals and performance test. At the test, we were study in the spectral interference of $NH_3$. We know that existing system had some problem. It is structural frailties of single beam type. Therefore we were study for double beam type structure. And we obtain a good result. In the result, it have been discuss that conduct a test of $NH_3$ effect.

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The Effect of W Particle Volume Percent on the Residual Stress of W Heavy Alloy (텅스텐계 중합금에서 텅스텐 입자의 부피비가 잔류응력에 미치는 영향)

  • 송홍섭
    • Journal of Powder Materials
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    • v.1 no.1
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    • pp.52-59
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    • 1994
  • Since the coefficient of thermal expansion (CTE) of matrix phase is larger about 4 times than that of W particle in tungsten heavy alloy, the thermal stresses due to the CTE difference between the two phases are induced in the alloy during heating and cooling processes. In the present study, a series of W heavy alloy containing various W particle volumes of 0 to 90% is made to investigate the residual stress taking place during cooling process. The CTE and residual stress of the series of alloy are measured by dilatometer and X-ray diffractometer. The residual stress of W particle is in compressive stress irrespective of W particle vol% and tends to increase with decreasing W particle vol% while that of the matrix phase is in tensile stress. The measured residual stress of W particle is about a third of calculated thermal stress. The influence of W particle vol% on the residual stress of W heavy alloy is discussed in terms of the deformation behaviors of W particle and matrix phase.

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Effects of Upset Pressure on Weldability in the Friction Welding of Cu to Cu-W Sintered Alloy (동-텅스텐 소결합금(Cu-W)과 동(Cu)의 마찰용접 특성에 미치는 업셋압력의 영향에 관한 연구)

  • 강성보;민택기
    • Journal of Welding and Joining
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    • v.17 no.5
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    • pp.69-76
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    • 1999
  • A copper-tungsten sintered alloy(Cu-W) has been friction welded to a tough pitch copper in order to investigate the effect of upset pressure on friction weldability. Under the condition of friction time 0.8sec, upset pressure 150MPa, the tensile strength and Charpy impact value of the friction welded joint were 336MPa, $400KJ/m^2$ respectively. And highest temperature of the weld measured was below $800^{circ}K$ which is very lower than melting point of Cu($1356^{circ}K$). Under the same conditions, W grains picked up in Cu matrix from Cu-W profitably affected on these mechanical fracture, and were dispersed in Cu by plastic flow during brake time.

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Cutting Characteristics of Actuator Arm in Hard Disk Drive (하드디스크 드라이브용 액츄에이터 암의 절삭 가공 특성)

  • Lee Jae-Woo
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.05a
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    • pp.11-12
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    • 2006
  • Actuator arm of HDD were machined with the slitting saw of tungsten carbide to clarify the cutting characteristics in terms of the roughness of machined surface, the burr size and the tool wear. An improved performance in all view of the surface machined, the tool life and the cutting efficiency was obtained at the cutting speed of 4,000rpm with the feed of 300m/min. The tool life increases with increasing the t/T value, whereas surface roughness decreases. The tool with alternate type of B and C edges has an effect to decrease the burr size.

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Micro Hole Machining for Ceramics ($Al_2O_3$) Using Ultrasonic Vibration (초음파 진동을 이용한 세라믹 소재의 마이크로 홀 가공)

  • 박성준;이봉구;최헌종
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.13 no.2
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    • pp.104-111
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    • 2004
  • Ultrasonic machining is a non-thermal, non-chemical, md non-electorial material removal process, and thus results in minimum modifications in mechanical properties of the brittle material during the process. Also, ultrasonic machining is a non-contact process that utilize ultrasonic vibration to impact a brittle material. In this research characteristics of micro-hole machining for brittle materials by ultrasonic machining(USM) process have been investigated. And the effect of ultrasonic vibration on the machining conditions is analyzed when machining fir non-conductive brittle materials using tungsten carbide tools with a view to improve form and machining accuracy.

Work Function Change of W(123) Plane Due to Hydrogen and Deuterium Adsorption at 78K (78K에서 수소 혹은 중수소 흡착으로 인한 W(123)면의 일함수 변화)

  • 박노길;김기석;김성수;정광호;황정남;최대선
    • Journal of the Korean Vacuum Society
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    • v.1 no.1
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    • pp.78-82
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    • 1992
  • The changes in work function due to hydrogen and deuterium adsorption on W(123) plane are measured by means of Field Emission Method. In the case of hydrogen or deuterium adsorption, work function of W(123) plane at 78 K increase and after a maxium value, it decrease and saturated as increasing coverage. After annealing the tungsten emission tip at 200 K, the coverage corresponding to maximum change in work function was shifted toward low coverage and the effect of work function by terraces or steps of which orientation is [ O l l ] was observed.

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Electrolysis for NiW Functional Alloy Plating (NiW 기능성 합금도금을 위한 전해)

  • Jeong, Goo-Jin;Lee, Churl-Kyoung
    • Journal of Surface Science and Engineering
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    • v.44 no.1
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    • pp.1-6
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    • 2011
  • A NiW functional alloy plating was investigated as variables of metal ion concentration, complexing agent, temperature, pH and applied current density. Even if numerous studies on reaction mechanism of NiW induced codeposition were carried out during couples of decade, it has not been acceptable reaction mechanism. This study was focused on the effect of the plating variables on the alloy composition in the NiW alloy plating. Applied current density could control mainly the alloy composition rather than other plating variables. It has also been confirmed that the functional alloy plating such as layered or gradient plating was possible by controlling applied current density.

Effect of Sputtering and Post-Annealing Condition on The Orientation of SBN Thin Films (스퍼터링 및 후 열처리 조건변화에 따른 SBN 강유전체 박막의 배향성에 관한 연구)

  • Lee, Chae-Jong;Lee, Hee-Young
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.05a
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    • pp.133-135
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    • 2006
  • SBN60 and SBN60/30 thin films were deposited by ion beam sputtering technique. Using the ceramic target of the same composition and Pt(100)/$TiO_2$/$SiO_2$/Si or Pt(111)/Ti/$SiO_2$/Si substrate, crystallization and orientation behavior as well as electric properties of the films were examined, Thickness was controlled to $3000{\AA}$ and the films were heat-treated at $650^{\circ}C{\sim}800^{\circ}C$. The orientation and crystallization behavior were observed which showed the dependence on processing condition($O_2$/Ar ratio, substrate temp, annealing temp...).

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