• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.205.1-205.1
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• 2016

핵융합로에서 고온, 고에너지 플라즈마에 장기간 노출되는 플라즈마 대면재는 고속 입자와 중성자에 의한 열화 및 침식과 높은 열부하를 견뎌야 하므로 높은 수준의 재료기술과 표면 코팅기술의 개발이 필요하다. 텅스텐은 용융점이 높고, 스퍼터링(Sputtering) 현상이 적으며, Tritium 재침적 현상이 제한되는 우수한 특성 때문에 핵융합로 대면제에 적용하기 위한 다양한 연구가 진행되고 있다. 본 연구에서는 VPS(vacuum plasma spray) 장비를 이용하여 5, 10, $25{\mu}m$ 크기의 텅스텐 분말을FM(ferritic-martenitic) steel 기판에 용사 코팅하였다. 입자 크기를 달리하여 제작한 3종의 시편은 시편 전후 두께 및 무게 변화, 현미경이미지, 비커스 경도, 3D 표면 형상, XRD를 이용하여 코팅층의 특성을 평가하였으며, $10{\mu}m$ 크기의 텅스텐 분말 시편이 가장 우수한 특성을 나타내는 것을 확인하였다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.796-799
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• 2004

The effects of forming presure, organic binder content and moisture on flexural strength were investigated. As moisture content increased in the granules during compaction, the density and strength of the green body were increased. Green strengths were found to improve more strongly with increasing forming pressure in the case of using the granules of higher organic content. The sintered strength was the highest with the organic content of 0.2wt％ under all forming pressures.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1995년도 추계학술대회 논문집
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• pp.48-52
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• 1995

Chipping is an unavidable phenomean in the slot grinding process of hard and brittle materials. However,it should be reduced for the improvement of surface integrity in the manufacture of optical and semiconductor components. Electrolytic In-process Dressing (ELID) technique for metal bonded superabrasive grinding wheel has been developed for mirror surface grinding of hard and brittle materials. Electrically dressed wheel surface has sharply exposed abrasives and results in lower grinding force, higher grinding efficiency in grinding. The paper deals with a newly developed method for slot grinding using ELID and was implemented to improve grooved surface quality and decreases chipping size on the edge of the groove. As a result, we accomplished shipping-free grooves and obtained the clear ground sufaces on glass and tungsten carbide.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.883-886
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• 2001

The mechanical properties such as the Young's modulus, damping ratio, vibration mode and hardness of the disk materials heat-treated under various conditions are measured, and the relations between there properties and the cutting characteristics such as early tip fracture are examined. The results obtained from this study are as follows. The circular saw with the V-Cr added disk has higher young's modulus and damping ratio than the saw with STC5 disk, preventing the early fracture of tungsten carbide due to the above properties. The circular saw with the disk which is subjected to the heat treatment at the quenching temperature of $830^{\circ}C$ and at the temperature of $550^{\circ}C$ have the best tool life and surface roughness.

• 한국분말재료학회지
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• 제1권1호
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• pp.79-84
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• 1994

The mechanism of activated sintering of tungsten powder was discussed in terms of diffusion and segregation of activator atoms at W grain boundaries. Shrinkage behaviours of W-0.2wt.% Ni, W-0.2wt.% Cu or pure W powder compacts during sintering at low temperatures of 900~ $1200^{\circ}C$ were investigated. It was found that the Cu additive inhibits sintering process causing lower densification than pure W compact while remarkable shrinkage occurred in the Ni added W powder. Such contrary effect was explained by comparing self diffusion processes along Ni or Cu segregated W boundaries in which Ni segregants enhance but Cu atoms retard the migration of W atoms at W boundaries.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.288-288
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• 2012

In this study, we investigated that the resistance switching characteristics of W-doped NbOx films with increasing W doping concentration. The W-doped NbOx based ReRAM devices with a TiN/W-doped NbOx/Pt/Ti/SiO2 were fabricated on Si substrates. The 50 nm thick W-doped NbOx films were deposited by reactive dc magnetron co-sputtering at $400^{\circ}C$ and oxygen partial pressure of 35%. Micro-structure of W-doped NbOx films and atomic concentration were investigated by XRD, TEM and XPS, respectively. The W-doped NbOx films showed set/reset resistance switching behavior at various W doping concentrations. The process voltage of set/reset is decreased and whereas the initial current level is increased with increasing W doping concentration in NbOx films. The change of resistance switching behavior depending on doping concentration was discussed in terms of concentration of metallic tungsten of oxygen of W-doped NbOx.

• 한국표면공학회지
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• 제51권3호
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• pp.179-184
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• 2018

In this study, Ni and tungsten carbide (WC) nanoparticles are simultaneously synthesized with the mesoporous carbon nanoparticles (CNP) using a solution plasma processing (SPP) in the benzene. The Ni and WC nanoparticles were formed through the sputtering effect of electrodes during discharge, and mean time CNP were formed through reduction reaction. TEM observation showed that loaded Ni and WC nanoparticles were evenly dispersed on the CNP. The results of electrochemical analysis demonstrated that an introduction of Ni nanoparticles promoted to improve catalytic activity for oxygen reduction reaction (ORR). Moreover, Ni-WC/CNP lead to fast electron transfer process compared to that of WC/CNP. Therefore, the inexpensive Ni-WC/CNP might be a promising as catalytic material for cathodes in fuel cell applications.

• 한국전기전자재료학회논문지
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• 제19권11호
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• pp.1050-1054
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• 2006

There have been intensive and continuous efforts in the field of DLC coating process because of their feature, like high hardness, high elasticity, abrasion resistance and chemical stability and have been applied widely the industrial areas. In this research, optimal grinding condition was investigated using Microlens Process Machine for the development of aspheric glass lens which is to be used for mobile phone module with 3 mega pixel and 2.5X optical zoom, and tungsten carbide(WC) mold cote was manufactured using high performance ultra precision machining and the effects of DLC coating on the form accuracy(PV) and surface roughness(Ra) of WC mold core was evaluated.

• 전자공학회논문지A
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• 제30A권12호
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• pp.69-76
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• 1993

The statistical methodology using RSM (response surface method) was used too ptimize the deposition conditions of selective CVD tungsten process for improving the deposition rate and the adhesion property. Temperature, flow rate of SiH$_4$ and WF$_6$ and H$_2$ and Ar carrier gases were chosen for the deposition variables and process characteristics due to carrier gas were intensively investigated. It was observed that temperature was the main factor influencingthe deposition rate in the case of H$_2$ carrier gas while the reactant ratio, $SiH_{4}/WF_{6}$, had the principal effect on the deposition rate in the case of Ar carrier gas. The increased deposition rate and the good adhesion to Si were obtained under Ar carrier gas compared to H$_2$ carrier gas. The optimum conditions for deposition rate and antipeeling property were found to be the temperature range of 300~32$0^{\circ}C$ and the reactant ratio, $SiH_{4}/WF_{6}$, of 0.5~0.6.

• Transactions on Electrical and Electronic Materials
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• 제7권3호
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• pp.108-111
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• 2006

The oxidizer-induced corrosion state and microstructure of surface passive metal-oxide layer greatly influenced on the removal rate of tungsten film according to the slurry chemical composition of different mixed oxidizers. In this paper, the actual polishing mechanism and pH-potential equilibrium diagram obtained from potentiodynamic polarization curve were electrochemically compared. An electrochemical corrosion effect implies that slurries with the highest removal rate (RR) have the high dissolution rate.