• ETRI Journal
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• v.7 no.4
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• pp.11-14
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• 1985

A polysilicon self-aligned bipolar n-p-n transistor structure is described, which can be used in high speed and high packing density LSI circuits The emitter of this transistor is separated less than $0.4\mum$ with base contact by polysilicon self-align technology. Through all the process, the active region of this device is not damaged. therefore a high performance device is obtained. Using the transistor with $3.0\mum$ design rules, a CML ring oscillator has per-gate minimum propagation delay time of 400 ps at 2.7 mW power consumption condition.

• Proceedings of the KIEE Conference
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• 2003.10b
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• pp.166-170
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• 2003

This paper presents the TTFC(Two Transistor Forward Converter) using Synchronous Rectifier of Compulsory Control-driver. The two transistor forward circuit is used to decrease voltage stress of primary side and the synchronous rectifier is used to reduce current stress of secondary side. Previous synchronous rectifier's MOSFET of TTFC have long dead time This paper presents synchronous rectifier of compulsory control-driver for minimized dead time. This paper compared with diode rectifier, self-driven synchronous rectifier and compulsory control-driver synchronous rectifier of TTFC. The principle of operation, feature and design considerations are illustrated and verified through the experiment with a 200W 100kHz MOSFET based experimental circuit.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1308-1311
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• 2007

Leakage current produced by backside illumination on bottom-gated amorphous silicon thin film transistor has been investigated. The experimental results show that the leakage current of bottomgated structure is significantly dependent on the shape of amorphous silicon pattern. A proper design of amorphous silicon pattern has been suggested in viewpoint of reducing the leakage current as well as mass production.

• ETRI Journal
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• v.25 no.5
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• pp.288-296
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• 2003

In this study, we present a 260k color TFT LCD driver chip set that consumes only 5 mW in the module, which has exceptionally low power consumption. To reduce power consumption, we used many power-lowering schemes in the logic and analog design. A driver IC for LCDs has a built-in graphic SRAM. Besides write and read operations, the graphic SRAM has a scan operation that is similar to the read operation of one row-line, which is displayed on one line in an LCD panel. Currently, the embedded graphic memory is implemented by an 8-transistor leaf cell and a 6-transistor leaf cell. We propose an efficient scan method for a 6-transistor embedded graphic memory that is greatly improved over previous methods. The proposed method is implemented in a 0.22 ${\mu}m$ process. We demonstrate the efficacy of the proposed method by measuring and comparing the current consumption of chips with and without our proposed scheme.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.2
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• pp.63-75
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• 1993

As the CMOS technology becomes the most dominant circuit realization method, the cost problem for the test which includes both the transistor-level FET stuck-on and stuck-off faults and the gatelevel stuck-at faults becomes more and more serious. In accordance, this paper proposes a test set and its generation algorithm, which handles both the transistor-level faults and the gate-level faults, thus can unify the test steps during the IC design and fabrication procedure. This algorithm uses only the logic equation of the given logic function as the input resource without referring the transistor of gate circuit. Also, the resultant test set from this algorithm can improve in both the complexity of the generation algorithm and the time to apply the test as well as unify the test steps in comparing the existing methods.

• Proceedings of the IEEK Conference
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• 1999.11a
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• pp.251-254
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• 1999

In this paper V-I(Voltage to Current) converter using the series composite transistor is presented. Due to the series composite transistor employs operating in the saturation region and triode region, the proposed circuit has wide input range at low voltage. The designed V-I converter has simulated by HSPICE using 0.6${\mu}{\textrm}{m}$ n-well CMOS process with a $\pm$2.5V supply voltage. Simulation results show that the THD can be 0.81% at 4 $V_{p-p}$ differential input voltage when frequency of input signal is 10MHz.z.

• JSTS:Journal of Semiconductor Technology and Science
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• v.3 no.3
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• pp.139-144
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• 2003

We report the results of extensive mixed mode simulations and theoretical analysis to quantify the contribution of the edge direct tunneling (EDT) current on the total gate leakage current of 80nm NMOSFET with SiO2 gate dielectric. It is shown that EDT has a profound impact on basic analog circuit building blocks such as sample-hold (S/H) circuit and the current mirror circuit. A transistor design methodology with zero gate-source/drain overlap is proposed to mitigate the EDT effect. This results in lower voltage droop in S/H application and better current matching in current mirror application. It is demonstrated that decreasing the overlap length also improves the basic analog circuit performance metrics of the transistor. The transistor with zero gate-source/drain overlap, results in better transconductance, input resistance, output resistance, intrinsic gain and unity gain transition frequency.

• Journal of the Semiconductor & Display Technology
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• v.3 no.4
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• pp.29-32
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• 2004

Fully depleted Silicon-on-Insulator (FD-SOI) devices lead to better electrical characteristics than bulk CMOS devices. However, the presence of a thin top silicon layer and a buried SiO2 layer causes self-heating due to the low thermal conductivity of the buried oxide. The electrical characteristics of FDSOI devices strongly depend on the path of heat dissipation. In this paper, we present a new three-dimensional (3-D) analysis technique for the self-heating effect of the finger-type and bar-type transistors. The 3-D analysis results show that the drain current of the finger-type transistor is 14.7% smaller than that of the bar-type transistor due to the 3-D self-heating effect. We have learned that the rate of current degradation increases significantly when the width of a transistor is smaller that a critical value in a finger-type layout. The current degradation fro the 3-D structures of the finger-type and bar-type transistors is investigated and the design issues are also discussed.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.11
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• pp.1121-1126
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• 2003

In this paper we show impulse generator which is important component in UWB communication. There is two steps to generate monocycle impulse. In first step, Gaussian pulse was made by operation of transistor switching and operation time of transistor switching. The second step the high pass filter change from Gaussian to Monocycle impulse. The result of this impulse generator is impulse whose pulse width is 0,9 ns in time domain and amplitude is +/-250 ㎷.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.28 no.3A
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• pp.185-191
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• 2003

In this paper, we propose two CMOS composite transistors with an improved operating region by reducing the threshold voltage. The proposed composite transistorⅠand transistor Ⅱ employ a P-type folded composite transistor and a composite diode in order to decrease the threshold voltage, respectively. The limitation of the operating region of these transistors by current source is described. All circuits are simulated by Hsipice using 0.25㎛ n-well process with 2.5V supply voltage.