• Journal of the Korean Graphic Arts Communication Society
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• v.20 no.1
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• pp.102-112
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• 2002

Cathode ray tubes (CRT) are the most common electronic display in use in information technology. The CRT consists of an electron gun, electrostatic or magnetic fields to direct the electron beam, and a phosphor screen. When the electron beam strikes the phosphor screen, the phosphor generates light. The phosphor screen has formed by precipitation method, electro-forming and centrifuge method. The high quality product was achieved by electro-forming or centrifuge method. Now applying method is electro-forming used with phosphor and Eh(isopropyl alcohol). Now applying method has been much consumption of raw-material, dirty working environment, dangerous fire and require of high cost. New method to form phosphor surface of monochrome is required to improve this matter. This study was developed novel method to form the phosphor surface by heat-transfer method. This method have advantages of simple process, automatization, clean environment, saving raw material and saving running-cost.

• Tribology and Lubricants
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• v.32 no.3
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• pp.75-81
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• 2016

Future electronics such as electronic paper and foldable cellphone are required to be flexible and transparent and should have a high performance. In order to fabricate the flexible electronics using flexibility transfer process, techniques for transferring various devices from rigid substrate onto flexible substrate by elastomeric stamp, have been developed. Adhesion between the elastomeric stamp and various devices is crucial for successful transfer process. The adhesion can be controlled by the thickness of the stamp, separation velocity, contact load, and stamp surface treatment. In this study, we fabricated the bump shape stamp consisting of a UV-curable polymer and investigated the effects of curing condition, separation velocity, and contact load on the adhesion characteristics of bumps. The bumps with hemispherical shape were fabricated using a dispensing process, which is one of the ink-jet printing techniques. Curing conditions of the bumps were controlled by the amount of UV irradiation energy. The adhesion characteristics of bumps are evaluated by adhesion test. The results show that the pull-off forces of bumps were increased and decreased as UV irradiation energy increased. For UV irradiation energies of 300 and 500 mJ/cm², the pull-off forces were increased as the separation velocity increased. The pull-off forces also increased with the increase of contact load. In the case of UV irradiation energy above 600 mJ/cm², however, the pull-off forces were not changed. Therefore, we believe that the bump shape stamp can be applied to roll-based transfer process and selective transfer process as an elastomeric stamp.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.6
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• pp.477-481
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• 2014

Flexible electronics have been to the fore because it is believed that flexibility can add incredible value such as light weight and mobility into the existing electronic devices and create new markets of large-area and low-cost electronics such as wearable eletronics in near future. Offset printing processes are regarded as major candidates for manufacturing the flexible electronics because they can provide the patterning resolution of micron-size effectively in large-area. In view of mechanics, the most important viewpoint in offset printing is how to achieve the synchronized movement of two contact surfaces in order to prevent slip between two contact surfaces and distortion of the blanket surface during ink transfer so that the high-resolution and good-overlay patterns can be printed. In this paper, a novel low-cost measurement method of the synchronization error using the motor control output signals is proposed and the compensation method is presented to minimize the synchronization error.

• 한국신재생에너지학회:학술대회논문집
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• 2006.06a
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• pp.110-112
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• 2006

Membrane electrode assembly (MEA) for polymer electrolyte fuel cell (PEFC) are commonly prepared in the research laboratory by spraying, screen-printing and brushing catalyst slurry onto membrane or other support material like carbon paper or polyimide film in a batch style. These hand applications of the catalyst slurry are painstaking process with respect to precision of catalyst loading and reproducibility. It has been generally mentioned that the adoption of continuous process is very helpful to develop the reliable product. In the present work, we report the results of using continuous type coater with doctor-blade to coat catalyst slurry for preparing the MEA catalyst layers In a faster and highly reproducible fashion. We show that while expectedly faster than batch style, the machine coater requires the use of slurry of appropriate composition and a properly selected transfer decal material in order to achieve superior MEA plat lnw loading reproducibility. To make highly viscous catalyst slurry that is imperative for using coater, we use 40wt.% Nafion solution and minimize the content of organic solvent. And the choice of proper high surface area catalyst is important in the viewpoint of making well-dispersed slurry. After catalyst coating onto the support material, we transferred the catalyst layer to both sides of Nafion membrane by hot-pressing In this case, the degree of transfer was Influenced by hot-pressing condition including temperature, pressure, and time. To compare the transferring ability, we compared so many films and detaching papers. And among the support, polyethylene terephthalate(PET) film shows the prominent result.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.8
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• pp.73-80
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• 2020

The 3D printing of electronics has been a major application topics in additive manufacturing technology for a decade. In this paper, wireless power transfer (WPT) technology for 3D electronics is studied to supply electric power to its inner circuit. The principle of WPT is that electric power is induced at the recipient antenna coil under an alternating magnetic field. Importantly, the efficiency of WPT does rely on the design of the antenna coil shape. In 3D printed electronics, a flat antenna that can be placed on the printed plane within a layer of a 3D printed part is used, but provided a different antenna response compared to that of a conventional PCB antenna for NFC. This paper investigates the WPT response characteristics of a WPT antenna for 3D printed electronics associated with changes in its design elements. The effects of changing the antenna curvature and the gap between the wires were analyzed through experimental tests.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.31 no.7
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• pp.510-514
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• 2018

This study discusses and demonstrates the structural stability of highly ordered Pt patterns formed on a transparent and flexible substrate through the process of nanotransfer printing (nTP). Bending tests comprising approximately 1,000 cycles were conducted for observing Pt line patterns with a width of $1{\mu}m$ formed along the direction of the horizontal (x-axis) and vertical (y-axis) axes ($15mm{\times}15mm$); and adhesion tests were performed with an ultrasonicator for a period greater than ten minutes, to analyze the Pt crossbar patterns. The durability of both types of patterns was systematically analyzed by employing various microscopes. The results show that the Pt line and Pt crossbar patterns obtained through nTP are structurally stable and do not exhibit any cracks, breaks, or damages. These results corroborate that nTP is a promising nanotechnology that can be applied to flexible electronic devices. Furthermore, the multiple patterns obtained through nTP can improve the working performance of flexible devices by providing excellent structural stability.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.7
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• pp.270-276
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• 2020

3D printing is an additive manufacturing technology that can produce complex shapes in a single process for a range of materials, such as polymers, ceramics, and metals. Recent 3D printing technology has developed to a level that enables the mass-production through an improvement of the printing speed and the continuous development of applicable materials. In this study, 3D printing technology using a laser was applied to manufacture a heat exchanger for an air compressor in a railway vehicle. First, the optimal design of the heat exchanger was carried out by focusing on weight reduction and compactness as a shape suitable for 3D printing. Based on the design derived, heat exchanger prototypes were made of AlSi10Mg alloy material by applying the SLM technique. Moreover, the manufactured prototypes were attached to an existing air compressor, and the heat exchange performance of the compressed air was tested. The test results of the 3D printed prototypes showed a heat exchange performance of approximately 80% and 85% at low and high-pressure, respectively, compared to the existing heat exchanger. From the 𝓔-NTU method results with an external cooling air condition similar to that of the existing heat exchanger, the calculated heat transfer amount of 3D printed parts showed similar performance compared to the existing heat exchanger. As a result, the 3D printed heat exchanger is lightweight with good performance.

• Journal of the Korean Graphic Arts Communication Society
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• v.24 no.2
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• pp.61-68
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• 2006

Rubber rollers in off-set printing process are one of the most important factor, transferring the ink and water to the plate. Each different roughness of roller surface and different rubber compounds could effect to ink transparency and printability. Three different rubber compounds (NBR, EPDM, PU) and each different roughness of roller surface would show us different result of ink transparency and density of actual printing result. There might be a differences from actual printing result not only the amount of transferred ink, but there is also some other point we should check it out. According to the result of this studies, we found that different rubber compounds and their surface roughness directly effect to the rate of ink transfer. It also shows that the amount of transferred ink is not even and stable amount what we expect to get optimum printability. To reach a targeted printability with rollers, firstly it is necessary to choose correct rubber compounds with certain purpose and the roughness of roller surface has to be as smooth as less than $5{\mu}m{\sim}7{\mu}m$.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.473-473
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• 2011

In recent years, organic thin film transistors OTFTs based on conductive-conjugated molecules have received significant attention. We report a fabrication of organic single crystal nanowires that made on Si substrates by liquid bridge-mediated nanotransfer molding (LB-nTM) with polyurethane acrylate (PUA) mold. LB-nTM is based on the direct transfer of various materials from a stamp to a substrate via a liquid bridge between them. In liquid bridge-transfer process, the liquid layer serves as an adhesion layer to provide good conformal contact and form covalent bonding between the organic single crystal nanowire and the Si substrate. Pentacene is the most promising organic semiconductors. However pentacene has insolubility in organic solvents so pentacene OTFTs can be achieved with vacuum evaporation system. However 6, 13-bis (triisopropylsilylethynyl) (TIPS) pentacene has high solubility in organic solvent that reported by Anthony et al. Furthermore, the substituted rings in TIPS-pentacene interrupt the herringbone packing, which leads to cofacial ${\pi}-{\pi}$ stacking. The patterned TIPS-Pentacene single crystal nanowires have been investigated by Atomic force microscopy (AFM), Transmission Electron Microscopy (TEM), X-Ray Diffraction (XRD), Scanning Electron Microscopy (SEM) and electrical properties.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.