• Title/Summary/Keyword: transfer assembly

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A Study on the Improvement Plan of the National Assembly Records Management System: Parliament Activity Records (국회기록물 관리 체제 개선 방안 연구: 국회 의정활동 기록물을 중심으로)

  • Choi, Hye Young;Lee, Seung-Il
    • Journal of Korean Society of Archives and Records Management
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    • v.19 no.3
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    • pp.97-121
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    • 2019
  • This study aims to provide alternative strategies by analyzing the current records management system of the National Assembly. The study also defines the concept of parliamentary activity records based on the analysis of the parliamentary organization and its work, and checks the status of such system through the National Assembly Archives and the Constitutional Memorial Hall. In addition, the study derives institutional problems of the National Assembly records management structure by examining the current law. Therefore, the study proposes the Act on the Management of National Assembly Records, referred to as the Special Act on the Records Management Act, as an improvement measure. Furthermore, the Act aims to establish an intermediate records management system in the National Assembly and transfer the collection function of the constitutional memorial to the National Assembly Archives for the integrated management of parliamentary activities records.

A Subchannel Analysis Code for LMR Core Subassembly Thermal Hydraulic Analysis: The MATRA-LMR

  • Lim, Hyun-Jin;Kim, Young-Gyun;Kim, Yeong-Il;Oh, Se-Kee
    • Journal of Energy Engineering
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    • v.12 no.4
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    • pp.281-288
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    • 2003
  • The MATRA-LMR code has been developed based on a subchannel analysis method for LMR (Liquid Metal Reactor) core subassembly thermal hydraulic design and analysis. The code was improved to allow a seven assembly calculation and can account for inter-assembly heat transfer based on a lumped parameter model. This paper describes the main modifications and improvements of the code and shows reference calculation results which compared single assembly calculation with seven assembly calculation cased for driver and blanket subassemblies of the KALIMER 150 MWe breakeven conceptual design core. KAL- IMER is a pool-type sodium cooled reactor with a thermal output of 392.0 MWth, which have inherently safe, environmentally friendly, proliferation-resistant and economically viable reactor concepts.

A Study on Flexible Pallet Design for Assembly Rationalization (조립합리화를 위한 유연성 있는 Pallet 설계에 관한 연구)

  • Mok, Hak-Soo;Lee, Jae-Man;Yang, Tae-Il
    • Journal of the Korean Society for Precision Engineering
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    • v.16 no.1 s.94
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    • pp.75-86
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    • 1999
  • In the assembly system, a pallet plays an important role of transfer and storage. As products become various, many different pallets are also necessary. Since some of them are redundant, a design of pallet with high flexibility is important. This paper suggests design alternatives, in designing pallets with high flexibility. The purpose of this study is to rationalize assembly process of mid-small size products. Every pallet has suitability values depending on characteristic factors of a product, and this value is determined by using AHP (Analytic Hierarchy Process) technique. As the characteristic factors of a product are changed, the suitability value is also changed. Design alternatives can be found by tracing change of the suitability value, which are based on correlation between the characteristic factors of a product and a pallet element.

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Design of a knowledge-based controller for job scheduling in assembly (조립 작업에서의 생산계획 수립을 위한 지식베이스형 제어기의 설계)

  • 김성수;서기성;우광방
    • 제어로봇시스템학회:학술대회논문집
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    • 1990.10a
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    • pp.514-518
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    • 1990
  • This paper describes an experimental Knowledge-Based Control System, named KBCS, for manufacturing and assembly. The KBCS of five parts and function : data-base, knowledge acquisition, optimization, and graphic monitoring. The KBCS is utilized for a FMS which is of five machine centers and automatic assembly lines. Each machine can perform almost all manufacturing functions which some difference in efficiency. Buffers store temporarily the incoming components and the outing components. Parts arrive at assembly lines after many steps of manufacturing, and the transfer path and time are determined by procedural knowledge of control systems. Nine different incoming components are set up. The total control system is expected to perform four algorithms, timing algorithm ,sequencing algorithm, penalty algorithm, and cart algorithm. The construction of controller require basic components of manufacturing systems in which knowledges are formulated on the base of the results and the repeated simulation of KBCS with graphic monitoring system. Simulation results by KBCS are compared with those by the other rules of manufacturing.

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Large Scale Directed Assembly of SWNTs and Nanoparticles for Electronics and Biotechnology

  • Busnaina, Ahmed;Smith, W.L.
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2011.10a
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    • pp.9-9
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    • 2011
  • The transfer of nano-science accomplishments into technology is severely hindered by a lack of understanding of barriers to nanoscale manufacturing. The NSF Center for High-rate Nanomanufacturing (CHN) is developing tools and processes to conduct fast massive directed assembly of nanoscale elements by controlling the forces required to assemble, detach, and transfer nanoelements at high rates and over large areas. The center has developed templates with nanofeatures to direct the assembly of carbon nanotubes and nanoparticles (down to 10 nm) into nanoscale trenches in a short time (in seconds) and over a large area (measured in inches). The center has demonstrated that nanotemplates can be used to pattern conducting polymers and that the patterned polymer can be transferred onto a second polymer substrate. Recently, a fast and highly scalable process for fabricating interconnects from CMOS and other types of interconnects has been developed using metallic nanoparticles. The particles are precisely assembled into the vias from the suspension and then fused in a room temperature process creating nanoscale interconnect. The center has many applications where the technology has been demonstrated. For example, the nonvolatile memory switches using (SWNTs) or molecules assembled on a wafer level. A new biosensor chip (0.02 $mm^2$) capable of detecting multiple biomarkers simultaneously and can be in vitro and in vivo with a detection limit that's 200 times lower than current technology. The center has developed the fundamental science and engineering platform necessary to manufacture a wide array of applications ranging from electronics, energy, and materials to biotechnology.

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Heat Transfer from a Fan-Aluminum Foam Heat Sink Assembly for CPU Cooling (CPU 냉각을 위한 홴-발포알루미늄 방열기 조합의 열전달 특성)

  • Kim, Seo-Yeong;Lee, Myeong-Ho;Baek, Jin-Uk;Lee, Gwan-Su
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.26 no.3
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    • pp.417-422
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    • 2002
  • The experiments have been carried out to evaluate the cooling performance of a fan-aluminum foam heat sink assembly in comparison with a conventional CPU cooler. In terms of the dimensionless surface temperature of the heater, the cooling performance of the aluminum foam heat sink is similar to that of the conventional one with much reduced weight. The optimum fin height is found to be strongly dependent on the fin height of the heat sink and flow characteristics of the cooling fan.

Sensitivity Analysis on the Thermal Response of Electronic Components during Infrared Reflow Soldering (적외선 리플로 솔더링시 전자부품의 열적반응 민감도 분석)

  • 손영석;신지영
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.14 no.1
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    • pp.1-9
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    • 2002
  • The thermal response of electronic components during infrared reflow soldering is studied by a two-dimensional numerical model. The convective, radiative and conduction heat transfer within the reflow oven as well as within the card assembly are simulated. Parametric study is also performed to determine the thermal response of electronic components to various conditions such as conveyor velocities, exhaust velocities and emissivities. The results of this study can be used in selecting the oven operating conditions to ensure proper solder melting and minimization of thermally induced card assembly stresses.

An Analysis on 3-Dimensional Temperature Distribution of Jet Vanes for a Thrust Vector Control (추력방향조종용 제트베인의 3차원 온도분포 해석)

  • Hwang, Ki-Young
    • Proceedings of the Korean Society of Propulsion Engineers Conference
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    • 2011.11a
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    • pp.283-291
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    • 2011
  • A computational investigation has been carried out to study the heat transfer characteristics of jet vane assembly used for the thrust vector control(TVC) of a vertical launch motor. In this study, the coefficients of convective heat transfer on the jet vane are calculated using the solutions of thermal boundary-layer equation and several semi-empirical equations. The calculation of 3-dimensional temperature distribution for the jet vane assembly was performed using the softwares called PATRAN and ABAQUS. The accuracy of the present numerical method is verified by comparing with the measured and calculated temperatures within jet vane shaft. The temporal variation of jet vane temperatures for three deflection angles(0o, 12.5o, 25o) was discussed.

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