• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2008년도 추계학술대회 초록집
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• pp.15-16
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• 2008

In case manufacturing COF, through hole should be made to be used for a pathway connecting the conductive layers of its both faces. In case Cu-plating inside of through hole with electroless plating way, contact between Cu and PI film gets bad to be fell apart from PI by the impact of applying to the electric devices. Therefore, after sputtering is applying on inner through hole, then a method to perform electroplating process. In this study, after changing sputtering condition to manufacture FCCL, we looked the changeability of the upper PI and inner hole Cu layers. Making use of RF Magnetron sputtering equipment, we coated Cu thin film and Cu-plated on it through electroplating. After cold-mounting the completed FCCL, we examined hole section through an optical microscope. From the result of test, with parameters deposition pressure and deposition time, both the thickness of the hole plated layer and PI plated upper layer increased at regular rate, increasing the thickness of Cu sputter layer. However, from the result of test in increasing RF-power, we could know the increment rate of hole plated layer is considerably greater than that of PI plated upper layer. Therefore, we finally acquired good result; if you want only to increase the plated layer of inner hole, it's much better to increase RF-power.

• 한국전자파학회논문지
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• 제21권2호
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• pp.188-193
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• 2010

본 논문은 관통형 비아와 전송 선로 사이의 임피던스 불연속과 P/G(Power/Ground) 면 사이에서 발생되는 공진으로 인한 클록 신호 응답 성능 저하가 관통형 비아(through-hole via)가 있는 4층 PCB(Printed Circuit Boards)의 SI(Signal Integrity) 성능에 악영향을 미치는 것을 이론적으로 분석하였다. 비아 구조의 집중소자 모델링을 이용한 반사 전압 계산과 TDR(Time Domain Reflector) 시뮬레이션 결과 비교로 관통형 비아와 전송 선로 사이의 임피던스 불연속 최소화 시킬 수 있고, 관통형 비아 위치를 이용한 P/G면 공진 상쇄의 시뮬레이션 결과로 클록 신호 응답 성능을 향상시킬 수 있음을 확인하였다.

• 한국자동차공학회논문집
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• 제9권6호
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• pp.201-206
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• 2001

The hole-drilling method makes a little hole through the metal surface that has residual stress and measures the relieved stress with a strain gage. It is used widely in measuring the residual stress of surfaces. In this method, the inclined hole is one of the source of error. This paper presents a finite element analysis of influence of the inclined hole for the uniaxial residual stress field. The stress differences between measured and applied residual stress increase proportionally to inclined angle of the hole. The correction equations which easily obtain the residual stress taking account of the inclined angle and direction are derived. The measurement error of stress due to the inclined hole can be reduced to around 1% through this study.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년 추계학술발표대회 개요집
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• pp.190-192
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• 2006

The 3-dimensional(3D) chip stacking technology is one of the leading technologies to realize a high density and high performance system in package(SIP). It could be found that it is the advanced process of through-hole via formation with the minimum damaged on the Si-wafer. Laser ablation is very effective method to penetrate through hole on the Si-wafer because it has the advantage that formed under $100{\mu}m$ diameter through-hole via without using a mask. In this paper, we studied the optimum method for a formation of through-hole via using femto-second laser heat sources. Furthermore, the processing parameters of the specimens were several conditions such as power of output, pulse repetition rate as well as irradiation method and time. And also the through-hole via form could be investigated and analyzed by microscope and analyzer.

• 한국자동차공학회논문집
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• 제16권3호
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• pp.73-79
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• 2008

Atomization speed of diesel fuel injected from 8-hole nozzle is faster than that of 7-hole nozzle because the hole diameter of 8-hole nozzle is smaller than that of 7-hole nozzle. But both insufficient distance between the fuel sprays and short penetration of injected sprays through 8-hole nozzle hole cause many harmful effects on combustion. In this study, we installed the 8-hole injectors to diesel 2.0 liter class engine, and optimized in-cylinder swirl and penetration via selecting and matching proper cylinder head and combustion bowl. Through this process, we found out the performance and emission potential of 8-hole nozzle installed engine are better than those of 7-hole nozzle installed one.

• Journal of Mechanical Science and Technology
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• 제16권11호
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• pp.1359-1366
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• 2002

The measurement of residual stresses by the hole-drilling method has been used to evaluate residual stresses in structural members. In this method, eccentricity can usually occur between the hole center and rosette gage center. In this study, we obtained the magnitude of the error due to eccentricity of a hole through the finite element analysis. To predict the magnitude of the error due to eccentricity of a hole in the biaxial residual stress field, it could be learned through the back propagation neural network. The prediction results of the error using the trained neural network showed good agreement with FE analyzed results.

• 마이크로전자및패키징학회지
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• 제15권2호
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• pp.29-36
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• 2008

본 연구에서는 MEMS 소자의 직접화 및 소형화에 필수적인 through-wafer via interconnect의 신뢰성 문제를 연구하였다. 이를 위하여 Au-Sn eutectic 접합 기술을 이용하여 밀봉(hermetic) 접합을 한 웨이퍼 레벨 MEMS 패키지 소자를 개발하였으며, 전기도금법을 이용하여 수직 through-hole via 내부를 구리로 충전함으로써 전기적 연결을 시도하였다. 제작된 MEMS 패키지의 크기는 $1mm{\times}1mm{\times}700{\mu}m$이었다. 제작된 MEMS패키지의 신뢰성 수행 결과 비아 홀(via hole)주변의 크랙 발생으로 패키지의 파손이 발생하였다. 구리 through-via의 기계적 신뢰성에 영향을 줄 수 있는 여러 인자들에 대해서 수치적 해석 및 실험적인 연구를 수행하였다. 분석 결과 via hole의 크랙을 발생시킬 수 있는 파괴 인자로서 열팽창 계수의 차이, 비아 홀의 형상, 구리 확산 현상 등이 있었다. 궁극적으로 구리 확산을 방지하고, 전기도금 공정의 접합력을 향상시킬 수 있는 새로운 공정 방식을 적용함으로써 비아 홀 크랙으로 인한 패키지의 파괴를 개선할 수 있었다.

• 한국생산제조학회지
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• 제6권2호
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• pp.34-41
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• 1997

The objective of this study is to investigate experimentally the frequency characteristics of the hole tones generated by a circular jet of low speed impinging on a plate with a round hole. The experimental results about the sound spectrum and the time wave of the hole tone are presented and discussed in relation with the hole type, the jet velocity and the distance of the nozzle-to-plate with a round hole. From the sound spectrum and time wave measurements, it is found that the hole tone is generated not only by an interaction of convected vortices with a round hole but also by a series of vortex shedding from jets passing through a hole. The hole tones generated by a feedback mechanism consist of many frequency stages and also have a hysteresis phenomenon like an edge tone. But the hole tones generated by a series of vortex shedding have nothing with the stage characteristics. The frequencies of hole tones are influenced by the jet velocity, the distance of the nozzle-to-plate with a round hole and the hole type.

• 대한전자공학회논문지SD
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• 제47권12호
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• pp.55-67
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• 2010

고다층 배선 기판에 형성된 개방 스터브(open stub)를 제거한 후면드릴가공홀(Back-Drilled-Hole, BDH)과 일반적인 구조인 관통홀(Plated-Through-Hole, PTH) 구조의 전기적 특성에 대한 분석을 하였으며, 고속 선호를 부품 실장면으로부터 내층의 스트립라인으로 전송하기 위해 비아홀의 급전 길이가 가장 긴 전송층을 선택하였다. 10 GHz의 광대역 주파수 내에서 실험계획법(DOE, design of experiment)을 적용하여 비아홀 구조 내에 외층과 급전층 사이의 비아홀의 길이, 접지층에 형성된 천공(anti-pad)의 크기와 급전층에 형성된 패드 (pad)의 크기가 최대 반사 손실 반전력 주파수와 삽입 손실에 미치는 영향을 분석하였다. 이로 부터 거시적 모델(macro model)을 위한 회귀 실험식을 추출하여 실험 결과와 비교 평가하였고, 실험 영역 외에서도 측정 결과와 5% 이내의 오차를 보이고 있음을 확인하였다.

• Nuclear Engineering and Technology
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• 제55권2호
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• pp.780-791
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• 2023

To study oscillation characteristic of steam and non-condensable gas direct contact condensation through multi-hole sparger at low mass flux, a series of experiments of pure steam and mixture gas condensation have been carried out under the conditions of steam mass flux of 20-120kg/m²s, water temperature of 20-95 ℃ and mass fraction of non-condensable gas of 0-5%. The regime map of pure steam condensation through multi-hole sparger is divided into steam chugging, separated bubble, aggregated bubble and escaping aggregated bubble. The bubbles behavior of synchronization in the same hole columns and desynchronized excitation between different hole columns can be found. The coalescence effect of mixture bubbles increases with water temperature and non-condensable gas content increasing. Pressure oscillation intensity of pure steam condensation first increases and then decreases with water temperature increasing, and increases with steam mass flux increasing. Pressure oscillation intensity of mixture gas condensation decreases with water temperature and non-condensable gas content increasing, which is significantly weaker than that of pure steam condensation. The oscillation dominant frequency decreases with the rise of water temperature and non-condensable gas content. The correlations for oscillation intensity and dominant frequency respectively are developed in pure steam and mixture gas condensation at low mass flux.