• 제목/요약/키워드: thinner

검색결과 1,062건 처리시간 0.026초

Analysis of the Horizontal Block Mura Defect

  • Mi, Zhang;Jian, Guo;Chunping, Long
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
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    • pp.1597-1599
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    • 2007
  • In TFT-LCD, mura is a defect which degrades the display quality. The resistance difference between gate lines is the main cause of H-Block mura. Two methods could eliminate this defect. A thinner gate layer or gate fan-out pattern decrease mura level. H-Block mura has been reduced after implementing the new schemes.

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휘도 향상에 직접 영향을 미치는 BLU부품에 관한 특성 분석 (Characteristic analysis of BLU parts directly related to improvement of brightness.)

  • 김수용
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 하계학술대회 논문집
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    • pp.1100-1103
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    • 2001
  • (1) By comparing and analyzing the distribution of brightness as domestic lamps and Japanese products go thinner and lighter, we set an effective design standard. (2) By comparing and analyzing the feature, brightness, chromaticity and uniformity of domestic LGPs and Japanese products, early home-manufacturing and stabilization in home-manufacturing are possible. (3) By comparing and analyzing the distribution of brightness as sheets are varied, we can design an ideal sheet composition.

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카아본-페라이트 전파흡수체의 특성 (Characteristics of Carbon-Ferrite Microwave Absorbers)

  • 김동일;정세모;박영우
    • 대한전자공학회논문지
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    • 제26권11호
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    • pp.1721-1727
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    • 1989
  • Carbon-ferrite microwave absorbers were designed experimentally and fabricated trialy, as a result of which the relative frequency bandwith of 7.3 to 8.2% were obtained under the tolerance limits of the reflection coefficients lower than -20 dB, and the matching thickness becomes 1.4 to 1.6mm, which is significantly thinner than that of the conventional ones. Furthermore, attenuation has been founded by measuring the material constants of the microwave absorbers for microwave oven and the results are compared and discussed.

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와이어 방전가공에 의한 북현상에 관한 연구 (A Study on the Hand drum form of Wire-Cut Electric Discharge Machining)

  • 김원일;이재명;강종표
    • 한국안전학회지
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    • 제12권4호
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    • pp.9-14
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    • 1997
  • From the experimental study of wire-cut Electric Discharge Machining for alloyed steel and tungsten carbide, the characteristics such as hand drum form has been observed and evaluated for various conditions. Hand drum form can be improved when gap voltage and spark cycle become smaller, their thickness become thinner, wire tension become larger and number of cutting is done so many times. When wire-cut 60mm thickness tungsten carbide in normal condition, Hand drum form becomes larger due to the low conductivity inducing cobalt composite rising by electrolysis.

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Designing low cost liquid crystal mode for Transflective LCD

  • Baek, Heume-Il;Ham, Mi-Sook;Ha, Kyung-Su;Kim, Dong-Guk;Shin, Hyun-Ho
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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    • pp.556-559
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    • 2002
  • We designed a low cost optical structure of transflective LCD that uses only a half number of retardation films compared to general active matrix transflective LCD. The prototype embodied by this design shows reasonable reflective and transmissive performance. This design would provide us thinner, lighter and cheaper product due to its reduced retardation film structure.

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화염 불안정성이 난류 예혼합 화염의 전파 특성에 미치는 영향에 관한 연구 (Influence of Flame Instabilities on Propagation Characteristics of Stagnating Turbulent Premixed Flames)

  • 권재성;허강열
    • 한국연소학회:학술대회논문집
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    • 한국연소학회 2012년도 제44회 KOSCO SYMPOSIUM 초록집
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    • pp.287-288
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    • 2012
  • DNS is performed to examine the propagation characteristics of stagnating turbulent premixed flames. Results show good agreement with the recently proposed relationship for turbulent burning velocity, $S_T$. It is shown that $S_T$ increases through a thinner flamelet, turbulence production and correlation between fluctuating velocity and buoyancy force respectively for diffusive-thermal, hydrodynamic and Rayleigh-Taylor instability. The mean curvature doesn't have significant effect on $S_T$ at the leading edge.

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The critical behaviors of resistivity in nickel films

  • Sik, Gil-Woo;Rhee Ilsu
    • Journal of Korean Vacuum Science & Technology
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    • 제1권1호
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    • pp.13-18
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    • 1997
  • The critical phenomena in nickel films have been studied by observing the resistivity behavior with temperatures near the Curie point. We observed the thickness dependence of the Curie point in nickel films, that is, the thinner the film is, the lower the Curie point is. This is as expected. Using the heat capacity data, we also found the amplitude ratios of bulk and film systems to be 1.222 and 1.197(average0, respectively. These values are cose to the theoretical prediction of 1.46 given by the Heisenberg, S=$\infty$ Model.

Development of 2.3' Plastic Film STN LCDs with uniform Cell Gap

  • Park, S.K.;Han, J.I.;Kim, W.K.;Kwak, M.K.
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2000년도 제1회 학술대회 논문집
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    • pp.39-40
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    • 2000
  • STN LCDs on Plastic Film substrates for mobile communication devices have been researched and developed at KETI in KOREA. The Plastic Film substrate is so weak to heat and pressure that its fabrication process is limited to $110^{\circ}C(Tg)$. In order to maintain uniform pressure on Plastic Film substrate we used newly designed jig and fabrication process. Electro-optical characteristics are better than or equivalent to those of typical glass LCD though it is thinner, lighter-weight, and more robust than glass LCD.

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골조-전단벽 구조에서 전단/코어벽의 Shear Lag 현상 (Shear Lag Phenomenon in Shear/Core Wall of Wall-Frame Structures)

  • 이은진;이강건;이리형
    • 한국전산구조공학회:학술대회논문집
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    • 한국전산구조공학회 2001년도 봄 학술발표회 논문집
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    • pp.215-222
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    • 2001
  • This study investigates the shear lag phenomenon existing in the shear wall of the wall-frame structure. Elastic analysis of such structures is carried out using a 3-D frame analysis program. The structural parameters governing the shear lag phenomenon are wall height and thickness. The analysis shows that the overturning moment due to external lateral load is resisted by both of the shear/core wall and the external frame. Severe unstable stresses are identified in height ratio of about 0.7 The taller or thinner wall shows the smaller shear lag phenomenon.

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IC Interposer Technology Trends

  • Min, Byoung-Youl
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2003년도 International Symposium
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    • pp.3-17
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    • 2003
  • .Package Trend -> Memory : Lighter, Thinner, Smaller & High Density => SiP, 3D Stack -> MPU : High Pin Counts & Multi-functional => FCBGA .Interposer Trend -> Via - Unfilled Via => Filled Via - Staggered Via => Stacked Via -> Emergence of All-layer Build-up Processes -> Interposer Material Requirement => Low CTE, Low $D_{k}$, Low $D_{f}$, Halogen-free .New Technology Concept -> Embedded Passives, Imprint, MLTS, BBUL etc.

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