• Journal of Welding and Joining
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• 제19권6호
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• pp.658-663
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• 2001

Residual stress caused in the weldments with high restraint force are often during welding observed in the weldments of large size nozzles or radial tanks. The reason is that quantitative analysis about thermal stresses during welding is lack for this weldments. To verify FEM theory, the temperature was measured with thermocouple in a real time in this paper. Also analysis of the thermal stress for welding condition is performed by ABAQUS program package on various welding condition in STS butt welding.

• 대한기계학회논문집A
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• 제30권1호
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• pp.76-83
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• 2006

This paper addresses the method for the shape design sensitivity analysis of the buckling load in the continuous elastic body. The sensitivity formula for critical load is analytically derived and expressed in terms of shape variation, based on the continuum formulation of the stability problem. Though the buckling problem is more efficiently solved by the structural elements such as beam and shell, the elastic solids are considered in this paper because the solid elements can be used in general for any kind of structures whether they are thick or thin. The initial stress and buckling analysis is carried out by the commercial analysis code ANSYS. The sensitivity is computed by using the mathematical package MATLAB using the results of ANSYS. Several problems including straight and curved beams under compressive load, ring under pressure load, thin-walled section and bottle shaped column are chosen to illustrate the efficiency of the presented method.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
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• pp.1703-1705
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• 2007

Before the ultra-violet glue encapsulation, the research evaporated LiF thin film on device surface to be the extra packaging layer for improving the lifetime of organic light-emitting diode. The formula of UV glue was specially developed. We found 100 nm LiF is the optimum thickness. The best lifetime obtained by using LiF and special UV glue is 2.4 times longer than those by commercial UV glue.

• 한국전산구조공학회:학술대회논문집
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• 한국전산구조공학회 2006년도 정기 학술대회 논문집
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• pp.841-846
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• 2006

This paper addresses the method for the shape design sensitivity analysis of the buckling load in the continuous elastic body. The sensitivity formula for critical load is analytically derived and expressed in terms of shape variation, based on the continuum formulation of the stability problem. Though the buckling problem is more efficiently solved by the structural elements such as beam and shell, the elastic solids are considered in this paper because the solid elements can be used in general for any kind of structures whether they are thick or thin. The initial stress and buckling analysis is carried out by the commercial analysis code ANSYS. The sensitivity is computed by using the mathematical package MATLAB using the results of ANSYS. Several problems including straight and curved beams under compressive load, ring under pressure load, thin-walled section are chosen to illustrate the efficiency of the presented method.

• 마이크로전자및패키징학회지
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• 제27권1호
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• pp.55-65
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• 2020

반도체 패키지에서 언더필의 사용은 패키지의 응력 완화 및 습기 방지에 중요할 뿐만 아니라, 충격, 진동 시에 패키지의 신뢰성을 향상시키는 중요한 소재이다. 그러나 최근 패키지의 크기가 커지고, 매우 얇아짐에 따라서 언더필의 사용이 오히려 패키지의 신뢰성을 저하하는 현상이 발견되고 있다. 이러한 이슈를 해결하기 위하여 본 연구에서는 언더필을 대신 할 소재로서 solid epoxy를 이용한 패키지를 개발하여 신뢰성을 향상시키고자 하였다. 개발된 solid epoxy를 스마트 폰의 AP 패키지에 적용하여 열사이클링 신뢰성 시험과 수치해석을 통하여 패키지의 신뢰성을 평가하였다. 신뢰성 향상을 위한 최적의 solid epoxy 소재 및 공정 조건을 찾기 위하여 solid epoxy 의 사용 개수, PCB 패드 타입 및 solid epoxy의 물성 등, 3 개의 인자가 패키지의 신뢰성에 미치는 영향을 고찰하였다. Solid epoxy를 AP 패키지에 적용한 결과 solid epoxy가 없는 경우 보다, solid epoxy를 적용한 경우가 신뢰성이 향상되었다. 또한 solid epoxy를 패키지의 외곽 4곳에 적용한 경우 보다는 6 곳에 적용한 경우가 더 신뢰성이 좋음을 알 수 있었다. 이는 solid epoxy가 패키지의 열팽창에 따른 응력을 완화 시키는 역할을 하여 패키지의 신뢰성이 향상되었음을 의미한다. 또한 PCB 패드 타입에 대한 신뢰성을 평가한 결과 NSMD (non-solder mask defined) 패드를 사용할 경우가 SMD (solder mask defined) 패드 보다 신뢰성이 더 향상됨을 알 수 있었다. NSMD 패드의 경우 솔더와 패드가 접합하는 면적이 더 크기 때문에 구조적으로 안정하여 신뢰성 측면에서 더 유리하기 때문이다. 또한 열팽창계수가 다른 solid epoxy를 적용하여 신뢰성 평가를 한 결과, 열팽창계수가 낮은 solid epoxy를 사용한 경우가 신뢰성이 더 향상됨을 알 수 있었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.322-323
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• 2008

Multi layered thin films with ZnS/$Na_3AlF_6$/ZnS were deposited on glass substrate by thermal evaporator precess and simulated by using EMP(Essential Macleod Program). EMP is a comprehensive software package to design and analyse the optical characteristics of multi-layered thin film. ZnS and $Na_3AlF_6$ were selected as a high refractive index and low refractive index material respectively. Additionally Cu was chosen as mid reflective material. Optical properties including color effect were systematically studied. in terms of different optical thickness of low refractive index material. The optical thickness of $Na_3AlF_6$ was changed as 0.25, 0.5, 0.75 and $1.0\lambda$. The film with 0.25, 0.5, 0.75 and $1.0\lambda$. of optical thickness showed mixed color range between bluish green and red purple, yellowish green and bluish green, purple and mixed color range of green and purple respectively.

• 한국전기전자재료학회논문지
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• 제21권4호
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• pp.376-380
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• 2008

The optical properties of multi layered thin films with $Sb_2O_3/Na_3AlF_6/Sb_2O_3/Cr$ were simulated by using EMP(Essential Macleod Program). EMP is a comprehensive software package to design and analyse the optical characteristics of multi-layered thin film. $Sb_2O_3$ and $Na_3AlF_6$ were selected as a high refractive index and low refractive index material respectively. Additionally Cr was chosen as mid reflective material. Optical properties including color effect were systematically studied in terms of different optical thickness of low refractive index material. The optical thickness of $Na_3AlF_6$ was changed as 0.25, 0.5, 0.75 and $1.0\lambda$. The film with 0.25, 0.5, 0.75 and $1.0\lambda$ of optical thickness showed mixed color range between purple and red range, yellowish green and bluish green, purple and mixed color range of green and purple respectively.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.345-345
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• 2007

ZnS/$Na_3AlF_6$/ZnS/Cu multi-layered thin film were simulated by EMP. EMP is a comprehensive software package for the design and analysis of optical thin film. ZnS and $Na_3AlF_6$ was selected as a high refractive index material and low refractive index material And Cu was selected as mid reflective material. Optical properties including color effect were systematically studied in terms of different low refractive index materials thickness. $Na_3AlF_6$ were changed 0.25, 0.5, 0.75, $1.0{\lambda}$. The thin film showed $0.25{\lambda}$ : blue, purple / $0.5{\lambda}$ : yellow $0.75{\lambda}$ : blue, purple, red / $1.0{\lambda}$ : yellow, green, blue, purple. It was becaused by different optical thickness of $Na_3AlF_6$. The maximum of optical interference by refractive layer.

• Steel and Composite Structures
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• 제50권2호
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• pp.159-181
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• 2024

In the present study, the effect of geometrical parameters of two different types of aluminum thin-walled structures on energy absorption under three-bending impact loading has been investigated experimentally and numerically. To evaluate the effect of parameters on the specific energy absorption (SEA), initial peak crushing force (IPCF), and the maximum crushing distance (δ), a design of experiment technique (DOE) with response surface method (RSM) was applied. Four different thin-walled structures have been tested under the low-velocity impact, and then they have simulated by ABAQUS software. An acceptable consistency between the numerical and experimental results was obtained. In this study, statistical analysis has been performed on various parameters of three different types of tubes. In the first and the second statistical analysis, the dimensional parameters of the cross-section, the number of holes, and the dimensional parameter of holes were considered as the design variables. The diameter reduction rate and the number of sections with different diameters are related to the third statistical analysis. All design points of the statistical method have been simulated by the finite element package, ABAQUS/Explicit. The final result shows that the height and thickness of tubes were more effective than other geometrical parameters, and despite the fact that the deformations of the cylindrical tubes were around forty percent greater than the rectangular tubes, the top desirability was relevant to the cylindrical tubes with reduced cross-sections.

• 대한화학회지
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• 제54권5호
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• pp.594-602
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• 2010

반도체의 경박단소화, 고밀도화에 따라 향후 반도체 패키지의 주 형태는 CSP(Chip Scale Package)가 될 것이다. 이러한 CSP에 사용되는 에폭시 수지 시스템의 흡습특성을 조사하기 위하여 에폭시 수지 및 충전재 변화에 따른 확산계수와 흡습율 변화를 조사하였다. 본 연구에 사용된 에폭시 수지로는 RE-304S, RE-310S, 및 HP-4032D를, 경화제로는 Kayahard MCD를, 경화촉매로는 2-methyl imidazole을 사용하였다. 충전재 크기 변화에 따른 에폭시 수지 성형물의 흡습특성을 조사하기 위하여 충전재로는 마이크로 크기 수준 및 나노 크기 수준의 구형 용융 실리카를 사용하였다. 이러한 에폭시 수지 성형물의 유리전이온도는 시차주사열량계를 이용하여 측정하였으며, 시간에 따른 흡습특성은 $85^{\circ}C$ and 85% 상대습도 조건하에서 항온항습기를 사용하여 측정하였다. 에폭시 수지 성형물의 확산계수는 Ficks의 법칙에 기초한 변형된 Crank 방정식을 사용하여 계산 하였다. 충전재를 사용하지 않은 에폭시 수지 시스템의 경우, 유리전이온도가 증가함에 따라 확산계수와 포화흡습율이 증가 하였으며 이는 유리전이온도 증가에 따른 에폭시 수지 성형물의 자유부피 증가로 설명하였다. 충전재를 사용한 경우, 충전재의 함량 증가에 따라 유리전이온도와 포화흡습율은 거의 변화가 없었으나, 확산계수는 충전재의 입자 크기에 따라 많은 변화를 보여주었다. 마이크로 크기 수준의 충전재를 사용한 경우 확산은 자유부피를 통하여 주로 이루어지나, 나노 크기 수준의 충전재를 사용한 에폭시 수지 성형물에서는 충전재의 표면적 증가에 따른, 수분 흡착의 상호작용을 통한 확산이 지배적으로 이루어진다고 판단된다.