• Title/Summary/Keyword: thin metal

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The Fabrication of Poly-Si Solar Cells for Low Cost Power Utillity (저가 지상전력을 위한 다결정 실리콘 태양전지 제작)

  • Kim, S.S.;Lim, D.G.;Shim, K.S.;Lee, J.H.;Kim, H.W.;Yi, J.
    • Solar Energy
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    • v.17 no.4
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    • pp.3-11
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    • 1997
  • Because grain boundaries in polycrystalline silicon act as potential barriers and recombination centers for the photo-generated charge carriers, these defects degrade conversion effiency of solar cell. To reduce these effects of grain boundaries, we investigated various influencing factors such as thermal treatment, various grid pattern, selective wet etching for grain boundaries, buried contact metallization along grain boundaries, grid on metallic thin film. Pretreatment above $900^{\circ}C$ in $N_2$ atmosphere, gettering by $POCl_3$ and Al treatment for back surface field contributed to obtain a high quality poly-Si. To prevent carrier losses at the grain boundaries, we carried out surface treatment using Schimmel etchant. This etchant delineated grain boundaries of $10{\mu}m$ depth as well as surface texturing effect. A metal AI diffusion into grain boundaries on rear side reduced back surface recombination effects at grain boundaries. A combination of fine grid with finger spacing of 0.4mm and buried electrode along grain boundaries improved short circuit current density of solar cell. A ultra-thin Chromium layer of 20nm with transmittance of 80% reduced series resistance. This paper focused on the grain boundary effect for terrestrial applications of solar cells with low cost, large area, and high efficiency.

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Evaluations of Si based ternary anode materials by using RF/DC magnetron sputtering for lithium ion batteries

  • Hwang, Chang-Muk;Park, Jong-Wan
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.08a
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    • pp.302-303
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    • 2010
  • Generally, the high energy lithium ion batteries depend intimately on the high capacity of electrode materials. For anode materials, the capacity of commercial graphite is unlike to increase much further due to its lower theoretical capacity of 372 mAhg-1. To improve upon graphite-based negative electrode materials for Li-ion rechargeable batteries, alternative anode materials with higher capacity are needed. Therefore, some metal anodes with high theoretic capacity, such as Si, Sn, Ge, Al, and Sb have been studied extensively. This work focuses on ternary Si-M1-M2 composite system, where M1 is Ge that alloys with Li, which has good cyclability and high specific capacity and M2 is Mo that does not alloy with Li. The Si shows the highest gravimetric capacity (up to 4000mAhg-1 for Li21Si5). Although Si is the most promising of the next generation anodes, it undergoes a large volume change during lithium insertion and extraction. It results in pulverization of the Si and loss of electrical contact between the Si and the current collector during the lithiation and delithiation. Thus, its capacity fades rapidly during cycling. Si thin film is more resistant to fracture than bulk Si because the film is firmly attached to the substrate. Thus, Si film could achieve good cycleability as well as high capacity. To improve the cycle performance of Si, Suzuki et al. prepared two components active (Si)-active(Sn, like Ge) elements film by vacuum deposition, where Sn particles dispersed homogeneously in the Si matrix. This film showed excellent rate capability than pure Si thin film. In this work, second element, Ge shows also high capacity (about 2500mAhg-1 for Li21Ge5) and has good cyclability although it undergoes a large volume change likewise Si. But only Ge does not use the anode due to its costs. Therefore, the electrode should be consisted of moderately Ge contents. Third element, Mo is an element that does not alloys with Li such as Co, Cr, Fe, Mn, Ni, V, Zr. In our previous research work, we have fabricated Si-Mo (active-inactive elements) composite negative electrodes by using RF/DC magnetron sputtering method. The electrodes showed excellent cycle characteristics. The Mo-silicide (inert matrix) dispersed homogeneously in the Si matrix and prevents the active material from aggregating. However, the thicker film than $3\;{\mu}m$ with high Mo contents showed poor cycling performance, which was attributed to the internal stress related to thickness. In order to deal with the large volume expansion of Si anode, great efforts were paid on material design. One of the effective ways is to find suitably three-elements (Si-Ge-Mo) contents. In this study, the Si based composites of 45~65 Si at.% and 23~43 Ge at.%, and 12~32 Mo at.% are evaluated the electrochemical characteristics and cycle performances as an anode. Results from six different compositions of Si-Ge-Mo are presented compared to only the Si and Ge negative electrodes.

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A Study on the Resistve Switching Characteristic of Parallel Memristive Circuit of Lithium Ion Based Memristor and Capacitor (리튬 이온 기반 멤리스터 커패시터 병렬 구조의 저항변화 특성 연구)

  • Kang, Seung Hyun;Lee, Hong-Sub
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.4
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    • pp.41-45
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    • 2021
  • In this study, in order to secure the high reliability of the memristor, we adopted a patterned lithium filament seed layer as the main agent for resistive switching (RS) characteristic on the 30 nm thick ZrO2 thin film at the device manufacturing stage. Lithium filament seed layer with a thickness of 5 nm and an area of 5 ㎛ × 5 ㎛ were formed on the ZrO2 thin film, and various electrode areas were applied to investigate the effect of capacitance on filament type memristive behavior in the parallel memristive circuit of memristor and capacitor. The RS characteristics were measured in the samples before and after 250℃ post-annealing for lithium metal diffusion. In the case of conductive filaments formed by thermal diffusion (post-annealed sample), it was not available to control the filament by applying voltage, and the other hand, the as-deposited sample showed the reversible RS characteristics by the formation and rupture of filaments. Finally, via the comparison of the RS characteristics according to the electrode area, it was confirmed that capacitance is an important factor for the formation and rupture of filaments.

Effect of Deposition and Heat Treatment Conditions on the Electrical and Optical Properties of AZO/Cu/AZO Thin Film (증착 및 열처리 조건에 따른 AZO/Cu/AZO 박막의 전기적·광학적 특성 평가)

  • Chan-Young Kim;Ha-Eun Lim;Gaeun Yang;Sukjeang Kwon;Chan-Hee Kang;Sang-Chul Lim;Taek Yeong Lee
    • Korean Journal of Materials Research
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    • v.33 no.4
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    • pp.142-150
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    • 2023
  • AZO/Cu/AZO thin films were deposited on glass by RF magnetron sputtering. The specimens showed the preferred orientation of (0002) AZO and (111) Cu. The Cu crystal sizes increased from about 3.7 nm to about 8.5 nm with increasing Cu thickness, and from about 6.3 nm to about 9.5 nm with increasing heat treatment temperatures. The sizes of AZO crystals were almost independent of the Cu thickness, and increased slightly with heat treatment temperature. The residual stress of AZO after heat treatment also increased compressively from -4.6 GPa to -5.6 GPa with increasing heat treatment temperature. The increase in crystal size resulted from grain growth, and the increase in stress resulted from the decrease in defects that accompanied grain growth, and the thermal stress during cooling from heat treatment temperature to room temperature. From the PL spectra, the decrease in defects during heat treatment resulted in the increased intensity. The electrical resistivities of the 4 nm Cu film were 5.9×10-4 Ω·cm and about 1.0×10-4 Ω·cm for thicker Cu films. The resistivity decreased as the temperature of heat treatment increased. As the Cu thickness increased, an increase in carrier concentration resulted, as the fraction of AZO/Cu/AZO metal film increased. And the increase in carrier concentration with increasing heat treatment temperature might result from the diffusion of Cu ions into AZO. Transmittance decreased with increasing Cu thicknesses, and reached a maximum near the 500 nm wavelength after being heat treated at 200 ℃.

Effect of the initial imperfection on the response of the stainless steel shell structures

  • Ali Ihsan Celik;Ozer Zeybek;Yasin Onuralp Ozkilic
    • Steel and Composite Structures
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    • v.50 no.6
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    • pp.705-720
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    • 2024
  • Analyzing the collapse behavior of thin-walled steel structures holds significant importance in ensuring their safety and longevity. Geometric imperfections present on the surface of metal materials can diminish both the durability and mechanical integrity of steel shells. These imperfections, encompassing local geometric irregularities and deformations such as holes, cavities, notches, and cracks localized in specific regions of the shell surface, play a pivotal role in the assessment. They can induce stress concentration within the structure, thereby influencing its susceptibility to buckling. The intricate relationship between the buckling behavior of these structures and such imperfections is multifaceted, contingent upon a variety of factors. The buckling analysis of thin-walled steel shell structures, similar to other steel structures, commonly involves the determination of crucial material properties, including elastic modulus, shear modulus, tensile strength, and fracture toughness. An established method involves the emulation of distributed geometric imperfections, utilizing real test specimen data as a basis. This approach allows for the accurate representation and assessment of the diversity and distribution of imperfections encountered in real-world scenarios. Utilizing defect data obtained from actual test samples enhances the model's realism and applicability. The sizes and configurations of these defects are employed as inputs in the modeling process, aiding in the prediction of structural behavior. It's worth noting that there is a dearth of experimental studies addressing the influence of geometric defects on the buckling behavior of cylindrical steel shells. In this particular study, samples featuring geometric imperfections were subjected to experimental buckling tests. These same samples were also modeled using Finite Element Analysis (FEM), with results corroborating the experimental findings. Furthermore, the initial geometrical imperfections were measured using digital image correlation (DIC) techniques. In this way, the response of the test specimens can be estimated accurately by applying the initial imperfections to FE models. After validation of the test results with FEA, a numerical parametric study was conducted to develop more generalized design recommendations for the stainless-steel shell structures with the initial geometric imperfection. While the load-carrying capacity of samples with perfect surfaces was up to 140 kN, the load-carrying capacity of samples with 4 mm defects was around 130 kN. Likewise, while the load carrying capacity of samples with 10 mm defects was around 125 kN, the load carrying capacity of samples with 14 mm defects was measured around 120 kN.

A Study of the Bracelets Excavated from Fifth-and Sixth-century Silla Kingdom Tombs: Physical Characteristics and Wearing Practices (신라 5~6세기 무덤 출토 팔찌에 대한 연구 -물리적·형태적 특성 및 착장 양상을 중심으로)

  • Yoon Sangdeok
    • Bangmulgwan gwa yeongu (The National Museum of Korea Journal)
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    • v.1
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    • pp.174-197
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    • 2024
  • Personal ornaments made from precious metals that have been excavated from tombs dating to the Maripgan period (4th-6th century) of the Silla Kingdom are a major subject of analysis in the study of gender and hierarchy among the tomb occupants. Nonetheless, bracelets had been neglected until Ha Daeryong's recent research on determining gender through bracelets attracted attention. Accordingly, an examination and organization of the fundamental elements of Silla bracelets was needed. In response, this paper examines their physical characteristics, appearance, changes over time, and related wearing practices. The data for this study is derived from 176 bracelets, mostly made from silver or gold. Copper and glass bracelets are also included. Many of them were cast in a single-use earthen mold. Even the notched and protruding designs were created by casting rather than carving. Glass bracelets and bracelets with dragon designs were made using molds with round cavities. Excluding those produced using metal sheets, the rest of the bracelets are thought to have been cast in a mold with a long-string-shaped cavity and then bent round. After being bent, the two ends were either soldered together (closed type) or left open (open type). As demonstrated in the study by Lee Hansang, Silla bracelets evolved from plain rounded rod-shaped bracelets, such as the one excavated from the Northern Mound of Hwangnamdaechong Tomb, to versions with notched designs, and eventually to those with protruding designs, which gained popularity by the sixth century. The precedents of plain rounded rod-shaped bracelets are presumed to have been thin rod-shaped bracelets from the Proto-Three Kingdoms period. Bracelets need to be fit to the wrists so that they do not slip off easily when worn. The open type design was the preferable way to achieve this. Moreover, given the ductility of gold, silver, and copper, it seems that it would have been possible to stretch or deform them. In the end, I concluded that even if a bracelet is too small to pass man's hand, the open type could have been worn. Furthermore, if a closed-type bracelet were pressed into an oval shape, it would not be impossible for a man to put it on. When bracelets are divided according to their degree of deformability into type A (the open type) through type D, which is almost impossible to deform, type A is commonly found with wearers of thin hollow earrings, and types C and D (which are difficult to deform) are not found with wearers of thin hollow earrings, but only with wearers of thick hollow earrings. Therefore, it can be seen that men were allowed to wear bracelets, and the existing studies that differentiate between men and women based on the wearing of thin hollow earrings, thick hollow earrings, and swords remain valid.

High Quality Nano Structured Single Gas Barrier Layer by Neutral Beam Assisted Sputtering (NBAS) Process

  • Jang, Yun-Sung;Lee, You-Jong;Hong, Mun-Pyo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.251-252
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    • 2012
  • Recently, the growing interest in organic microelectronic devices including OLEDs has led to an increasing amount of research into their many potential applications in the area of flexible electronic devices based on plastic substrates. However, these organic devices require a gas barrier coating to prevent the permeation of water and oxygen because organic materials are highly susceptible to water and oxygen. In particular, high efficiency OLEDs require an extremely low Water Vapor Transition Rate (WVTR) of $1{\times}10^{-6}g/m^2$/day. The Key factor in high quality inorganic gas barrier formation for achieving the very low WVTR required ($1{\times}10^{-6}g/m^2$/day) is the suppression of defect sites and gas diffusion pathways between grain boundaries. In this study, we developed an $Al_2O_3$ nano-crystal structure single gas barrier layer using a Neutral Beam Assisted Sputtering (NBAS) process. The NBAS system is based on the conventional RF magnetron sputtering and neutral beam source. The neutral beam source consists of an electron cyclotron Resonance (ECR) plasma source and metal reflector. The Ar+ ions in the ECR plasma are accelerated in the plasma sheath between the plasma and reflector, which are then neutralized by Auger neutralization. The neutral beam energies were possible to estimate indirectly through previous experiments and binary collision model. The accelerating potential is the sum of the plasma potential and reflector bias. In previous experiments, while adjusting the reflector bias, changes in the plasma density and the plasma potential were not observed. The neutral beam energy is controlled by the metal reflector bias. The NBAS process can continuously change crystalline structures from an amorphous phase to nano-crystal phase of various grain sizes within a single inorganic thin film. These NBAS process effects can lead to the formation of a nano-crystal structure barrier layer which effectively limits gas diffusion through the pathways between grain boundaries. Our results verify the nano-crystal structure of the NBAS processed $Al_2O_3$ single gas barrier layer through dielectric constant measurement, break down field measurement, and TEM analysis. Finally, the WVTR of $Al_2O_3$ nano-crystal structure single gas barrier layer was measured to be under $5{\times}10^{-6}g/m^2$/day therefore we can confirm that NBAS processed $Al_2O_3$ nano-crystal structure single gas barrier layer is suitable for OLED application.

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Optoelectronic properties of the Metal-dielectric complex thin films for applying high sensitivity IR image sensors (고감도 적외선 이미지 센서 적용을 위한 금속-유전체 복합 박막의 광전자 특성)

  • Kim, Ye-Na;Kwon, Soon-Woo;Park, Seung-Jun;Kim, Woo-Kyug;Lee, Han-Young;Yoon, Dae-Ho;Yang, Woo-Seok
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.21 no.2
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    • pp.60-64
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    • 2011
  • High sensitivity IR image sensors require materials characteristics with temperature coefficient of resistance (TCR) and IR range absorption. In this study, the metal-dielectric thermo sensitive films (MDTF) based on $(SiO_2)_x-(Ti)_y$ composition were deposited on substrates of germanium and glass by thermal evaporator. The $SiO_2$ : Ti mixture was made from the ratio of 9 : 1, 8 : 2, 7 : 3, 6 : 4, respectively. $(SiO_2)_x-(Ti)_y$ mixture powder was loaded on tungsten boat in evaporator and was 15.5 cm from the substrate. Resistance of $(SiO_2)_x-(Ti)_y$ in the range of 273~333K were measured as a function of temperature. Temperature coefficient of resistance (TCR) was calculated by the resistance variation. Under the various mixture ratios condition, it is possible to obtain $SiO_2$-Ti layers with resistance from units kilo-ohm to hundreds kilo-ohm. Finally, our results showed that Temperature coefficient of resistance (TCR) of these films varies from -1.4 to $-2.6%K^{-1}$.

Fabrication of Field Emitter Arrays by Transferring Filtered Carbon Nanotubes onto Conducting Substrates

  • Jang, Eun-Soo;Goak, Jung-Choon;Lee, Han-Sung;Lee, Seung-Ho;Lee, Nae-Sung
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.311-311
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    • 2009
  • Carbon nanotubes (CNTs) belong to an ideal material for field emitters because of their superior electrical, mechanical, and chemical properties together with unique geometric features. Several applications of CNTs to field emitters have been demonstrated in electron emission devices such as field emission display (FED), backlight unit (BLU), X-ray source, etc. In this study, we fabricated a CNT cathode by using filtration processes. First, an aqueous CNT solution was prepared by ultrasonically dispersing purified single-walled CNTs (SWCNTs) in deionized water with sodium dodecyl sulfate (SDS). The aqueous CNT solution in a milliliter or even several tens of micro-litters was filtered by an alumina membrane through the vacuum filtration, and an ultra-thin CNT film was formed onto the alumina membrane. Thereafter, the alumina membrane was solvated by acetone, and the floating CNT film was easily transferred to indium-tin-oxide (ITO) glass substrate in an area defined as 1 cm with a film mask. The CNT film was subjected to an activation process with an adhesive roller, erecting the CNTs up to serve as electron emitters. In order to measure their luminance characteristics, an ITO-coated glass substrate having phosphor was employed as an anode plate. Our field emitter array (FEA) was fairly transparent unlike conventional FEAs, which enabled light to emit not only through the anode frontside but also through the cathode backside, where luminace on the cathode backside was higher than that on the anode frontside. Futhermore, we added a reflecting metal layer to cathode or anode side to enhance the luminance of light passing through the other side. In one case, the metal layer was formed onto the bottom face of the cathode substrate and reflected the light back so that light passed only through the anode substrate. In the other case, the reflecting layer coated on the anode substrate made all light go only through the cathode substrate. Among the two cases, the latter showed higher luminance than the former. This study will discuss the morphologies and field emission characteristics of CNT emitters according to the experimental parameters in fabricating the lamps emitting light on the both sides or only on the either side.

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Effects of GaN Buffer Layer Thickness on Characteristics of GaN Epilayer (GaN 완충층 두께가 GaN 에피층의 특성에 미치는 영향)

  • Jo, Yong-Seok;Go, Ui-Gwan;Park, Yong-Ju;Kim, Eun-Gyu;Hwang, Seong-Min;Im, Si-Jong;Byeon, Dong-Jin
    • Korean Journal of Materials Research
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    • v.11 no.7
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    • pp.575-579
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    • 2001
  • GaN buffer layer and epilayer have been grown on sapphire (0001) by metal organic chemical vapor deposition (MOCVD). GaN buffer layer ranging from 26 nm to 130 nm in thickness was grown at 55$0^{\circ}C$ prior to the 4 $\mu\textrm{m}$ thick GaN epitaxial deposition at 110$0^{\circ}C$. After GaN buffer layer growth, buffer layer surface was examined by atomic force microscopy (AFM). As the thickness of GaN buffer layer was increased, surface morphology of GaN epilayer was investigated by scanning electron microscopy (SEM). Double crystal X-ray diffraction (DCXRD) and Raman spectroscopy were employed to study crystallinity of GaN epilayers. Optical properties of GaN epilayers were measured by photoluminescence (PL). The epilayer grown with a thin buffer layer had rough surface, and the epilayer grown with a thick buffer layer had mirror-like surface of epilayer. Although the stress on the latter was larger than on the former, its crystallinity was much better. These results imply that the internal free energy is decreased in case of the thick buffer layer. Decrease in internal free energy promotes the lateral growth of the GaN film, which results in the smoother surface and better crystallinity.

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