• Korean Journal of Materials Research
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• v.27 no.2
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• pp.89-93
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• 2017

A thin film thermoelectric generator that consisted of 5 p/n pairs was fabricated with $1{\mu}m$-thick n-type $In_3Sb_1Te_2$ and p-type $Ge_2Sb_2Te_5$ deposited via radio frequency magnetron sputtering. First, $1{\mu}m$-thick GST and IST thin films were deposited at $250^{\circ}C$ and room temperature, respectively, via radio-frequency sputtering; these films were annealed from 250 to $450^{\circ}C$ via rapid thermal annealing. The optimal power factor was found at an annealing temperature of $400^{\circ}C$ for 10 min. To demonstrate thermoelectric generation, we measured the output voltage and estimated the maximum power of the n-IST/p-GST generator by imposing a temperature difference between the hot and cold junctions. The maximum output voltage and the estimated maximum power of the $1{\mu}m$-thick n-IST/p-GST TE generators are approximately 17.1 mV and 5.1 nW at ${\Delta}T=12K$, respectively.

• Journal of the Korean Electrochemical Society
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• v.23 no.1
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• pp.18-23
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• 2020

Antimony telluride (Sb_xTe_y) thin films were synthesized by an electrodeposition method with a control of applied potential at room temperature. Characterization of electrical and thermoelectric properties such as conductivity, Seebeck coefficient, and power factor (P.F.) were conducted as a function of the chemical composition of the electrodeposited films. Morphology of thin films were dense and uniform and the composition was tailored from 25 to 60 at.% of the Sb content by altering the applied potential from -0.13 to -0.27 V (vs. SCE). The conductivity of the films were ranged from 2 × 10^-4 ~ 5 × 10^-1 S/cm indicating their amorphous behavior. The meaured Seebeck coefficient of films were relatively high compared to that of bulk single cyrstal Sb_xTe_y due to their low carrier concentration. The variation of the Seebeck coefficient of the films was also related to the change of chemical composition, showing the power factor of ~10 ㎼/mK².

• Proceedings of the Materials Research Society of Korea Conference
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• 1995.11a
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• pp.99-99
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• 1995

• Proceedings of the Materials Research Society of Korea Conference
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• 1996.11a
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• pp.21-21
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• 1996

• Korean Journal of Materials Research
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• v.33 no.7
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• pp.295-301
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• 2023

Thermoelectric (TE) energy harvesting, which converts available thermal resources into electrical energy, is attracting significant attention, as it facilitates wireless and self-powered electronics. Recently, as demand for portable/wearable electronic devices and sensors increases, organic-inorganic TE films with polymeric matrix are being studied to realize flexible thermoelectric energy harvesters (f-TEHs). Here, we developed flexible organic-inorganic TE films with p-type Bi_0.5Sb_1.5Te₃ powder and polymeric matrices such as poly(3,4-eethylenedioxythiophene):poly(styrene sulfonate) (PEDOT:PSS) and poly (vinylidene fluoride) (PVDF). The fabricated TE films with a PEDOT:PSS matrix and 1 wt% of multi-walled carbon nanotube (MWCNT) exhibited a power factor value of 3.96 µW·m^-1·K^-2 which is about 2.8 times higher than that of PVDF-based TE film. We also fabricated f-TEHs using both types of TE films and investigated the TE output performance. The f-TEH made of PEDOT:PSS-based TE films harvested the maximum load voltage of 3.4 mV, with a load current of 17.4 µA, and output power of 15.7 nW at a temperature difference of 25 K, whereas the f-TEH with PVDF-based TE films generated values of 0.6 mV, 3.3 µA, and 0.54 nW. This study will broaden the fields of the research on methods to improve TE efficiency and the development of flexible organic-inorganic TE films and f-TEH.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.10
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• pp.881-887
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• 2014

Micro-sized Peltier coolers are generally employed for uniformly distributing heat generated in the multi-chip packages. These coolers are commonly classified into vertical and planar devices, depending on the heat flow direction and the arrangement of thermoelectric materials on the used substrate. Owing to the strong need for evaluation of performance of thermoelectric modules, at present an establishment of proper theoretical model has been highly required. The design theory for micro-sized thermoelectric cooler should be considered with contact resistance. Cooling performance of these modules was significantly affected by their contact resistance such as electrical and thermal junction. In this paper, we introduce the useful and optimal design model of small dimension thermoelectric module.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.139-144
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• 2005

A rigorous research is underway in our team, for the design and development of high figure of merits (ZT= 1.5${\sim}$2.0) micro-thermoelectric coolers. This paper discusses the fabrication process that we are using for developing the $Sb_2Te_3-Bi_2Te_3$ micro-thermoelectric cooling modules. It describes how to obtain the mechanical properties of the thin film TEC elements and reports the results of an equation-based multiphysics modeling of the micro-TEC modules. In this study the thermoelectric thin films were deposited on Si substrates using co-sputtering method. The physical mechanical properties of the prepared films were measured by nanoindentation testing method while the thermal and electrical properties required for modeling were obtained from existing literature. A finite element model was developed using an equation-based multiphysics modeling by the commercial finite element code FEMLAB. The model was solved for different operating conditions. The temperature and the stress distributions in the P and N elements of the TEC as well as in the metal connector were obtained. The temperature distributions of the system obtained from simulation results showed good agreement with the analytical results existing in literature. In addition, it was found that the maximum stress in the system occurs at the bonding part of the TEC i.e. between the metal connectors and TE elements of the module.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.33-38
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• 2012

An in-plane thermoelectric sensor was processed on a glass substrate by evaporation of the n-type Bi-Te and p-type Sb-Te thin films, and its sensing characteristics were evaluated. The n-type Bi-Te thins film used to fabricate the inplane sensor exhibited a Seebeck coefficient of -165 ${\mu}V$/K and a power factor of $80{\times}10^{-4}W/K^2-m$. The p-type Sb-Te thin film used to fabricate the in-plane sensor exhibited a Seebeck coefficient of 142 ${\mu}V$/K and a power factor of $51.7{\times}10^{-4}W/K^2-m$. The in-plane thermoelectric sensor consisting of 15 pairs of the n-type Bi-Te and the p-type Sb-Te evaporated thin films exhibited a sensitivity of 2.8 mV/K.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.178-178
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• 2008

초소형 박막의 열전 발전모듈은 작은 부피와 한번 설치시 교체없이 지속적인 전원공급으로 소형의 센서 노드에 전원으로 각광 받고 있다. 이에 본 논문에서는 In Plane방식의 PIN Junction의 박막형 열전소자를 제작하여 보았다. 열전 박막인 P-type의 $BiSbTe_3$와 N-type의 $Bi_2Te_3$은 (001)GaAs 기판에 MOCVD(Metal Organic Chemical Vapour Deposition)방식으로 성장하였으며 전극으로는 E-Beam Evaporator를 이용하여 금(Au), 알루미늄(Al)을 사용하였다. 열전박막의 두께는 MOCVD의 성장시간과 온도 MO-x 가스의 압력으로 조절하여 주었다. 제작결과 1Pairs 당 약 $63{\mu}V$/K을 나타내었다.

• Korean Journal of Metals and Materials
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• v.48 no.5
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• pp.445-448
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• 2010

For an enhanced thermoelectric performance, one-dimensional heterostructure nanowires were created that consisted of aBi core and Te shell. The structure was fabricated by depositing Te in-situ onto a Bi nanowire grown by our unique OFF-ON (on-film formation of nanowires) method. After examining a cross-sectional TEM image, it was found that diffusive interface was formed between Bi and Te. Selected area electron diffraction revealed that the crystallinity of the Te shell was some what lower compared to the highly single-crystalline Bi core. The Bi-Te core/shell nanowires can be a smart structure that suppresses phonon transport by several scattering mechanisms, making the OFF-ON method the simplest way to realize that structure.