Introduction to the Thin Film Thermoelectric Cooler Design Theories
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Jeon, Seong-Jae
(Department of Nano-Mechanics, Korea Institute of Machinery & Materials)
Jang, Bongkyun (Department of Nano-Mechanics, Korea Institute of Machinery & Materials) Song, Jun Yeob (Department of Ultra-Precision Machines and Systems, Korea Institute of Machinery & Material) Hyun, Seungmin (Department of Nano-Mechanics, Korea Institute of Machinery & Materials) Lee, Hoo-Jeong (School of Advanced Materials Science and Engineering, Sungkyunkwan University) |
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Glatz, W., Schwyter, E., Durrer, L., and Hierold, C., " |
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10 | Jang, B., Hyun, S., Kim, J.-H., and Lee, H.-J., "Simulation of Thermal Design and Thermoelectric Cooling for 3D Multi-chip Packaging," Proc. of KSPE Autumn Conference, pp. 711-712, 2009. 과학기술학회마을 |
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