• Journal of Institute of Control, Robotics and Systems
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• v.14 no.6
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• pp.543-547
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• 2008

In the paper, we develop the ultrasonic bonding technique for LCD driver chips having small size and high pin-density. In general, the mounting technology for LCD driver ICs is a thermo-compression method utilizing the ACF (An-isotropic Conductive Film). The major drawback of the conventional approach is the long process time. It will be shown that the conventional ACF method based on thermo-compression can be remarkably enhanced by employing the ultrasonic bonding technique in terms of bonding time. The proposed approach is to apply the ultrasonic energy together with the thermo-compression methodology for the ACF bonding process. To this end, we design a bonding head that enables pre-heating, pressure and ultrasonic excitation. Through the bonding experiments mainly with LCD driver ICs, we present the procedures to select the best combination of process parameters with analysis. We investigate the effects of bonding pressure, bonding time, pre-heating temperature before bonding, and the power level of ultrasonic energy. The addition of ultrasonic excitation to the thermo-compression method reduces the pre-heating temperature and the bonding process time while keeping the quality bonding between the LCD pad and the driver IC. The proposed concept will be verified and demonstrated with experimental results.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.2
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• pp.488-499
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• 1996

SMC(Sheet molding compound) is a thermosetting material reinforced with chopped fiberglass. The compression molding of SMC was analyzed based on a rigid thermo-viscoplastic approach using a three dimensional finite element program coupled with temperatures. Only the temperature analysis part was tested in this paper by solving one-dimensional heat transfer problem and comparing with the exact solutions available in the literature. Based on this comparison the program was proved to be valid and was further applied in solving compression molding of SMC between flat dies. To investigate the usefulness of a rigid thermo-viscoplastic approach in the compression molding analysis of SMC charge, compression of rectangular shaped SMC charge at plane strain and three dimensionalde formation condition was analyzed under the same condition as given in the literature. From this comparison it was found out that the rigid thermo-viscoplastic approach was useful in analyzing SMC compression molding between flat dies.

• Food Science and Biotechnology
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• v.18 no.5
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• pp.1155-1160
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• 2009

Poly(lactide) (PLA)-coated paperboards were prepared by solution coating and thermo-compression coating methods and their effect of coating on the packaging properties such as tensile, water resistance, water vapor barrier, and heat sealing properties was tested. Compared with uncoated control paperboard, tensile strength (TS) of PLA-coated paperboard increased profoundly (2.2-2.6 folds) with slight increase in elongation at break (E). Water absorptiveness (WA) of the paperboard decreased 74-170 folds and water vapor permeability (WVP) decreased 6.3-22.1 folds by coating with PLA, which indicates an increase in the hydrophobicity of the surface of paperboard. Compared with polyethylene (PE)-coated paperboard, both PLA-coated paperboard exhibited 2.3 time higher heat sealing strength. In addition, the PLA-coated paperboards showed equal or higher wet TS than PE-coated paperboard. All the test results showed that the paperboard coated by the thermo-compression coating method was similar to or better than those of coated by the solution coating method.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.47-48
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• 2008

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.933-934
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• 2008

• 한국금형공학회:학술대회논문집
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• 2008.06a
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• pp.209-213
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• 2008

In this work, we have proposed a method for calculating the residual stress developed during the PCB thermo-compression bonding precess. Residual stress is the most important factor that causes PCB warpage in accordance with the pattern design. In this work, a single-layed double-sided PCB, which is comprised of the dielectric (FR-4) substrate in the middle and copper cladding on the both top and bottom sides, is considered. A reference temperature, where all stress is free, is calculated by comparing the calculated and measured warapge of a PCB of which copper cladding of the top side is removed. Then, the reesidual stress values is calculated for the double-sided PCB.

• Food Science and Biotechnology
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• v.16 no.1
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• pp.62-66
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• 2007

Four different biopolyester films, two aliphatic polyesters including polylactides (PLA) and poly(3-hydroxy-butyrate-co-3-hydroxyvalerate (PHBV), and two aliphatic-aromatic copolyesters including Ecoplex and Biomax, were prepared using by thermo-compression, and their tensile and water barrier properties were determined. Among the films tested, PLA film was the most transparent (T: 95.8%), strongest, and stiffest (TS, 40.98 MPa; E, 1916 MPa), however it was rather brittle. In contrast, Ecoplex film was translucent while being the most flexible and resilient (EB, 766.8%). Biomax film was semitransparent and was the most brittle film tested (EB, 0.03%). All biopolyester films were water resistant exhibiting very low water solubility (WS) values ranging from 0.0.3 to 0.36%. PHBV film showed the lowest water vapor permeability (WVP) value ($1.26{\times}10^{-11}\;g{\cdot}m/m^2{\cdot}sec{\cdot}Pa$) followed by Biomax, PLA, and Ecoflex films, respectively. The water vapor barrier properties of each film were approximately 100 times higher than those of carbohydrate or protein-based films, but about 100 times lower than those of commodity polyolefin films such as low-density polyethylene (LDPE) or polypropylene (PP).

• Design & Manufacturing
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• v.14 no.3
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• pp.23-30
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• 2020

Laser Assisted Thermo-Compression Bonding (LATCB) has been proposed to improve the "chip tilt due to the difference in solder bump height" that occurs during the conventional semiconductor chip bonding process. The bonding module of the LATCB system has used a piezoelectric actuator to control the inclination of the compression jig on a micro scale, and the piezoelectric actuator has been directly coupled to the compression jig to minimize the assembly tolerance of the compression jig. However, this structure generates a lateral force in the piezoelectric actuator when the compression jig is tilted, and the stacked piezoelectric element vulnerable to the lateral force has a risk of failure. In this paper, the optimal design of the flexure hinge was performed to minimize the lateral force generated in the piezoelectric actuator when the compression jig is tilted by using the displacement difference of the piezoelectric actuator in the bonding module for LATCB. The design variables of the flexure hinge were defined as the hinge height, the minimum diameter, and the notch radius. And the effect of the change of each variable on the stress generated in the flexible hinge and the lateral force acting on the piezoelectric actuator was analyzed. Also, optimization was carried out using commercial structural analysis software. As a result, when the displacement difference between the piezoelectric actuators is the maximum (90um), the maximum stress generated in the flexible hinge is 11.5% of the elastic limit of the hinge material, and the lateral force acting on the piezoelectric actuator is less than 1N.

• Elastomers and Composites
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• v.50 no.1
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• pp.30-34
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• 2015

Thermo-mechanical treatment process of a compressed open-cell rigid polyurethane foam (OC-RPUF), which was fabricated for the vacuum insulation panel (VIP), was studied to obtain an optimum condition for the dimensional stability by the relaxation of compressive stress. Thermo-mechanical deformation of the sample OC-RPUF was shown to occur from about $120^{\circ}C$. Yield stress of 0.36 MPa was shown at about 10% yield strain. And, densification of the foam started to occur from 75% compressive strain and could be continued up to max. 90%. Compression set of the sample restored after initial compression to 90% at room temperature was ca. 82%. Though the expansion occurred to about twice of the originally compressed thickness in case of temperature rise to $130^{\circ}C$, it could be overcome and the dimensional stability could be maintained if the constant load of 0.3 MPa was applied. As the result, a thermo-mechanical treatment process, i.e, annealing process at temperature of $130{\sim}140^{\circ}C$ for about 20 min as is the maximum compressed state at room temperature, should be required for dimensional stability as an optimum condition for the use of VIP core material.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.17-22
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• 2013

We investigated the optimum bonding conditions for thermo-compression bonding of electrodes between flexible printed circuit board(FPCB) and rigid printed circuit board(RPCB) with Sn-58Bi solder as interlayer. In order to figure out the optimum bonding conditions, peel test of FPCB/RPCB joint was conducted. The peel strength was affected by the bonding conditions, such as temperature and time. The fracture energies were calculated through F-x (Force-displacement) curve during peel test and the relationships between bonding conditions and fracture behaviors were investigated. The optimum condition for the thermo-compression bonding with Sn-58Bi solder was found to be temperature of $195^{\circ}C$ and time of 7 s.