Proceedings of the Korean Society of Precision Engineering Conference (한국정밀공학회:학술대회논문집)
- 2008.06a
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- Pages.933-934
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- 2008
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- 2005-8446(pISSN)
Development of ACF bonding using Thermo-compression Ultrasonic Technique
열압착 초음파 기법을 이용한 ACF 본딩기술 개발
- Published : 2008.06.11