• Applied Biological Chemistry
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• v.42 no.2
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• pp.134-139
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• 1999

The characteristics of anthocyanin pigments extracted from cherry(Prunus serrulata L. var. spontanea Max. Wils.) were investigated at the various conditions, such as light, temperature, organic acid, metal ion and pH. The pigments were fairly stable under the sunlight during the 20 days storage period at room temperature. The pigments covered with the Al-foil, as well as red, blue, green and yellow films, were very stable at pH 2.5. The high thermal stability (over the 64% at $115^{\circ}C$, 30 min) of the pigments in the dark at pH 2.5 was also found. In the presence of organic acid, the hyperchromic effect of red color was greatly increased in the dark at $25^{\circ}C$. Addition of metal ion, such as $Na^+,\;K^+,\;Mg^{2+},\;Ca^{2+}\;and\;Mn^{2+}$, was contributed on the stability in color at pH 2.5 throughout 20 days storage period in the dark at $25^{\circ}C$. However, $Cu^{2+}\;and\;Fe^{3+}$ caused the rapidly degradation of pigments, and $Al^{3+}$ converted red color to blueish violet. The hyperchromic effect of the red color increased, as pH decreased. Therefore, these results indicated that cherry anthocyanin pigments might be used as the potential sources of natural red colorant for foods.

• Journal of Conservation Science
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• v.32 no.1
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• pp.21-32
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• 2016

Animal glue is a traditional material used extensively as adhesive and binder in mother-of-pearl, wooden structure, traditional painting, etc. Analysis of animal glue is usually performed with IR(infrared spectroscopy) based on the IR absorption of functional group. But, it has a limitation in confirming animal glue when a sample consists of several materials because of overlapping of the absorption band. Py/GC/MS(pyrolysis/gas chromatography/mass spectrometry) is a useful tool in analyzing the constituent of polymeric materials like animal glue by identifying their pyrolysate with very small amount of sample. In this study, confirmation of animal glue in a Dancheong sample was tried with this method. Characteristic pyrolytic compounds of animal glue and tung oil used in Dancheong were identified. Dancheong sample painted with Noerok as a coloring material, animal glue and tung oil was prepared and it was possible to find characteristic peaks of animal glue after thermal degradation and artificial weathering experiment. From this, we found that animal glue can be detected using py/GC/MS in cultural heritage samples consisting of several materials and in different condition. IR was also tried to analyze Dancheong sample and the results were compared with those of py/GC/MS for the detection of animal glue.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.140-140
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• 2018

The 3D interconnect technologies have been appeared, as the density of Integrated Circuit (IC) devices increases. Through Silicon Via (TSV) process is an important technology in the 3D interconnect technologies. And the process is used to form a vertically electrical connection through silicon dies. This TSV process has some advantages that short length of interconnection, high interconnection density, low electrical resistance, and low power consumption. Because of these advantages, TSVs could improve the device performance higher. The fabrication process of TSV has several steps such as TSV etching, insulator deposition, seed layer deposition, metallization, planarization, and assembly. Among them, TSV metallization (i.e. TSV filling) was core process in the fabrication process of TSV because TSV metallization determines the performance and reliability of the TSV interconnect. TSVs were commonly filled with metals by using the simple electrochemical deposition method. However, since the aspect ratio of TSVs was become a higher, it was easy to occur voids and copper filling of TSVs became more difficult. Using some additives like an accelerator, suppressor and leveler for the void-free filling of TSVs, deposition rate of bottom could be fast whereas deposition of side walls could be inhibited. The suppressor was adsorbed surface of via easily because of its higher molecular weight than the accelerator. However, for high aspect ratio TSV fillers, the growth of the top of via can be accelerated because the suppressor is replaced by an accelerator. The substitution of the accelerator and the suppressor caused the side wall growth and defect generation. The suppressor was used as Single additive electrodeposition of TSV to overcome the constraints. At the electrochemical deposition of high aspect ratio of TSVs, the suppressor as single additive could effectively suppress the growth of the top surface and the void-free bottom-up filling became possible. Generally, copper was used to fill TSVs since its low resistivity could reduce the RC delay of the interconnection. However, because of the large Coefficients of Thermal Expansion (CTE) mismatch between silicon and copper, stress was induced to the silicon around the TSVs at the annealing process. The Keep Out Zone (KOZ), the stressed area in the silicon, could affect carrier mobility and could cause degradation of the device performance. Cobalt can be used as an alternative material because the CTE of cobalt was lower than that of copper. Therefore, using cobalt could reduce KOZ and improve device performance. In this study, high-aspect ratio TSVs were filled with cobalt using the electrochemical deposition. And the filling performance was enhanced by using the suppressor as single additive. Electrochemical analysis explains the effect of suppressor in the cobalt filling bath and the effect of filling behavior at condition such as current type was investigated.

• Applied Chemistry for Engineering
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• v.7 no.3
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• pp.490-495
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• 1996

Low molecular weight linear chlorine terminated siloxanes (yields;71.2~86.5%) were prepared by reactions of cyclotri-, cyclotetra- and cyclopentasiloxane with dimethyldichlorosilane in the presence of pyridine N-oxide catalyst. The amine terminated siloxane oligomers were obtained in good yields(76.2~85.3%) by the reaction of linear chlorine terminated siloxanes with dimethylamine at $0^{\circ}C$. In this investigation, we have studied on the syntheses and properties of copolymers (yields;58.0~71.0%) obtained from the reaction of amine terminated siloxane oligomers with 1,4-bis(dimethylhydroxysilyl)benzene. The structures and properties of the copolymers were examined by FT-IR, $^1H$-NMR, TGA and DSC. Initial degradation temperatures($T_D{^i}$) of the polymer I and IV were confirmed as 476 and $485^{\circ}C$, respectively. The thermal stabilities of the polymers were found to be increased with increasing n of $(R_2SiO)_n$. The glass transition temperatures(Tg) of the polymers were increased with decreasing n of $(R_2SiO)_n$, and the lowest Tg revealed $-76^{\circ}C$ when n=5.

• Applied Chemistry for Engineering
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• v.28 no.1
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• pp.73-79
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• 2017

Maleic anhydride (MAH) grafted polypropylene (PP-g-MAH) copolymers were prepared by changing MAH and styrene monomer (SM) content, using a twin screw extruder at $190^{\circ}C$. The grafting degree was measured by non-aqueous back titration method. The grafting degree of PP-g-MAH-SM copolymer was higher than that of PP-g-MAH at the same MAH content. PP-g-MAH-SM/kenaf fiber (KF) composites were also prepared by using a PP-g-MAH as a matrix at $200^{\circ}C$ and the KF content was fixed at 20 wt%. Based on the degradation temperature investigated by TGA, the thermal stability of PP-g-MAH-SM/KF composites was more enhanced than that of PP-g-MAH only. Mechanical properties of the composites were also improved when MAH and SM applied together. The adhesion degree between the copolymer and KF was confirmed by both SEM pictures of the fractured surface and contact angles.

• Polymer(Korea)
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• v.30 no.6
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• pp.478-485
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• 2006

Physical properties and flammability of polyhydroxyamides (PHAs) haying poly (ethylene-glycol) methyl ether (MPEG) and/or dimethylphenoxy pendants were studied by using DSC, TGA, FTIR, pyrolysis combustion flow calorimeter (PCFC), and X-ray diffractometer. The degradation temperatures of the polymers were recorded in the ranges of $276{\sim}396^{\circ}C$ in air. PCFC results showed that the heat release (HR) capacity and total heat release (total HR) values of the PHAs were increased with in-creasing molecular weight of MPEG. In case of M-PHA 2 annealed at $290^{\circ}C$, the values of HR capacity were siginificantly decreased from 253 to 42 J/gK, and 60% weight loss temperatures increased from 408 to $856^{\circ}C$ with an annealing temperature. The activation energy for the decomposition reaction of the PHAs showed in the range of $129.3{\sim}235.1kJ/mol$, which increased with increasing conversion. Tensile modulus of PHAs were decreased as increasing chain of MPEG, and showed an increase more than initial modulus after converted to PBOs.

• Polymer(Korea)
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• v.32 no.1
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• pp.70-76
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• 2008

The PES-g-BTCA membrane was synthesized by UV irradiation method and then used to be modified into the PES anion exchange membrane by the amination reaction. Their chemical structures and adsorption properties were investigated. The degree of grafting and amination were increased with increasing the reaction time and had the maximum values of 138% and 1.20 mmol/g at 80 min, respectively. The initial thermal degradation temperature of PES membrane was $400^{\circ}C$. Which was reduced as the surface modification reaction had proceeded. The values of contact angle for PES membrane were decreased from 68.1 to $40.2^{\circ}$ with increasing the extent of amination, the water up-take and ion exchange capacity were also increased with increasing UV irradiation time until 80 min. The average pore size and BET surface area were decreased in order of PES, PES-g-BTCA, and aminated PES ion exchange membrane. Their average pore sizes were 624.8, 359.7, and 138.5 ${\AA}$, and their surface areas were 10.1,9.7 and 1.7 $m^2/g$, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.55-60
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• 2012

In order to develop electroless-plated Nickel Phosphate (Ni-P) as a contact material for high efficient low-cost silicon solar cells, we evaluated the effect of ambient thermal annealing on the degradation behavior of interfacial adhesion energy between electroless-plated Ni-P and silicon solar cell wafers by applying 4-point bending test method. Measured interfacial adhesion energies decreased from 14.83 to 10.83 J/$m^2$ after annealing at 300 and $600^{\circ}C$, respectively. The X-ray photoelectron spectroscopy analysis suggested that the bonding interface was degraded by environmental residual oxygen, in which the oxidation inhibit the stable formation of Ni silicide phase between electroless-plated Ni-P and silicon interface.

• Korean Chemical Engineering Research
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• v.46 no.1
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• pp.106-111
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• 2008

Polypropylene (PP)/corn starch master batch (starch-MB)/silicate composites with different corn starch compositions of 10, 20, 30, 40 and 50 were prepared by melt compounding at $200^{\circ}C$, using lab scale Brabender mixer. The content of silicate was fixed at 5 wt%. The composition of starch-MB in composites was confirmed by the existence of hydroxy group and peak intensity in fourier-transform-infrared (FT-IR) spectrum. The thermal properties of the PP/starch-MB/silicate composites were investigated by differential scanning calorimetry (DSC), and thermogravimetric analyzer (TGA). There was no district change in melting temperature, and TGA curve indicates a decrease in degradation temperature with the increase of starch-MB content. The silicate dispersion of the composites was measured by X-ray diffraction (XRD) and transmission electron microscope (TEM). The degree of silicate dispersion in PP/starch-MB/silicate composites depended on the content of starch-MB. There was detectable change in d-spacing and peak intensity of the composite when the content of starch-MB was higher than 20 wt%. The rheological behavior of the composites was explained by both shear thinning effect and elastic property with the starch-MB amount. These effects were remarkable when the content of starch-MB was higher than 20 wt%. These were confirmed by an oscillatory viscometer at $200^{\circ}C$.

• Journal of IKEEE
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• v.19 no.4
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• pp.491-499
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• 2015

Silicon Carbide(SiC) has large advantage in high temperature and high voltage applications because of its high thermal conductivity and large band gap energy. When using SiC to design power semiconductor devices, edge termination techniques have to be adjusted for its maximum breakdown voltage characteristics. Many edge termination techniques have been proposed, and the most appropriate technique for SiC device is Junction Termination Extension(JTE). In this paper, the change of breakdown voltage efficiency ratio according to the change of doping concentration and passivation oxide charge of each JTE techniques is demonstrated. As a result, the maximum breakdown voltage ratio of Single Zone JTE(SZ-JTE), Double Zone JTE(DZ-JTE), Multiple Floating Zone JTE(MFZ-JTE), and Space Modulated JTE(SM-JTE) is 98.24%, 99.02%, 98.98%, 99.22% each. MFZ-JTE has the smallest and SZ-JTE has the largest sensitivity of breakdown voltage ratios according to the change of JTE doping concentration. Additionally the degradation of breakdown voltage due to the passivation oxide charge is analyzed, and the sensitivity is largest in SZ-JTE and smallest in MFZ-JTE, too. In this paper, DZ-JTE and SM-JTE is the best efficiency JTE techniques than MFZ-JTE which needs large doping concentration in short JTE width.