• 대한전기학회:학술대회논문집
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• 대한전기학회 2001년도 하계학술대회 논문집 C
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• pp.1667-1669
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• 2001

The clack of Insulator, which results from internal or external surges such as electrical, mechanical, and thermal stress, might cause ground fault and a power failure without proper repairs. In order to minimize losses caused by a short-term or long-term power failure, it is necessary to detect the deteriorated insulator as early as possible. To do so, we will develop a new device, which can detect and trace an deteriorated insulator by monitoring its physical change the variation of frequency spectrum. This device will do so by finding a Periodic wave sharp (120 Hz), a peculiar wave generated by defused electricity.

• 한국산학기술학회논문지
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• 제14권6호
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• pp.2596-2603
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• 2013

타이어 몰드의 내구성과 정밀도는 타이어의 품질을 결정하는 매우 중요한 요인이다. 그러나 타이어 몰드를 제작하는데 있어서 밀폐된 주조장치 안에서 발생하는 주물의 열변형을 측정하는 데는 많은 어려움이 있다. 본 연구에서는 금형주조장치의 예열온도에 따른 타이어 몰드용 AC7A 주조재의 온도분포, 변위, 응력과 같은 열변형을 수치해석을 통해 분석하였고, 동일 조건하에서 AC7A 주조재의 온도분포를 실험을 통해 측정하여 수치해석 결과와 비교하였다. 수치해석을 위해 상용프로그램인 "COMSOL Multiphysics"를 사용하였고, 금형주조장치의 예열온도를 $150^{\circ}C$, $200^{\circ}C$, $250^{\circ}C$, $300^{\circ}C$로 바꾸어 수치해석을 실행하였다. 수치해석 결과 금형주조장치의 예열온도가 $300^{\circ}C$였을 경우에 주조재의 평균변위와 평균응력은 각각 0.25mm와 0.351GPa로 가장 작게 나타났고, 평균온도는 $374.27^{\circ}C$로 온도가 가장 높게 나타나는 것을 확인할 수 있었다. 수치해석에 의한 온도분포 결과와 실험에 의한 온도분포 결과를 비교하였을 때, 냉각 초기에 상변화과정에서 발생하는 잠열로 인해 약간의 온도차이가 발생하였으나, 그 구간을 제외하고는 거의 비슷한 냉각패턴을 나타내는 것을 확인할 수 있었다.

• 마이크로전자및패키징학회지
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• 제25권3호
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• pp.21-30
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• 2018

Driven by the recent energy saving trend, conventional silicon based power conversion modules are being replaced by modules using silicon carbide. Previous papers have focused mainly on the electrical advantages of silicon carbide semiconductors that can be used to design switching devices with much lower losses than conventional silicon based devices. However, no systematic study of their thermomechanical reliability in power conversion modules using finite element method (FEM) simulation has been presented. In this paper, silicon and silicon carbide based power devices with three-phase switching were designed and compared from the viewpoint of thermomechanical reliability. The switching loss of power conversion module was measured by the switching loss evaluation system and measured switching loss data was used for the thermal FEM simulation. Temperature and stress/strain distributions were analyzed. Finally, a thermal fatigue simulation was conducted to analyze the creep phenomenon of the joining materials. It was shown that at the working frequency of 20 kHz, the maximum temperature and stress of the power conversion module with SiC chips were reduced by 56% and 47%, respectively, compared with Si chips. In addition, the creep equivalent strain of joining material in SiC chip was reduced by 53% after thermal cycle, compared with the joining material in Si chip.

• 산업융합연구
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• 제20권10호
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• pp.209-218
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• 2022

마사지 치료는 1회 치료만으로 통증을 경감시키고 스트레스를 이완시킵니다. 그러나 아직까지 1회 마사지 치료의 효과에 대한 객관적인 데이터를 확인한 연구가 없었습니다. 그래서 본 연구에서는 마사지 치료와 동일한 효과가 있는 것으로 보고된 척추 마사지 기구로 1회 치료를 실시하여 통증 경감과 스트레스 이완의 효과의 증거를 확인하고자 하였습니다. 10년 전부터 시각적상사척도 4점의 요통이 있었던 45세 남자 환자 1인을 대상으로 척추 마사지 기구를 실시한 1차 실험과 침상안정을 실시한 2차 실험을 실시하였습니다. 시각적상사척도 측정과 실시간으로 심박 변이도를 측정하여 자율신경계를 확인하였고 총 5회 혈액검사를 실시하여 스트레스 관련 혈액검사(코르티솔, 에피네프린, 노르에피네프린)를 실시하였습니다. 침상안정을 취한 2차 실험에 비해 척추 마사지 기구로 1회 치료를 받은 1차 실험에서 유의미한 통증 감소효과를 보였습니다. 또한 1차 실험에서 자율신경계 활성도 및 부교감 신경계의 활성도가 증가되어 있었으며 혈중 에피네프린과 노르에피네프린이 감소되어 있었습니다. 이것은 기존의 마사지 치료 효과와 동일한 결과이며 1회 척추 마사지 기구를 통해 얻어지는 효과의 증거라 사료됩니다.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2003년도 추계학술발표대회 논문집
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• pp.167-170
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• 2003

In this paper, the electromechanical displacements of curved actuators using laminated composites are calculated by finite element method to design the optimal configuration of curved actuators. To predict the pre-stress in the device due to the mismatch in coefficients of thermal expansion, the carbon-epoxy and glass- epoxy as well as PZT ceramic is also numerically modeled by using hexahedral solid elements. Because the modeling of these thin layers causes the numbers of degree of freedom to increase, large-scale structural analyses are performed in a cluster system in this study. The curved shape and pre-stress in the actuator are obtained by the cured curvature analysis. The displacement under the piezoelectric force by an applied voltage is also calculated to compare the performance of curved actuator. The thickness of composite is chosen as design factor.

• JSTS:Journal of Semiconductor Technology and Science
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• 제15권2호
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• pp.249-254
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• 2015

Solution-derived amorphous indium-gallium-zinc oxide (a-IGZO) thin-film-transistor (TFTs) were developed using a microwave irradiation treatment at low process temperature below $300^{\circ}C$. Compared to conventional furnace-annealing, the a-IGZO TFTs annealed by microwave irradiation exhibited better electrical characteristics in terms of field effect mobility, SS, and on/off current ratio, although the annealing temperature of microwave irradiation is much lower than that of furnace annealing. The microwave irradiated TFTs showed a smaller $V_{th}$ shift under the positive gate bias stress (PGBS) and negative gate bias stress (NGBS) tests owing to a lower ratio of oxygen vacancies, surface absorbed oxygen molecules, and reduced interface trapping in a-IGZO. Therefore, microwave irradiation is very promising to low-temperature process.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2003년도 춘계학술발표대회 논문집
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• pp.87-90
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• 2003

In this paper, the electromechanical displacements of curved actuators such as THUNDER are calculated by finite element method to design the optimal configuration of curved actuators. To predict the pre-stress in the device due to the mismatch in coefficients of thermal expansion, the adhesive as well as metal and PZT ceramic is also numerically modeled by using hexahedral solid elements. Because the modeling of these thin layers causes the numbers of degree of freedom to increase, large-scale structural analyses are performed in a cluster system in this study. The curved shape and pre-stress in the actuator are obtained by the cured curvature analysis. The displacement under the piezoelectric force by an applied voltage is also calculated to compare the performance of curved actuator. The thickness of metal and adhesive, the number of metal layer are chosen as design factors.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 추계학술대회
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• pp.1407-1412
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• 2003

In MEMS devices, packaging induced stress or stress induced structure deformation become increasing concerns since it directly affects the performance of the device. In this paper, deformation behavior of MEMS gyroscope package subjected to temparature change is investigated using high-sensitivity $Moir{\acute{e}}$ interferometry. Using the real-time $Moir{\acute{e}}$ setup, fringe patterns are recorded and analyzed at several temperatures. Temperature dependent analyses of warpages and extensions/contractions of the package are presented. Linear elastic behavior is documented in the temperature region of room temperature to $125^{\circ}C$. Analysis of the package reveals that global bending occurs due to the mismatch of thermal expansion coefficient between the chip, the molding compond and the PCB.

• Current Photovoltaic Research
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• 제9권2호
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• pp.36-44
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• 2021

To endorse the reliability and durability of the solar photovoltaic (PV) device several tests were conducted before exposing to the outdoor field in a non-ideal condition. The PV module has high probability that intend to perform adequately for 30 years under operating conditions. To evaluate the long term performance of the PV module in diversified terrestrial conditions, one should use the outdoor performance data. However, no one wants to wait for 25 years to determine the module reliability. The accelerating stress tests performing in the laboratory by mimicking different field conditions are thus important to understand the performance of a PV module. In this review, we will discuss briefly about different accelerating stress types, levels and prioritization that are used to evaluate the PV module reliability and durability before using them in real field.

• 한국초전도ㆍ저온공학회논문지
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• 제7권2호
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• pp.11-15
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• 2005

The I$_{c}$ degradation behavior of Bi-2223 tapes bent at RT and 77K were investigated using the bending device invented by Goldacker. Test results on fixing the tape at RT and 17K showed no difference. At 17K and RT bending, the critical strain was 0.67 and 0.50$\%$, respectively, for the VAM-l tape. For the AMSC tape, it was 0.94 and 0.88$\%$, respectively. These results show that there is additional residual stress in the superconducting filaments to be bent at 17K which shifts the formation of cracks into smaller bending radii. This was proved by computational analysis based on the mixture rule of composites. For the VAM-l tape, the Ie degradation behavior using the Goldacker type device shifted to higher strain levels at about 0.5$\%$, as compared with the FRP sample holders which have a critical bending strain of about 0.24$\%$. Also, for the externally reinforced AMSC tape, Ie degradation using the Goldacker type device begins at a higher strain level, at 0.88$\%$ as compared with using FRP sample holders, at 0.74$\%$. The difference between both cases can be explained by the tensile' and thermal stresses that the tapes were subjected to during fixing (soldering) when the FRP sample holders were used.