• The Korean Journal of Ceramics
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• v.3 no.3
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• pp.195-198
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• 1997

Post-firing process of electronic ceramic, such as electroding and encapsultion with resin, often causes damage by thermal shock. The thermal shock behavior of $BaTiO_3$ ceramics was investigated by the down-quench test, where the relative strength retained is determined after the sample is quenched from an elevated temperature into a fixed temperature bath. The critical temperature drop, $\DeltaTc$, was evaluated for three kinds of sintered $BaTiO_3$ ceramics, which were formed by extrustioin, uniaxial pressing using granules, and uniaxial pressing using powders. A drastic loss in strength caused by microcracking was observed for the specimens quenched with $\DeltaT\geq150^{\circ}C$. This concentp can be adopted as a method of the quality control by monitoring the sudden drop of the strength of capacitor products after each exposure to heat.

• Journal of the Korean Ceramic Society
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• v.30 no.3
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• pp.229-235
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• 1993

Thermal history and thermal stress of alumina specimen, which occured from thermal shock process, were calculated by finite difference method. Stress intensity factor and crack growth in cyclic thermal fatigue were calculated from single thermal shock temperature history and thermal stress. Cyclic thermal life were estimated by bending strength after cyclic thermal shock under critical thermal shock temperature. Calculated stress intensity factor was compared with real experimental thermal fatigue life of specimen. Fatigue life until critical stress intensity factor and real experimental result were comparable.

• Journal of the Korean Ceramic Society
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• v.36 no.10
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• pp.1062-1068
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• 1999

The flexural strength distribution of alumina ceramics was observed using ball-on-3 ball test after thermal shock into the distilled water of 25$^{\circ}C$ Crack distribution was also observed by dye-penetration after thermal shock test. Fracture probability of alumina ceramics by ball-on-3 ball test was studied and compared with that by 3-point bending test. The crack distance from the center of thespecimen showed the stronger effect on the flexural strength by ball-on-3 ball test than the crack density.

• Korean Journal of Materials Research
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• v.17 no.3
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• pp.152-159
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• 2007

When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between $-40^{\circ}C\;and\;+125^{\circ}C$ for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and $45^{\circ}$ lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.

• Transactions of Materials Processing
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• v.11 no.1
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• pp.61-68
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• 2002

The thermal shock and thermal fatigue test has been carried out to analyze the thermal characteristics of tool steels for hot forging and the effects of mechanical properties on this study have been investigated. The resistance to thermal shock is first of all a matter of good toughness and ductility. Therefore, a proper hot-work tool steel should be characterized by high fracture strength and high temperature toughness. Based on these results, some critical temperature($T_{fracture}$) at which fracture occur can be measured to characterize the thermal resistance of the materials. During thermal fatigue tests, the thermal fatigue cracks occur because of the repetitive heating and cooling of the die surface and the thermal fatigue damage was evaluated by analyzing different number of cycles to failure. The results showed that the resistance to thermal shock and thermal fatigue were found to be favoured by high hot tensile strength and high hot hardness, and thermal resistance of SKD61 was superior to that of ESC, SKT4 and this was caused by higher mechanical properties of SKD61.

• Journal of the Korean Ceramic Society
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• v.37 no.3
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• pp.201-204
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• 2000

Thermal shock resistance of 80Al2O3-20Al composite and monolithic alumina ceramics was compared. Fracture strength was measured by using a 4-pont bending test after quenching. Thermal stresses of the ceramics and ceramic-metal composites were calculated using a finite element analysis. The bending strength of the Al2O3 ceramics decreased catastropically after quenching from 20$0^{\circ}C$ to $0^{\circ}C$. The bending strength of the composite also decreased after quenching from 200~2$25^{\circ}C$, but the strength reduction was much smaller than for Al2O3. The maximum thermal stress occured in the monolithic alumina ceramics when exposed to a temperature difference of 20$0^{\circ}C$ was 0.758 GPa. The same amount of stress occured in the Al2O3-Al composite when the temperature difference of 205$^{\circ}C$ used.

• Journal of the Korean Ceramic Society
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• v.27 no.1
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• pp.102-108
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• 1990

WC-Co composites are widely used as cutting or drilling tools because of their high hardness, strength, and fracture toughness. The working temperature is, however, generally in the range of 300-$700^{\circ}C$ so thermal shock fracture of WC-Co can occur. In this study, the strength, fracture toughness and fracture surface of 16wt% Co bonded tungsten carbide composites before and after thermal shock were observed.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2005.11a
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• pp.79-82
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• 2005

In this study, mechanical properties of carbon fabrics composite under the thermal shock cycling were evaluated. Due to the interactions between fiber and polymer matrix, it is reasonable to conclude that both thermal cycles of thermal shock result in improvement of interlaminar shear strength(ILSS) for the longer conditioning time duration. The rise in ILSS may be attributed to the improved adhesion by cryogenic compressive stress and also by the post-curing strengthening effect. However, the flexural and tensile strength were decreased with increasing conditioning time of thermal cycle.

• Composites Research
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• v.27 no.3
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• pp.83-89
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• 2014

The purpose of this study is to improve the strength and thermal conductivity of polybutylene terephthalate (PBT) by embedding various additives. Specimens were prepared using PBT pellets embedded with glass fibers (GF) and boron nitride (BN) powders. The test results showed that tensile strength decreased, and thermal conductivity increased with increasing BN contents. with thermal shock cycles conducted, unfilled PBT showed a considerable decrease in failure strain and strength, whereas strength and thermal conductivity of glass fiber and BN particle-embedded PBT had little differeces. With increasing BN, the thermal conductivity of PBT composites was highly improved.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.8
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• pp.1189-1196
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• 2001

The objective of this paper is to investigate the applicability of acoustic emission(AE) technique to monitor the progress of the thermal shock damage on alumina ceramic. For this purpose, alumina ceramic specimen was heated in the furnace and then was quenched in the water tank. When the specimen was quenched in the water tank, complex AE signals due to the initiation of micro-cracks and boiling effect were generated by the progress of thermal shock damage. These mixed AE signals have to be classified for monitoring the degree of the thermal shock damage of alumina ceramics. In this paper, the mixed AE signals generated from both the boiling effect and the crack initiation under thermal shock test was analyzed. The characteristics of AE signals were also discussed by considering the variation of bending strength and Yongs modulus of specimens.