• 대한조선학회논문집
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• 제51권3호
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• pp.212-219
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• 2014

As subsea production has been revived up, the demand of subsea equipment has also been increased. Among the equipment, subsea tree plays a major role in safety. The tubing hanger is one of the most important components in subsea tree. In this study structural reliability analysis on dual bore tubing hanger of subsea tree is performed. The target reliability which is introduced in ISO regulation is used for judging whether tubing hanger is safe or not. The considered loads are working pressure, working temperature and suspended tubing weight. Thermal-stress analysis on tubing hanger is performed and kriging model is created based on the results of FEM analysis. According to von Mises criterion, limit state equation can be estimated. Reliability analysis is performed by using level 2 method and the result is verified by that of Monte Carlo Simulation. For finding most probable failure point, enhanced HL-RF method is adopted. Because the reliability of model doesn't reach target reliability, an improvement measure should be considered. Thus, it is suggested to change the material of tubing hanger main body to AISI 4140.

• Journal of Welding and Joining
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• 제35권3호
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• pp.15-20
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• 2017

In this paper, two types of assemblies using CNT-filled SACAs (with 0.03 wt% CNTs and without CNT) were prepared to investigate the influence of carbon nanotubes (CNTs) on the reliability properties of solderable anisotropic conductive adhesives (SACAs) with a low-melting-point alloy (LMPA). Two types of reliability test including thermal shock (TS: -55 to $125^{\circ}C$, 1000 cycles) and high-temperature and high-humidity (HTHH: $85^{\circ}C$, 85% RH, 1000 h) tests were conducted. The SACA assemblies with and without CNTs showed stable electrical reliability properties due to the formation of wide and stable metallurgical interconnection between corresponding metallizations by the molten LMPA fillers. Although the mechanical pull strength of CNT-filled SACA assemblies was decreased after thermal aging (because of the excessive layer growth and planarization of the IMCs), the CNT-filled SACA with 0.03wt% CNTs showed enhanced mechanical reliability properties compared with the SACA assemblies no CNTs. This enhancement in mechanical performance was due to the reinforcement effect of the CNTs. These results demonstrate that CNTs within the CNT-filled SACAs can improve the reliability properties of CNT-filled SACAs joints due to their superior physical properties.

• 신재생에너지
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• 제16권4호
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• pp.49-64
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• 2020

Photovoltaic and Thermal collector (PV/T) systems are renewable energy devices that can produce electricity and heat energy simultaneously using solar panels and heat exchangers. Since PV/T systems are exposed to the outdoors, their reliability is affected by various environmental factors. This paper presents a reliability test for a PV/T system and evaluates the test results. The reliability assessment entails performance, environment, safety, and life tests. The factor that had the greatest influence on the life of the system was the hydraulic pressure applied to the heat exchanger. A test was conducted by repeatedly applying pressure to the PV/T system, and a reliability analysis was conducted based on the test results. As a result, the shape parameter (β) value of 5.6658 and the B10life 308,577 cycles at the lower 95% confidence interval were obtained.

• 마이크로전자및패키징학회지
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• 제12권1호
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• pp.9-16
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• 2005

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

• 대한금속재료학회지
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• 제47권12호
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• pp.842-851
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• 2009

The long-term reliability of Sn-0.3wt%Ag-0.7wt%Cu solder joints was evaluated and compared with Sn-3.0wt%Ag-0.5wt%Cu under thermal shock conditions. Test vehicles were prepared to use Sn-0.3Ag-0.7Cu and Sn-3.0Ag-0.5Cu solder alloys. To compare the shear strength of the solder joints, 0603, 1005, 1608, 2012, 3216 and 4232 multi-layer ceramic chip capacitors were used. A reflow soldering process was utilized in the preparation of the test vehicles involving a FR-4 material-based printed circuit board (PCB). To compare the shear strength degradation following the thermal shock cycles, a thermal shock test was conducted up to 2,000 cycles at temperatures ranging from $-40^{\circ}C$ to $85^{\circ}C$, with a dwell time of 30 min at each temperature. The shear strength of the solder joints of the chip capacitors was measured at every 500 cycles in each case. The intermetallic compounds (IMCs) of the solder joint interfaces werealso analyzed by scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS). The results showed that the reliability of Sn-0.3Ag-0.7Cu solder joints was very close to that of Sn-3.0Ag-0.5Cu. Consequently, it was confirmed that Sn-0.3Ag-0.7Cu solder alloy with a low silver content can be replaced with Sn-3.0Ag-0.5Cu.

• 조명전기설비학회논문지
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• 제28권3호
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• pp.26-31
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• 2014

High temperature fuel cell system, such as molten carbonate fuel cells(MCFC) and solid oxide fuel cells(SOFC), are capable of operating at MW rated power output. The power output change of high temperature fuel cell imposes the thermal and mechanical stresses on the fuel cell stack. To minimize the thermal-mechanical stresses on the stack and increase the systems reliability, we should divide the power plant configuration to several banks. However, the improvement of reliability in fuel cell power plant system causes an increase of the investment cost, for example, replacement costs, labor costs, and so on. For this reason - the balance between investment and reliability improvement - many studies about the appropriate level of investment have been conducted. In this paper, we evaluate the cost for operation and installation, the benefit for electric energy and thermal energy sales, and the system reliability for several cases : these cases relate with the bank configuration.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.115-118
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• 2000

In case of developing new motor, many examinations was tested to decide a motor efficiency and reliability. To give reliability judgment, traction motor winding insulation was tested by electrical method after appling electrical, heat, mechanical, environmental stress. In this study, stator form-wound winding of traction motor in urban transit E.M.U was tested by accelerative thermal degradation test. Stator form-wound winding was tested on the accelerative degradation composed of heat, vibration, moisture, overvoltage and researched insulation resistance, dielectric loss, partial discharge for insulation degradation properties, evaluated withstand voltage. Degradation temperature was $230[^\circ{C}]$, $250[^\circ{C}]$, $270[^\circ{C}]$, for stator form-wound winding respectively. On the test results of accelerative thermal degradation, insulation properties were relied all temperature until 10 times and expected life was evaluated by the rule of reducing $10[^\circ{C}]$ life into halves. Expected life was 31.8 years. It is guaranteed insulation reliability because of exceeding 25 years life times as considering.

• 한국전기전자재료학회논문지
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• 제33권2호
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• pp.88-92
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• 2020

Thermal effects in bulk and SOI FinFETs are briefly reviewed herein. Different techniques to measure these thermal effects are studied in detail. Self-heating effects show a strong dependency on geometrical parameters of the device, thereby affecting the reliability and performance of FinFETs. Mobility degradation leads to 7% higher current in bulk FinFETs than in SOI FinFETs. The lower thermal conductivity of SiO₂ and higher current densities due to a reduction in device dimensions are the potential reasons behind this degradation. A comparison of both bulk and SOI FinFETs shows that the thermal effects are more dominant in bulk FinFETs as they dissipate more heat because of their lower lattice temperature. However, these thermal effects can be minimized by integrating 2D materials along with high thermal conductive dielectrics into the FinFET device structure.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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• pp.89-98
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• 2001

Pb-free wave soldering process of AC Adapter was implemented by six sigma method using Sn-Cu-Ni type solder. The solder joint appearance, microstructural change, a lift-off phenomenon and reliability were evaluated through thermal shock teal. $(Cu,Ni)_6Sn_5$-type intermetallic compound of which thickness is about 5 micron was found at solder joint between Sn-Cu-Ni solder and copper land. After applying the thermal shock test of as-soldered product up to 750 cycles, no crack was found at the solder joint and the newly developed product was superior to conventions; one in terms of productivity and reliability.