• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1395-1400
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• 2003

This paper introduces a novel scheme for determining the thermal diffusivity of solids using the photothermal mirage technique. The suggested scheme extends the thermal-wave coupling method, employing the solution to the heat conduction equation in close proximity to the pump beam. Therefore, determination of thermal diffusivity is possible by detecting the mirage signal with small separation between the probe and pump beams, with enhanced intensity of the mirage signal. Though the method requires information about the probe-beam height, the absolute transverse position of the probe beam need not be known as it is automatically evaluated by the iterative-computation procedure. The thermal diffusivity of Ni is measured by the proposed scheme and the result demonstrates good agreement with the literature value to within 5 %.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.10 no.4
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• pp.70-75
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• 2001

In metal cutting, the machining accuracy is more affected by thermal errors than by geometric errors. This paper models of the thermal errors for error analysis and develops on-the-machine measurement system by which the volumetric error are measured and compensated. The thermal error is modeled by means of angularity errors of a column and thermal drift error of the spindel unit which are measured by the touch probe unit with a star type styluses, a designed spherical ball arti-fact, and five gap sensors. In order to analyze the thermal characteristics under several operating conditions, experiments performed with the touch probe unit and five gap sensors on the vertical and horizontal machining centers.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.11
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• pp.4121-4128
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• 2010

A probe card is used in testing semiconductor wafers. It must maintain a precise location tolerance for a fine pitch due to highly densified chips. However, high heat transferred from its lower chuck causes thermal deformations of the probe card. Vertical deformation due to the heat will bring contact problems to the pins in the probe card, while horizontal deformation will cause positional inaccuracies. Therefore, probe cards must be designed with proper materials and structures so that the thermal deformations are within allowable tolerances. In this paper, heat transfer analyses under realistic loading conditions are simulated using ANSYS$^{TM}$ finite element analysis program. Thermal deformations are calculated based on steady-state temperature gradients, and an optimal structure of the probe card is proposed by adjusting a set of relevant design parameters so that the deformations are minimized.

• Korean Journal of Materials Research
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• v.29 no.9
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• pp.547-552
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• 2019

In the present study, the thermal conductivity of a silicon nitride($Si_3N_4$) thin-film is evaluated using the dual-wavelength pump-probe technique. A 100-nm thick $Si_3N_4$ film is deposited on a silicon (100) wafer using the radio frequency plasma enhanced chemical vapor deposition technique and film structural characteristics are observed using the X-ray reflectivity technique. The film's thermal conductivity is measured using a pump-probe setup powered by a femtosecond laser system of which pump-beam wavelength is frequency-doubled using a beta barium borate crystal. A multilayer transient heat conduction equation is numerically solved to quantify the film property. A finite difference method based on the Crank-Nicolson scheme is employed for the computation so that the experimental data can be curve-fitted. Results show that the thermal conductivity value of the film is lower than that of its bulk status by an order of magnitude. This investigation offers an effective way to evaluate thermophysical properties of nanoscale ceramic and dielectric materials with high temporal and spatial resolutions.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.23 no.5
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• pp.356-364
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• 2011

Storage and transfer heat in soils is governed by the soil thermal properties and these properties are therefore needed in many engineering applications, including horizontal ground heat exchanger for ground-coupled heat pumps. This paper presents the evaluation results of the thermal diffusivity of soils (silica, quartzite, limestone, sandstone, granite, and two masonry soils used for the trench backfilling materials of the horizontal ground heat exchanger. To assess this thermal property, we (i) measure the soil thermal conductivities using single-probe method and (ii) use the de Vries method of summing the heat capacities of the soil constituents. The results show that the thermal diffusivity tends to increase as dry soil begins to wet, but it approaches a constant value or even decreases as the soil continues to wet. Combined algorithm with and improved model for the thermal conductivity of soils and the constituent equation provides accurate estimates of the soil thermal diffusivity.

• Transactions of the Korean Society of Automotive Engineers
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• v.6 no.6
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• pp.267-275
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• 1998

In this study, the instantaneous heat flux measurement probe and the linkage system for the measurement of the instantaneous temperature and heat flux of the DI mono cylinder diesel engine were developed, and these were proved to have a good reliability and sensibility. A 3-D FEM model which consist of full piston to accommodate the eccentric bowl in the piston head, was applied for the analysis of the thermal stress and the temperature distribution. The mean heat flux on the piston head was used as boundary condition for the analysis of piston. The analysis showed that thermal stress concentrate on the bowl and inner surface of pin hall.

• International Journal of Precision Engineering and Manufacturing
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• v.1 no.1
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• pp.111-117
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• 2000

One of the major limitations of productivity and quality in metal cutting is the machining accuracy of machine tools. The machining accuracy is affected by geometric errors, thermally-induced errors, and the deterioration of the machine tools. Geometric and thermal errors of machine tools should be measured and compensated to manufacture high quality products. In metal cutting, the machining accuracy is more affected by thermal errors than by geometric errors. This paper models the thermal errors for error analysis and develops an on-the-machine measurement system by which the volumetric errors are measured and compensated. The thermal error is modeled by means of angularity errors of a column and thermal drift error of the spindle unit which are measured by the touch probe unit with a star type styluses and a designed spherical ball artifact (SBA). Experiments show that the developed system provides a high measuring accuracy, with repeatability of $\pm$2$\mu\textrm{m}$ in X, Y and Z directions. It is believed that the developed measurement system can be also applied to the machine tools with CNC controller. In addition, machining accuracy and product quality can be also improved by using the developed measurement system when the spherical ball artifact is mounted on a modular fixture.

• Proceedings of the SAREK Conference
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• 2008.11a
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• pp.39-44
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• 2008

The heat exchange between the Borehole Heat Exchanger(BHE) and the surrounding ground depends directly on ground thermal conductivity k at the certain site. The k is thus a key parameter in designing BHE and coupled geothermal heat pump systems. Currently, although a thermal hydraulic response test(TRT) is mostly used in practice, the thermal hydraulic TRT needs additional power and is generally time-consuming. A new, simple wireless P/T probe for a hi-speed k determination was introduced in this paper. This technique using a wireless P/T probe is less time-consuming and requires no external source of energy for measurement and predicts local thermal properties by measuring soil temperatures along the depth. Measured temperature data along the depth was analyzed. In order to verify the new technique for the determination of ground thermal conductivity, ground thermal conductivity k that calculated from the measured temperature data using a wireless P/T probe was compared with one obtained from conventional hydraulic TRT. When comparing the average k of two methods, the relative error was approximately 10%. As a result, the electronic TRT can replace the conventional hydraulic TRT method after carrying out the additional research on a lot of sites.

• Journal of Mechanical Science and Technology
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• v.20 no.3
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• pp.297-309
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• 2006

This paper deals with a novel structure for single-cell characterization which makes use of bimorph micro thermal actuators combined with electrical sensor device and integrated microfluidic channel. The goal for this device is to capture and characterize individual biocell. Quantitative and qualitative characteristics of bimorph thermal actuator were analyzed with finite element analysis methods. Furthermore, optimization for the dimension of cantilevers and integrated parallel probe systems with microfluidic channels is able to be realized through the virtual simulation for actuation and the practical fabrication of prototype of probes. The experimental value of probe deflection was in accordance with the simulated one.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2000.10a
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• pp.449-453
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• 2000

In metal cutting, the machining accuracy is more affected by thermal errors than by geometric errors. This paper models of the thermal errors for error analysis and develops on-the-machine measurement system by which the volumetric error are measured and compensated. The thermal error is modeled by means of angularity errors of a column and thermal drift error of the spindle unit which are measured by the touch probe unit with a star type styluses, a designed spherical ball artifact, and five gap sensors. In order to analyze the thermal characteristics under several operating conditions, experiments performed with the touch probe unit and five gap sensors on the vertical and horizontal machining centers.