• 전기학회논문지
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• 제65권5호
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• pp.738-744
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• 2016

Current rating of a power cable can be calculated by the maximum allowable temperature in an insulating material considering the heat transfer from cable conductor. Therefore, it is very important to calculate the current rating using electrical equivalent circuit by calculated cable thermal circuit parameters but, it has not been fully investigated yet. In this paper, in order to determine the current rating of power cable, conventional calculation method has been reviewed considering the conductor resistance, loss factor of sheath, dielectric losses and thermal resistances based on the maximum allowable temperature of 345 kV $2500mm^2$ XLPE cable. To confirm the calculation result of the current rating, the conductor temperature should be examined whether it reaches the maximum allowable temperature by the thermal equivalent circuit of the cable. Then, utilizing EMTP (Electro-Magnetic Transient Program) which is a conventional program for electrical circuit, the thermal equivalent circuit was transformed to an electric equivalent circuit using an analogous relationship between thermal circuit and electrical circuit, and temperature condition including cable conductor, sheath, cable jacket could be calculated by the current rating of 345 kV $2500mm^2$ XLPE cable.

• 대한금속재료학회지
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• 제48권10호
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• pp.901-906
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• 2010

The first stage blade of a gas turbine was operated under a severe environment which included both $1300^{\circ}C$ hot gas and thermal stress. To obtain high efficiency, a thermal barrier coating (TBC) and an internal cooling system were used to increase the firing temperature. The TBC consists of multi-layer coatings of a ceramic outer layer (top coating) and a metallic inner layer (bond coat) between the ceramic and the substrate. The top and bond coating layer respectively act as a thermal barrier against hot gas and a buffer against the thermal stress caused by the difference in the thermal expansion coefficient between the ceramic and the substrate. Particularly, the bondcoating layer improves the resistance against oxidation and corrosion. An inter-diffusion layer is generated between the bond coat and the substrate due to the exposure at a high temperature and the diffusion phenomenon. A thickness measurement result showed that the bond coat of the suction side was thicker than that of the pressure side. The thickest inter-diffusion zone was noted at SS1 (Suction Side point 1). A chemical composition analysis of the bond coat showed aluminum depletion around the inter-diffusion layer. In this study, we evaluated the properties of the bond coat and the degradation of the coating layer used on a $1300^{\circ}C$-class gas turbine blade. Moreover, the operation temperature of the blade was estimated using the Arrhenius equation and this was compared with the result of a thermal analysis.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2005년도 제36회 하계학술대회 논문집 C
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• pp.1977-1979
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• 2005

열저항 측정법에는 정상상태보다는 과도응답 특성을 이용하는 것이 우수한 것으로 20년부터 알려져 왔다. 온도를 시간의 함수로 나타내는 열적 계단응답함수를 이용하면 칩에서 주위 분위기, 냉각장치 또는 마운트를 포함한 열 임피던스를 측정할 수 있다. 소자 접합부의 열적 동특성을 측정함으로써 칩 주변의 기하학적 물질에 대한 특성을 파악할 수 있으며 나아가 측정으로부터 소자의 열적 구조를 유추할 수 있다. 본 논문에서는 열적 계단응답 특성을 이용한 열 임피던스 측정이론 및 원리에 대해서 개관하였다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 추계학술발표강연 및 논문개요집
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• pp.24-24
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• 2003

Research activity in the III-V nitrides materials system has increased markedly in the past several years ever since high-brightness blue light-emitting diodes (LEDs) became commercially available. Despite of excellent optical properties of the GaN, however, inherently poor thermal property of the sapphire used as a substrate material n these devices may lead to thermal degradation of devices, especially during their high power operation. Therefore, dependable thermal analysis and packaging schemes of GaN-based LEDs are necessary for solid lighting applications under high power operation. In this paper, emphasis will be placed upon thermal design of GaN-based LEDs. Thermal measurements of LEDs on chip and packaging scale were performed using the liquid crystal thermographic technology and micro thermocouples for different bias conditions. By a series of optical arrangement, hot spots with specific transition temperatures were obtained with increasing input power. Thermal design of LEDS was made using the finite element method and analytical unit temperature profile approach with optimal boundary conditions. The experimental results were compared to the simulated data and the results agree well enough for the establishment of dependable prediction of thermal behavior in these devices. The paper will present a more detailed understanding of the thermal analysis of the GaN-based blue and white LEDs for high power applications.

• Nuclear Engineering and Technology
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• 제54권10호
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• pp.3732-3744
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• 2022

To investigate the effects of ocean conditions on the thermal stress and deformation caused by thermal stratification of a pressurizer surge line in a floating nuclear power plant (FNPP), the finite element simulation platform ANSYS Workbench is utilized to conduct the fluid-solid-thermal coupling transient analysis of the surge line under normal "wave-out" condition (no motion) and under ocean conditions (rolling and pitching), generating the transient response characteristics of temperature distribution, thermal stress and thermal deformation inside the surge line. By comparing the calculated results for the three motion conditions, it is found that ocean conditions can significantly improve the thermal stratification phenomenon within the surge line, but may also result in periodic oscillations in the temperature, thermal stress, and thermal deformation of the surge line. Parts of the surge line that are more susceptible to thermal fatigue damage or failure are determined. According to calculation results, the improvements are recommended for pipeline structure to reduce the effects of thermal oscillation caused by ocean conditions. The analysis method used in this study is beneficial for designing and optimizing the pipeline structure of a floating nuclear power plant, as well as for increasing its safety.

• Journal of Power Electronics
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• 제16권2호
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• pp.685-694
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• 2016

This paper presents a reliability assessment model for the power semiconductors used in wind turbine power converters. In this study, the thermal loadings at different timescales of wind speed are considered. First, in order to address the influence of long-term thermal cycling caused by variations in wind speed, the power converter operation state is partitioned into different phases in terms of average wind speed and wind turbulence. Therefore, the contributions can be considered separately. Then, in regards to the reliability assessment caused by short-term thermal cycling, the wind profile is converted to a wind speed distribution, and the contribution of different wind speeds to the final failure rate is accumulated. Finally, the reliability of an actual power converter semiconductor for a 2.5 MW wind turbine is assessed, and the failure rates induced by different timescale thermal behavior patterns are compared. The effects of various parameters such as cut-in, rated, cut-out wind speed on the failure rate of power devices are also analyzed based on the proposed model.

• 한국전기전자재료학회논문지
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• 제14권3호
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• pp.228-233
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• 2001

This paper presents the optimized design, fabrication and thermal characteristics of micro-heaters for thermal MEMS (micro elelctro mechanical system) applications usign SOI (Si-on-insulator) and trench structures. The micro-heater is based on a thermal measurement principle and contains for thermal isolation regions a 10㎛ thick Si membrane with oxide-filled trenches in the SOI membrane rim. The micro-heater was fabricated with Pt-RTD (resistance thermometer device) on the same substrate by suing MgO as medium layer. The thermal characteristics of the micro-heater wit the SOI membrane is 280$\^{C}$ at input power 0.9W; for the SOI membrane with 10 trenches, it is 580$\^{C}$ due to reduction of the external thermal loss. Therefore, the micro-heater with trenches in SOI membrane rim provides a powerful and versatile alternative technology for improving the performance of micro-thermal sensors and actuators.

• 한국우주과학회:학술대회논문집(한국우주과학회보)
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• 한국우주과학회 2004년도 한국우주과학회보 제13권2호
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• pp.270-273
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• 2004

The initial thermal analysis needs to be fast and efficient to reduce the feedback time for the optimal electronic equipment designing. In this study, a thermal model is developed by using power consumption measurement values of each functional breadboard, that is, semi-empirical power dissipation method. In modeling heat dissipated EEE parts, power dissipation is imposed evenly on the EEE part footprint area which is projected to the printed circuit board, and is called surface heat model. The application of these methods is performed in the development of a command and telemetry unit (CTU) for a geostationary satellite. Finally, the thermal cycling test is performed to verify the applied thermal analysis methods.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.569-572
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• 2000

This paper presents the optimized fabrication and thermal characteristics of micro-heaters for thermal MEMS applications using a SDB SOI substrate. The micro-heater is based on a thermal measurement principle and contains for thermal isolation regions a 10$\mu\textrm{m}$ thick silicon membrane with oxide-filled trenches in the SOI membrane rim. The micro-heater was fabricated with Pt-RTD(Resistance Thermometer Device)on the same substrate by using MgO as medium layer. The thermal characteristics of the micro-heater with the SOI membrane is 280$^{\circ}C$ at input Power 0.9 W; for the SOI membrane with 10 trenches, it is 580$^{\circ}C$ due to reduction of the external thermal loss. Therefore, the micro-heater with trenches in SOI membrane rim provides a powerful and versatile alternative technology for improving the performance of micro thermal sensors and actuators.

• 전력전자학회:학술대회논문집
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• 전력전자학회 1999년도 전력전자학술대회 논문집
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• pp.608-613
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• 1999

This thesis aims at developing of a digita governor system for the steam turbine generator on the Buk-Cheju Thermal Power Plant of KEPCO. The steam turbine generator of the Buk-Cheju Thermal Power Plant is modelled. As a hardware platform, a triple modular system which is fitted 32-bit microprocessor of Motorola company to perform the digital governor system is used. The parameters of the PID controller algorithm in the speed control block is tuned on the basis of the estimated model.