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Jeon, Jong-Wook;Park, Byung-Gook;Shin, Hyung-Cheol
- JSTS:Journal of Semiconductor Technology and Science
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- v.10 no.3
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- pp.225-231
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- 2010
In this paper, we investigate the channel thermal noise in nanoscale MOSFETs. Simple analytical model of thermal noise factor in nanoscale MOSFETs is presented and it is verified with accurately measured noise data. The noise factor is expressed in terms of the channel conductance and the electric field in the gradual channel region. The proposed noise model can predict the channel thermal noise behavior in all operating bias regions from the long-channel to nanoscale MOSFETs. From the measurement results, we observed that the thermal noise model for the long-channel MOSFETs does not always underestimate the short-channel thermal noise.
https://doi.org/10.5573/JSTS.2010.10.3.225 인용 PDF KSCI

Ji, Hyun-Jin
- Journal of the Korea Institute of Military Science and Technology
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- v.11 no.1
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- pp.102-111
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- 2008
This paper describes the basic model and simulation results of thermal battery. Voltage and thermal analysis is a critical part of thermal-battery design because of the need to maintain the inner temperature above the electrolyte melting point. Traditionally, battery design has depended on an empirical approach, in which prototype batteries are outfitted with thermocouples and the design of subsequent batteries is refined accordingly. We have developed the basic model that allows the design engineer to configure or modify a battery, quickly conduct a thermal analysis, and efficiently review the results. Based on performance tests, the thermal-battery model was established and the effect of design parameters on battery performance was analyzed.
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고태조;김희술;김형식;김선호
- Proceedings of the Korean Society of Precision Engineering Conference
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- 1997.10a
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- pp.375-379
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- 1997
Thermal drift of the machine tool spindle due to temperature increase dominates the major source of the machine tool error. To compensate the thermal errors, software based error correction methods could be implemented. In th~s case, we need model to map the relationship between temperature and thermal distortion. Traditionally, two or three different methods have been trled: step increase of spindle speed, constant, random. The latter two methods are described in the document of ISOlDIS230-3. In this research, three different methods were verified through the experiments from the viewpoint of compensation of thermal distortion. Constant spindle speed turned out good enough for monitoring the behavior of the thermal drift and modeling the relationship between temperature and thermal distortion.
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