• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.11 no.6
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• pp.664-670
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• 2018

In modern society, CCTV, which is the eye of surveillance, is being used to collect image data in various ways in daily life. CCTV is used not only for security, surveillance, and crime prevention but also in many fields such as automobile and black box. In this paper, we have developed a STM32F407 ARM chip based camera system for various applications. In order to develop camera system, modeling of camera system based on 3D structure was carried out in SolidWorks environment. The PCB board design was developed to extract the PCB parts from the camera system modeling files into iges files, convert them from the Altium Designer tool into 3D and 2D boards, After designing the camera system circuit and PCB, we have been studying the implementation of the stable system by using TRM (Thermal Risk Management) tool to cope with the heat simulation generated on the board.

• Journal of the Korean Society of Industry Convergence
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• v.24 no.6_2
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• pp.927-935
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• 2021

This study conducted a study to improve the problems of the existing fire sensor system. In the case of the existing system, it took more than 3 minutes to detect a fire even at a short distance, making it difficult to extinguish the initial fire. In order to improve these problems, in this study, a fire detection system using an infrared thermal imaging camera was studied. The infrared image-based fire detection system is relatively wide and can detect fire over a long distance, so it has the advantage of being applicable to many fire detection systems. As a result of conducting a field test using the fire detection system, a fire that occurred about 2 km ahead was detected within about 10 seconds. Since the fire detection function of this system can detect within 10 seconds from a distance of about 2 km, it was applicable to forest fires that occur frequently in spring and autumn.

• IEMEK Journal of Embedded Systems and Applications
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• v.17 no.1
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• pp.33-40
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• 2022

With the recent increase in the development of military drones, they are adopted and used as the combat system of battalion level or higher. However, it is difficult to use drones that can be used in battles below the platoon level due to the current conditions for the formation of units in the Korean military. In this paper, therefore, we developed a program drones equipped with a thermal imaging camera and LiDAR sensor for reconnaissance and exploration that can be applied in battles below the platoon level. Using these drones, we studied the possibility and feasibility of drones for small-scale combats that can find hidden enemies, search for an appropriate detour through image processing and conduct reconnaissance and search for battlefields, hiding and cover-up through image processing. In addition to the purpose of using the proposed drone to search for an enemies lying in ambush in the battlefield, it can be used as a function to check the optimal movement path when a combat unit is moving, or as a function to check the optimal place for cover-up or hiding. In particular, it is possible to check another route other than the route recommended by the program because the features of the terrain can be checked from various viewpoints through 3D modeling. We verified the possiblity of flying by designing and assembling in a form of adding LiDAR and thermal imaging camera module to a drone assembled based on racing drone parts, which are open source hardware, and developed autonomous flight and search functions which can be used even by non-professional drone operators based on open source software, and then installed them to verify their feasibility.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.1 no.2
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• pp.27-31
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• 2000

Thermal imaging system is implemented for the measurement and the analysis of the thermal distribution of the target objects. The main Part of the system is thermal camera in which a focal plane array typed sensor is introduced The sensor detects mid-range infrared spectrum or target objects and then it output generic video signal which should be processed to form a thermal image frame. A digital signal processor(DSP) in the system inputs analog to digital converted data. performs algorithms to improve the thermal images and then outputs the corrected frame data to frame buffers for NTSC encoding and for digital outputs.. To enhance the quality of the thermal images, two point correction method is applied. Figures indicate that the corrected thermal images are much improved.

• Proceedings of the Korean Geotechical Society Conference
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• 2010.03a
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• pp.1324-1333
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• 2010

This paper is used in a recent civil engineering field in three-dimensional laser-meter tiles using thermal imaging cameras for the weathered rock slopes precisely measured indirectly, to the degree that began in the will. In the field is difficult to access the degree of weathering of the rock slope to the existing direct way to compensate for the shortcomings of 3D Terrestrial Laser Scanner and weathering characteristics of rocks using thermal imaging cameras to get the information to analyze the degree of rock weathering is. Intensity of 3D TLS and the thermal camera with image analysis to analyze the degree of weathering of bedrock in the field of core drilling targeting indoor laboratory tests were analyzed through the study. Granite, gneiss, sandstone, much of the cancerous samples, each experiment has a 40 per category, each of which 30 were used to analyze the data collected. That degree of rock weathering, the rock, depending on the strength of the Intensity values can change, depending on the level of thermal imaging camera, also weathered the changes in temperature could see. Intensity is the strength of weak rocks, the more value decrease, the temperature of the thermal imaging camera through the swell Intensity and notice that the temperature had an inverse relationship. Intensity value of the low strength of weak rock, but the value came out of the rocks have been proved to be largely dependent on the contrast. The contrast of the surface rocks are weathered dark Intensity values lower temperature to swell the contrary, the degree of weathering can be distinguished.

• Journal of Institute of Control, Robotics and Systems
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• v.6 no.5
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• pp.396-403
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• 2000

A thermal imaging system is implemented for the measurement and the analysis of the thermal distribution of the target objects. The main part of the system is a thermal camera in which a focal plane array typed sensor is introduced. The sensor detects the mid-range infrared spectrum of target objects and then it outputs a generic video signal which should be processed to form a frame thermal image. Here, a digital signal processor(DSP) is applied for the high speed processing of the sensor signals. The DSP controls analog-to-digital converter, performs correction algorithms and outputs the frame thermal data to frame buffers. With the frame buffers can be generated a NTSC signal and transferred the frame data to personal computer(PC) for the analysis and a monitoring of the thermal scenes. By performing the signal processing functions in the DSP the overall system achieves a simple configuration. Several experimental results indicate the performance of the overall system.

• Proceedings of the KWS Conference
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• 2006.05a
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• pp.148-150
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• 2006

In this paper, the applicability of an UET(ultrasound excited thermography) for a defect detection of the welded receptacle is described. An UET(ultrasound excited thermography) is a defect-selective and fast imaging tool for damage detection. A high power ultrasound-excited vibration energy with pulse durations of 280ms is injected into the outer surface of the welded receptacle made of Al material. An ultrasound vibration energy sent into the welded receptacle propagate inside the sample until they are converted into the heat in the vicinity of the defect. The injection of the ultrasound excited vibration energy results in heat generation so that the defect is turned into a local thermal wave transmitter. Its local heat emission is monitored by the thermal infrared camera. And they are processed by the image recording system. Measurement was performed on aluminum receptacle welded by using Nd:YAG laser. The observed thermal image revealed two area of defects along the welded seam.

• Proceedings of the KSRS Conference
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• 2002.10a
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• pp.657-662
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• 2002

Sea surface temperatures (SSTs) estimated from satellite data are affected by various kinds of disturbance factors. In order to accurately estimate SSTs based on radiometric data observed by satellite, it is important to correct the effects by these disturbance factors. We obtained a huge data set of skin sea surface temperature images observed by a thermal infrared camera (TIC) in MUBEX Campaign. TIC installed on an observation vessel recorded sea surface skin temperature distribution under various weather conditions. Based on some special images observed by TIC, we estimated skin effects and effective sea surface emissivity. In this paper, we report the methods and results of these estimations.

• Journal of Sensor Science and Technology
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• v.9 no.1
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• pp.44-50
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• 2000

Every object emits some energy from its surface. The emission energy forms surface heat distribution which we can capture by using an infrared thermal imager. The infrared thermal image may include valuable information regarding to the subsurface anomaly of the object. Since a thermal image reflects surface clutter and subsurface anomaly, we have difficulty in extracting the information on the subsurface anomaly only with thermal images taken under a wavelength. Thus, we use visible wavelength images of the object surface to remove exterior clutter. We, therefore in this paper, visualize the infrared image for overlaying it with a visible wavelength image. First, we make an interpolated image from two ordinary images taken from both sides of an infrared sensor. Next, we overlay the intermediate image with an infrared image taken from the infrared camera. The technique suggested in this paper can be utilized for analyzing the infrared images on non-destructive inspection against disaster and for safety.

• Journal of the Semiconductor & Display Technology
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• v.15 no.4
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• pp.1-9
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• 2016

The warpage on mobile phone camera packages occurs due to the CTE(Coefficient of Thermal Expansion) mismatch between a thin silicon die and a substrate. The warpage in the optical instruments such as camera module has an effect on the field curvature, which is one of the factors degrading the optical performance and the product yield. In this paper, we studied the effect of die bonding epoxy on the package and optical performance of mobile phone camera packages. We calculated the warpages of camera module packages by using a finite element analysis, and their shapes were in good agreement showing parabolic curvature. We also measured the warpages and through-focus MTF of camera module specimens with experiments. The warpage was improved on an epoxy with low elastic modulus at both finite element analysis and experiment results, and the MTF performance increased accordingly. The results show that die bonding epoxy affects the warpage generated on the image sensor during the packaging process, and this warpage eventually affects the optical performance associated with the field curvature.