• Journal of the Korean Institute of Telematics and Electronics B
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• v.31B no.1
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• pp.49-56
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• 1994

This paper describes the design principles and methods of electronic processor for thermal imager with the SPRITE detector, operating in the 8-12 micron band. The thermal imager consists of a optical scanner containing the detector and an electrical signal processor. The optical scanner utilizing rotating polygon and oscillating mirror, is 2-dimensional serial/parallel scan type using 5 elements of the detector. And the electronic processor has pre-processing of 5 chnanel's thermal signal from the detector, and performs digital scan conversion to reform the parallel data stream into serial analog data compatible with conventional RS-170 video. Through the designed electronic processor, we have acquired a satisfactory thermal image. And the MRTD (Minimum Resolvable Temperature Difference) is 0.5$^{\circ}$K at 7.5 cycles/mm.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.6
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• pp.493-501
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• 2013

LED lighting is sensitive because it made by semiconductor. So it has been researched about radiation of heat technologies for a long time. In addition, measurement and assessment a radiation of heat also conducted. It is necessary to get a date of accuracy temperature on the board after LED driven for measuring Junction temperature of the LED Lighting. For this research, we use 5 chip which is 4 W power on top of LED lighting board made by aluminum. Thermal camera effects to emissivity depending on material and property of the surface in LED board because it determines thermal energy which emitted from material surface. it is not only thermal camera has not a standard about emissivity. It has an error of temperature when emissivity was measured by thermal camera. we confirmed that emissivity and reflected temperature depending on color and quality of the surface throughout experiment.

• Proceedings of the KWS Conference
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• 2006.05a
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• pp.206-208
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• 2006

The reliability of BGA (ball grid array) package with OSP (organic surface preservative) surface finish under thermal cycle was investigated by using SEM (scanning electron microscopy), EDS(energy dispersive spectroscopy), image tool and ball shear test. The IMCs (intermetallic compounds) were increased with increasing number of thermal cycles. However, the shear strengths of solder ball were decreased with increasing number of thermal cycles. The order of solders which had the highest shear strength as follow: Sn-3.5wt%Ag-0.7wt%Cu, Sn-0.7wt%Cu, Sn-37wt%Pb.

• Journal of the Korean Institute of Telematics and Electronics S
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• v.35S no.1
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• pp.122-129
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• 1998

For generation and analysis of the multi-sensory image, we propose a new three dimensional (3D) modeling method considering an iternal heat source. We represent the heat conduction process within th object as an equivalent thermal circuit. Therefore, without a complex computation, our modeling approach can obtain thermal features of the object. By using the faceted model, the proposed method can express the accurate visual signatures of the object. Comparing the estimates datum with the obtained surface temperatures, we have demonstrated that the proposed method can provide a precise thermal features. The thermal images by out model is applicable to simulate a tracking loop of an IR missile.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.57 no.3
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• pp.332-337
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• 2008

We analyzed carbonization pattern and crystal structure of polyvinyl chloride wire by thermal stress. Copper that is oxidized at normal temperature is a reddish brown. If under the thermal stress range of 500 to 700 [$^{\circ}C$], carbonization and exfoliation occurrence. Section structure of electric wire is same as arrangement of particle in metallograph analysis. But, as thermal stress increases, size of particle is enlarged. Electric wire displays elongation structure in SEM image analysis and elongation structure collapses when receive thermal stress at 300 [$^{\circ}C$]. In EDX analysis, we get the spectra of CuL, CuK, OK, and ClK. FT-IR analysis was shown new spectra with in range of $1,440{\sim}1,430\;[cm^{-1}]$, 1,340 [$cm^{-1}$], 1,240 [$cm^{-1}$].

• Bulletin of the Society of Naval Architects of Korea
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• v.12 no.1
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• pp.59-75
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• 1975

The thermal stresses due to a heat source moving crosswise on a finite breadth plate, which is much more like to the practical welding problems, were studied. The temperature distributions in the plate were obtained analytically using the mirror image method, and the thermal stresses were calculated by the finite-difference method. Some numerical calculations for temperature distributions and thermal stresses were performed. The temperature distributions were also obtained by experiment. It was found that the theory was in good agreement with the result of experiment, and the calculated thermal stresses were resonable.

• Journal of the Korean Society of Visualization
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• v.19 no.3
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• pp.77-83
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• 2021

Solid oxide fuel cell (SOFC) operates at high temperatures in range of 600-800℃. Since layers of SOFC are composed of different substances, different thermal expansion in SOFC can result in defects under high temperature conditions. For understanding relation between temperature field and the thermal deformation in SOFC, temperature and strain field were simultaneously estimated using thermographic phosphors by optical measurement. Temperature fields were obtained by the life-time method, and the temperature differences of one specimen was checked with thermocouple. The thermal deformation was estimated by digital image correlation (DIC) method with extracted phosphorescence images. To investigate the deformation accuracy of DIC measurement, thermographic phosphors were coated with and without grid pattern on aluminum surface. Simultaneous measurement of temperature fields and thermal deformation were carried out for YSZ. This study will be helpful to multi-sensing of temperature field and thermal deformation on SOFC cells.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.22 no.4
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• pp.621-628
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• 2021

This paper proposes a method to calibrate a thermal camera with three different perspectives. In particular, the intrinsic parameters of the camera and re-projection errors were provided to quantify the accuracy of the calibration result. Three lenses of the camera capture the same image, but they are not overlapped, and the image resolution is worse than the one captured by the RGB camera. In computer vision, camera calibration is one of the most important and fundamental tasks to calculate the distance between camera (s) and a target object or the three-dimensional (3D) coordinates of a point in a 3D object. Once calibration is complete, the intrinsic and the extrinsic parameters of the camera(s) are provided. The intrinsic parameters are composed of the focal length, skewness factor, and principal points, and the extrinsic parameters are composed of the relative rotation and translation of the camera(s). This study estimated the intrinsic parameters of thermal cameras that have three lenses of different perspectives. In particular, image enhancement based on a deep learning algorithm was carried out to improve the quality of the calibration results. Experimental results are provided to substantiate the proposed method.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.113-116
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• 2004

In this study, the causes of temporal bright image sticking problem in an AC PDP were investigated. The temporal bright image sticking problem in an ac PDP is observed to be a relatively lower luminance following several minutes on-time at a high gray level compared to that of the ordinary turned-on image area. We focused on the detailed causes of image sticking, which are directly related with the visible emission such as the changes in the characteristics of phosphor, MgO surface and gas dynamics. The experimental results show that the thermal quenching of phosphor and temperature-dependent discharge characteristics change cause the image sticking problem.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.5
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• pp.122-128
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• 2007

The electric part of thermal SEM(Scanning Electron Microscopy) consists of high voltage generation, lens control, and image processing. Several methodologies for enhancing SEM image are addressed and those results are verified through analyses and experiments. The controller employes a DSP(Digital Signal Processing), making the system more flexible and convenient than the classical analogue based controller. In some parts based the analog circuit, there are inevitable sources of noise and image distortion. The experimental investigation is provided along with analytical proof to enhance the SEM image.