• Resources Recycling
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• v.26 no.5
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• pp.22-28
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• 2017

In-Bi-Sn alloy sheet has been used as a thermal fusible parts of secondary battery safety system. This study offers a simple process to make In-Bi-Sn alloy fusible parts. The process consists of two procedures, melting and sheeting by tape casting. 62.5 wt%-In 20.0 wt%-Bi 17.5 wt%-Sn (M.P. $92.4^{\circ}C$) alloy sheet obtained by tape casting was used as the thermal fusible sheet of thermal fuse system for mobile telephone. The performance test of the system was carried out in oil bath, and the fusible alloy sheet was melted and cut off at $95^{\circ}C$. This results confirmed the possibility that the alloy sheet obtained by tape casting can be usable as a thermal fusible parts of battery safety system. And this process can be applied as a simple process to recycle the In-Bi-Sn alloy scrap separated from the used thermal fuse system.

• Journal of Korea Foundry Society
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• v.35 no.3
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• pp.62-66
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• 2015

Tape casting is an important forming operation used to prepare flat sheets in the various industries. In this study, Doctor Blade tape casting of In-based low melting point alloy was carried out. The purpose of this investigation was to determine the possibility of applying the Doctor Blade tape casting process to the manufacture of low melting point alloy sheets that can be used as thermal fusible parts of battery safety systems. In-based molten alloy that has a melting point of $95^{\circ}C$ was produced; it's viscosity was measured at various temperatures. The molten alloy was used as a slip in the caster of the Doctor Blade tape casting system. The effects of the molten alloy temperatures and carrier speeds on the produced sheet shape were observed. For the casting conditions of 1.5 cm slip height, $120^{\circ}C$ slip temperature, 0.05 mm blade gap and 60 m/min. carrier speed, an In-based alloy thin tape well shaped with 0.16 mm uniform thickness was continuously produced.

• Journal of Applied Reliability
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• v.13 no.2
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• pp.109-116
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• 2013

The solder is any of various fusible alloys, usually tin and lead, used to join metallic parts that provide the contact between the chip package and the printed circuit board. Solder plays an important role of electrical signals to communicate between the two components. In this study, two kinds of Ag-free solder as sample is made to conduct the thermal shock test and the high humidity temperature test. Low resistance is measured to estimate crack size of solder, using daisy chain. The low speed shear test is also performed to analyze strength of solder. The appropriate degradation model is estimated using the result data. Depending on the composition of solder, lifetime estimation is conducted by adopted degradation model. The lifetime estimated two kinds of Ag-free solder is compared with expected lifetime of Sn-Ag-Cu solder. The result is that both Ag-free composition are more reliable than Sn-Ag-Cu solder.

• Fire Science and Engineering
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• v.22 no.4
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• pp.54-60
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• 2008

In this study, damage characteristics of MCCB and terminal block due to poor contact were analyzed, and various poor contact detection techniques were suggested. Firstly, the detection techniques using thermocouple and infrared thermal camera were analyzed respectively. Also, thermo-cap during poor contact detected abnormal status effectively by changing its color, and the detection system using an odor detector and odor capsules was analyzed. Lastly, poor contact detection screw was made using characteristics of fusible alloy, and we applied the poor contact detection screw to terminal block. The above methods could prevent electrical fire caused by poor contact effectively if they are used properly.