• Title/Summary/Keyword: thermal factor

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Modeling of combined thermal and mechanical action in roller compacted concrete dam by three-dimensional finite element method

  • Abdulrazeg, A.A.;Noorzaei, J.;Mohammed, T.A.;Jaafar, M.S.
    • Structural Engineering and Mechanics
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    • v.47 no.1
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    • pp.1-25
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    • 2013
  • A combined thermal and mechanical action in roller compacted concrete (RCC) dam analysis is carried out using a three-dimensional finite element method. In this work a numerical procedure for the simulation of construction process and service life of RCC dams is presented. It takes into account the more relevant features of the behavior of concrete such as hydration, ageing and creep. A viscoelastic model, including ageing effects and thermal dependent properties is adopted for the concrete. The different isothermal temperature influence on creep and elastic modulus is taken into account by the maturity concept, and the influence of the change of temperature on creep is considered by introducing a transient thermal creep term. Crack index is used to assess the risk of occurrence of crack either at short or long term. This study demonstrates that, the increase of the elastic modulus has been accelerated due to the high temperature of hydration at the initial stage, and consequently stresses are increased.

High thermoelectric performance and low thermal conductivity in K-doped SnSe polycrystalline compounds

  • Lin, Chan-Chieh;Ginting, Dianta;Kim, Gareoung;Ahn, Kyunghan;Rhyee, Jong-Soo
    • Current Applied Physics
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    • v.18 no.12
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    • pp.1534-1539
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    • 2018
  • SnSe single crystal showed a high thermoelectric zT of 2.6 at 923 K mainly due to an extremely low thermal conductivity $0.23W\;m^{-1}\;K^{-1}$. It has anisotropic crystal structure resulting in deterioration of thermoelectric performance in polycrystalline SnSe, providing a low zT of 0.6 and 0.8 for Ag and Na-doped SnSe, respectively. Here, we presented the thermoelectric properties on the K-doped $K_xSn_{1-x}Se$ (x = 0, 0.1, 0.3, 0.5, 1.5, and 2.0%) polycrystals, synthesized by a high-temperature melting and hot-press sintering with annealing process. The K-doping in SnSe efficiently enhances the hole carrier concentration without significant degradation of carrier mobility. We find that there exist widespread Se-rich precipitates, inducing strong phonon scattering and thus resulting in a very low thermal conductivity. Due to low thermal conductivity and moderate power factor, the $K_{0.001}Sn_{0.999}Se$ sample shows an exceptionally high zT of 1.11 at 823 K which is significantly enhanced value in polycrystalline compounds.

Thermal post-buckling behavior of GPLRMF cylindrical shells with initial geometrical imperfection

  • Yi-Wen Zhang;Gui-Lin She;Lei-Lei Gan;Yin-Ping Li
    • Geomechanics and Engineering
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    • v.32 no.6
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    • pp.615-625
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    • 2023
  • Initial geometrical imperfection is an important factor affecting the structural characteristics of plate and shell structures. Studying the effect of geometrical imperfection on the structural characteristics of cylindrical shell is beneficial to explore the thermal post-buckling response characteristics of cylindrical shell. Therefore, we devote to investigating the thermal post-buckling behavior of graphene platelets reinforced mental foam (GPLRMF) cylindrical shells with geometrical imperfection. The properties of GPLRMF material with considering three types of graphene platelets (GPLs) distribution patterns are introduced firstly. Subsequently, based on Donnell nonlinear shell theory, the governing equations of cylindrical shell are derived according to Eulerian-Lagrange equations. Taking into account two different boundary conditions namely simply supported (S-S) and clamped supported (C-S), the Galerkin principle is used to solve the governing equations. Finally, the impact of initial geometrical imperfections, the GPLs distribution types, the porosity distribution types, the porosity coefficient as well as the GPLs mass fraction on the thermal post-buckling response of the cylindrical shells are analyzed.

Thermal buckling of rectangular sandwich plates with advanced hybrid SMA/CNT/graphite/epoxy composite face sheets

  • Saeed Kamarian;Jung-Il Song
    • Advances in nano research
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    • v.14 no.3
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    • pp.261-271
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    • 2023
  • The present study follows three main goals. First, an analytical solution with high accuracy is developed to assess the effects of embedding pre-strained shape memory alloy (SMA) wires on the critical buckling temperatures of rectangular sandwich plates made of soft core and graphite fiber/epoxy (GF/EP) face sheets based on piecewise low-order shear deformation theory (PLSDT) using Brinson's model. As the second goal, this study compares the effects of SMAs on the thermal buckling of sandwich plates with those of carbon nanotubes (CNTs). The glass transition temperature is considered as a limiting factor. For each material, the effective ranges of operating temperature and thickness ratio are determined for real situations. The results indicate that depending on the geometric parameters and thermal conditions, one of the SMAs and CNTs may outperform the other. The third purpose is to study the thermal buckling of sandwich plates with advanced hybrid SMA/CNT/GF/EP composite face sheets. It is shown that in some circumstances, the co-incorporation of SMAs and CNTs leads to an astonishing enhancement in the critical buckling temperatures of sandwich plates.

Evaluation of Deployment Barriers to Solar Thermal and Ground Source Heat Pump for Buildings (건물용 태양열과 지열의 보급 장벽 평가)

  • Ilhyun Cho;Jaeseok Lee
    • New & Renewable Energy
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    • v.20 no.1
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    • pp.61-69
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    • 2024
  • This study investigates the barriers to the deployment of solar thermal and ground source heat pump (GSHP) from the perspective of consumers and businesses, as well as evaluates priorities for improving the barriers via expert AHP evaluation. From a consumer's perspective, the overall satisfaction with solar thermal is significantly lower than that with PV and needs to be improved at the installation and use stages. GSHP needs to be improved at the prior-information search stage. From a business perspective, the non-distinction between heat and electricity in mandatory installations in public buildings, the difficulty in assessing the value of heat, and high initial costs impede the deployment. Based on the result of AHP analysis, the priorities for improving the barriers to the wide utilization of solar thermal are evaluated in the order of economic feasibility, policy, acceptability, and technology, where high installation cost is shown to be the greatest barrier. Barriers for GSHP are evaluated in the order of policy, acceptability, economic feasibility, and technology, where policy means improvement is evaluated as the most important factor in promoting the deployment of GSHP.

The Fundamental study on Development of Ceiling materials using the Zeolite and Stone dust, Sludge (제올라이트와 석분 및 슬러지를 이용한 천장재의 개발에 관한 기초적 연구)

  • 임병호;류희정;최영준;이승조;김태곤;박정민;김화중
    • Proceedings of the Korea Concrete Institute Conference
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    • 1997.10a
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    • pp.777-784
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    • 1997
  • This paper is fundamental study to develop ceiling materials, using the properties of Zeolite, stone dust and sludge for the purpose of prevention of environmental pollution and reuse of industrial wastes. According to latin square method, We estimated to the significant level ad optimum level for a significant factor, and investigated to the significant degree to extend each factor for required capacity. Thus, we investigated for required capacity in ceiling material such as, compressive and bending strength, absorptivity and thermal conductivity.

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A PROPOSED CORRELATION FOR CRITICAL FLOW RATE OF WATER FLOW

  • KIM, YEON-SIK
    • Nuclear Engineering and Technology
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    • v.47 no.1
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    • pp.135-138
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    • 2015
  • A new correlation predicting the idealized critical mass-flow rates of water for subcooled and saturated liquid water including two-phase water flow was developed for a wide range of upstream stagnation pressures (e.g., 0.5-20.0 MPa). A choking correction factor dependent on the upstream stagnation pressure and subcooled temperature was introduced into a new correlation, and its values were suggested to satisfy the idealized nozzle data within 10% error ranges. The suggested correlation will be instructive and helpful for related studies and/or engineering works.

Phenomenon of Power Interference and Screening Factor (전력유도 현상과 차폐계수)

  • 황종선;김영민;이경욱;김재준
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.11a
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    • pp.621-624
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    • 2001
  • A metal sheath provides a cable with electrostatic screening and a degree of magnetic screening. The presence of a screen on a cable also reduces the induction arising from the high-frequency components of transients caused by power-line switching and also induced transients from lightning strokes; such transient induced voltages are of increasing importance with the increasing use of miniaturized telecommunication equipment with very small thermal capacity. This paper describes electrostatic induction and electromagnetic induction caused by power interference. Also screening factors are proposed.

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Wafer-Level Packaged MEMS Resonators with a Highly Vacuum-Sensitive Quality Factor

  • Kang, Seok Jin;Moon, Young Soon;Son, Won Ho;Choi, Sie Young
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.14 no.5
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    • pp.632-639
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    • 2014
  • Mechanical stress and the vacuum level are the two main factors dominating the quality factor of a resonator operated in the vacuum range 1 mTorr to 10 Torr. This means that if the quality factor of a resonator is very insensitive to the mechanical stress in the vacuum range, it is sensitive to mainly the ambient vacuum level. In this paper, a wafer-level packaged MEMS resonator with a highly vacuum-sensitive quality factor is presented. The proposed device is characterized by a package with out-of-plane symmetry and a suspending structure with only a single anchor. Out-of-plane symmetry helps prevent deformation of the packaged device due to thermal mismatch, and a single-clamped structure facilitates constraint-free displacement. As a result, the proposed device is very insensitive to mechanical stress and is sensitive to mainly the ambient vacuum level. The average quality factors of the devices packaged under pressures of 50, 100, and 200 mTorr were 4987, 3415, and 2127, respectively. The results demonstrated the high controllability of the quality factor by vacuum adjustment. The mechanical robustness of the quality factor was confirmed by comparing the quality factors before and after high-temperature storage. Furthermore, through more than 50 days of monitoring, the stability of the quality factor was also certified.

Study on Simulation and Calculation Method of Thermal Error Compensation System for a Ball Screw Feed Drive (볼 스크류 이송장치 열 에러 보상 시스템의 시뮬레이션 및 계산 방법에 관한 연구)

  • Xu, Zhe Zhu;Choi, Chang;Kim, Lae-Sung;Baek, Kwon-In;Lyu, Sung-ki
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.16 no.2
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    • pp.88-93
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    • 2017
  • Due to the requirement of the development of the precision manufacturing industry, the accuracy of machine tools has become a key issue in this field. A critical factor that affects the accuracy of machine tools is the feed system, which is generally driven by a ball screw. Basically, to improve the performance of the feed drive system, which will be thermally extended lengthwise by continuous usage, a thermal error compensation system that is highly dependent on the feedback temperature or positioning data is employed in the machine tool system. Due to the overdependence on measuring technology, the cost of the compensation system and low productivity level are inevitable problems in the machine tool industry. This paper presents a novel feed drive thermal error compensation system method that could compensate for thermal error without positioning or temperature feedback. Regarding this thermal error compensation system, the heat generation of components, principal of compensation, thermal model, mathematic model, and calculation method are discussed. As a result, the test data confirm the correctness of the developed feed drive thermal error compensation system very well.