Wafer-Level Packaged MEMS Resonators with a Highly Vacuum-Sensitive Quality Factor |
Kang, Seok Jin
(School of Electronics Engineering, Kyungpook National University)
Moon, Young Soon (Department of Sensor and Display Engineering, Kyungpook National University) Son, Won Ho (School of Electronics Engineering, Kyungpook National University) Choi, Sie Young (School of Electronics Engineering, Kyungpook National University) |
1 | S. Hutcherson, et al, "On the squeeze-film damping of micro-resonators in the free-molecule regime," J. Micromech. Microeng., Vol.14, No.12, pp.1726-1733, Sep., 2004. DOI |
2 | A. Bosseboeufet, et al, "Vacuum measurement in wafer level encapsulations by interference microscopy," Microsystem technologies, Vol.12, No.10-11, pp.1063-1069, Sep., 2006 DOI |
3 | F. Santagata,et al, "Tube-shaped Pirani gauge for in situ hermeticity monitoring of SiN thin-film encapsulation," J. Micromech. Microeng., Vol.22, No.10, pp.25-32, Sep., 2012. |
4 | Y. T. Cheng, et al, "Vacuum packaging technology using localized aluminum/silicon-to-glass bonding," Journal of Microelectromechanical Systems, Vol.11, No.5, pp.556-565, Oct., 2002. DOI ScienceOn |
5 | A. K. Pandey, et al, "Effect of pressure on fluid damping in MEMS torsional resonators with flow ranging from continuum to molecular regime," Experimental Mechanics, Vol.48, pp.91-106, Sep., 2007. |
6 | A. Cozma, et al, "Characterization of the Electrostatic Bonding of Silicon and Pyrex Glass Wafers," J. Micromech. Microeng, Vol.5, No.2, pp.98-102, Jan., 1995. DOI |
7 | Acar, Cenk, et al. "Environmentally robust MEMS vibratory gyroscopes for automotive applications." IEEE Sensors Journal, 9(12), pp.1895-1906, 2009. DOI |
8 | Shakoor, Rana Iqtidar. "Design, Fabrication And Characterization Of Metalmumps Based Mems Gyroscopes." PhD Thesis. Pakistan Institute of Engineering & Applied Sciences, Islamabad, 2010. |
9 | W. Rabaud, et al, "Recent development in pixel level packaging for uncooled IRFPA," Proc. of SPIE, Vol.7834, pp.1-8, Sep., 2010. |
10 | T. M. Lee, et al, "Detailed characterization of anodic bonding process between glass and thin-film coated silicon substrates," Sensors and Actuators A, Vol.86, pp.103-107, 2000. DOI |
11 | Jung-Tang Huang, et al, "Improvement of bonding time and quality of anodic bonding using the spiral arrangement of multiple point electrodes," Sensors and Actuators A, Vol.102, No.1-2, pp.1-5, Dec., 2002. DOI |
12 | T. Grzebyk, et al, "Vacuum in Microsystems-generation and measurement," Optica Applicata, Vol.41, No.2, pp.389-394, 2011. |
13 | B. Lee, et al, "A Study on Wafer Level Vacuum Packaging for MEMS Devices," J. Micromech. Microeng., Vol.13, pp.663-669. Jan., 2003. DOI ScienceOn |