• Korean Journal of Materials Research
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• v.8 no.4
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• pp.323-327
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• 1998

All solid state lithium based rechargeable batteries were fabricated in a cell structure of Li/PEO-$LiCIO_4$-PC /$LIMn_2O_4$$LIMn_2O_4$ thin films were prepared by RF magnetron sputtering and the spinel structure could be obtained by Rapid Thermal Annealing (RT A) process at the temperature of around 750$750^{\circ}C$ . Room temperature cycling of this cell showed a nearly constant cell potential of 4 V( us. Li) and good reversibility.

• Journal of the Korean Society for Heat Treatment
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• v.7 no.2
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• pp.118-128
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• 1994

Five alloys were selected randomly in the composition range showing the best shape memory effect in Fe-Mn-Si system reported by Murakami. The shape memory effects of those alloys were mainly investigated through the training treatment which consisted of the repetition of 2% tensile deformation at room temperature and subsequent annealing at $600^{\circ}C$ above $A_r$ temperature. At the same deformation degress in rolling $600^{\circ}C$-annealing for 1 hr. showed the best shape memory effect, and 10%-deformation degrees represented maxima of the shpae memory effects at all annealing temperatures, $500^{\circ}C$, $600^{\circ}C$ and $700^{\circ}C$. The shape memory effects of the alloys were increased by increasing training cycle up to 5 cycles. This was because a large number of dislocations introduced by training process gave rise to increase in the austenite yield stress, and acted as nucleation sites for stress induced ${\varepsilon}$ martensite. The thermal cycling treatment, repetition of cooling in nitrogen at $-196{\circ}C$ and heating to $300^{\circ}C$ for 5 min., did not improve the shape memory effect.

• Nuclear Engineering and Technology
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• v.53 no.7
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• pp.2261-2267
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• 2021

This paper evaluates the efficacy of magnesium potassium phosphate cements (MKPCs) as waste forms for the solidification of radioactive concrete powder wastes produced by the decommissioning of nuclear power plants. MKPC specimens that contained up to 50 wt% of simulated concrete powder wastes (SCPWs) were evaluated. We measured the porosity and compressive strength of the MKPC specimens, observing them using scanning electron microscopy and X-ray diffraction. The addition of SCPWs reduced the porosity and increased the compressive strength of the MKPC specimens. Struvite-K crystals were well-synthesized, and no additional crystal phase was formed. After thermal cycling and after immersion, MKPC specimens with 50 wt% SCPWs satisfied the waste-acceptance criteria (WAC) for compressive strength. Semi-dynamic leaching tests were performed using the ANS 16.1 method; the leachability indices of Cs, Co, and Sr were 11.45, 17.63, and 15.66, respectively, which also satisfy the WAC. Thus, MKPCs can provide stable matrices to immobilize radioactive concrete wastes generated by the decommissioning of nuclear power plants.

• Journal of the Korean institute of surface engineering
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• v.55 no.3
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• pp.173-179
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• 2022

This study presents a roll-to-roll process which is capable of Ag nanowire (AgNW) transfer from polyethylene terephthalate (PET) film to polycarbonate (PC) film. We developed a roll-to-roll machine that consists of two film suppliers, a coater of photo-curable resin, a film laminator, an ultraviolet (UV) exposure unit, and a film winder to facilitate large-area electrode transfer between different flexible substates. Using the process, optimal fabrication condition was investigated by parametric experiments in terms of the UV exposure time, number of thermal cycling, and exposure time of high temperature and humidity. A fabricated AgNW on PC film showed sheet resistance of 52 Ω/sq and optical transmittance of approximately 80 % over a range of visible light.

• Nuclear Engineering and Technology
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• v.55 no.10
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• pp.3617-3627
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• 2023

This study presents a method to solidify spent ion-exchange resin (IER) in a metakaolin-based geopolymer and shows results of mechanical strength, immersion, leaching, irradiation, and thermal cycling tests for waste acceptance criteria (WAC) to repository. The geopolymer waste form with 20 wt% of simulated spent IER met the WAC in South Korea (ROK), and the leaching tests of various sized-waste forms up to 15.0 × 30.0 cm and waste loadings up to 20 wt% for 1-5 d and 1-90 d achieved a leachability index, L_i > 6. In a leaching test for 5 d, the cumulative fraction leached (CFL) for Cs, which leached the most, was linearly correlated with the square root of leaching time for all waste forms, and L_i increased as the size of the waste form increased. The CFL was also correlated with elapsed time in the 90 d leaching test. The correlations among CFL, time, and volume-to-surface area ratio of waste forms used to estimate the L_i of Cs of a 200-L sized geopolymer with 15 wt% IER showed the L_i values as 14.73 (5 d) and 17.71 (90 d), respectively, indicating that the large-sized geopolymer waste form met the WAC.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2023.11a
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• pp.211-212
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• 2023

Polishing tiles among porcelain tiles are more durable and aesthetic than ceramic tiles, so their demand has recently increased. In particular, since polishing tiles have a very low absorption rate, organic adhesives with chemical bonds are mainly used. However, organic adhesives have low economic efficiency and some volatile organic compounds (TVOCs). Therefore purpose of this study was to evaluate the performance of polishing tile adhesion by developing organic-inorganic adhesives, which have chemical bonds and mechanical bonds. As a result, since the amorphous chain and chemical bonds of the polymer in the tile adhesives, both tensile and shear adhesion strength were satisfied with the KS L 1592, KS L 1593, and the rate of length change itself in the thermal cycling was lower than organic adhesives. So it is thought that it is possible to replace some organic adhesives.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.55-65
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• 2020

The use of underfill materials in semiconductor packages is not only important for stress relieving of the package, but also for improving the reliability of the package during shock and vibration. However, in recent years, as the size of the package becomes larger and very thin, the use of the underfill shows adverse effects and rather deteriorates the reliability of the package. To resolve these issues, we developed the package using a solid epoxy material to improve the reliability of the package as a substitute for underfill material. The developed solid epoxy was applied to the package of the application processor in smart phone, and the reliability of the package was evaluated using thermal cycling reliability tests and numerical analysis. In order to find the optimal solid epoxy material and process conditions for improving the reliability, the effects of various factors on the reliability, such as the application number of solid epoxy, type of PCB pad, and different solid epoxy materials, were investigated. The reliability test results indicated that the package with solid epoxy exhibited higher reliability than that without solid epoxy. The application of solid epoxy at six locations showed higher reliability than that of solid epoxy at four locations indicating that the solid epoxy plays a role in relieving stress of the package, thereby improving the reliability of the package. For the different types of PCB pad, NSMD (non-solder mask defined) pad showed higher reliability than the SMD (solder mask defined) pad. This is because the application of the NSMD pad is more advantageous in terms of thermomechanical stress reliability because the solderpad bond area is larger. In addition, for the different solid epoxy materials with different thermal expansion coefficients, the reliability was more improved when solid epoxy having lower thermal expansion coefficient was used.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.3 s.32
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• pp.1-7
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• 2004

Tin plating on component finishes may grow whiskers under certain conditions, which may cause failures in electronics equipment. To protect the environment, 'lead-free' among component finishes is being promoted worldwide. This paper presents the evaluation results of whiskers on two kinds of lead-free plating materials at the plating temperature and under the reliability test. The rising plating temperature caused increasing the size of plating grain and shorting the growth of whisker. The whisker was grown under the temperature cycling the bent type in matt Sn plating and striated type in malt Sn-Bi. The whisker growth in Sn-Bi plating was shorter than that in Sn plating. In FeNi42 leadframe, the $7.0{\~}10.0{\mu}m$ diameter and the $25.0{\~}45.0{\mu}m$ long whisker was grown under 300 cycles. In the 300 cycles of Cu leadframe, only the nodule(nuclear state) grew on the surface, and in the 600 cycles, a $3.0{\~}4.0{\mu}m$ short whisker grew. After 600 cycles, the ${\~}0.34{\mu}m$ thin $Ni_3Sn_4$ formed on the Sn-plated FeNi42. However, we observed the amount of $0.76{\~}1.14{\mu}m$ thick $Cu_6Sn_5$ and ${\~}0.27{\mu}m$ thin $Cu_3Sn$ intermetallics were observed between the Sn and Cu interfaces. Therefore, the main growth factor of a whisker is the intermetallic compound in the Cu leadframe, and the coefficient of thermal expansion mismatch in FeNi42.

• Journal of the Korean Electrochemical Society
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• v.14 no.3
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• pp.176-183
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• 2011

The electrochemical characteristics from various particle sizes of $Ce_{0.9}Gd_{0.1}O_{2-{\delta}}$ (CGO91) in composite cathode comprised of the samarium-strontium doped layered perovskite ($SmBa_{0.5}Sr_{0.5}Co_2O_{5+{\delta}}$) and CGO91 have been investigated for possible application as a cathode material for an intermediate temperature-operating solid oxide fuel cell (IT-SOFC). The area specific resistances (ASRs) of composite cathodes with CGO91 having smaller particle size ($0.4\sim42{\mu}m$) and SBSCO of 1 : 1 ratio (50wt% SBSCO and 50 wt% CGO91, SBSCO: 50) give the lowest ASR of $0.10{\mu}cm^2$ at $600^{\circ}C$ and $0.013{\Omega}cm^2$ at $700^{\circ}C$. However, composite cathodes with having relatively bigger CGO91 particle size show the two times higher ASR results than those of SBSCO : 50. From the 10 times thermal cycles in SBSCO : 50, the ASRs of SBSCO : 50 increased from $0.0193{\Omega}cm^2$ to $0.094{\Omega}cm^2$ at $700^{\circ}C$, however, the ASR value was maintained after 7 times of thermal cycling.

• Journal of the Korean Electrochemical Society
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• v.18 no.1
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• pp.31-37
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• 2015

Composition-controlled ternary components chalcogenides germanium tin sulfide ($Sn_xGe_{1-x}S$) nanoparticles were synthesized by a novel gas-phase laser photolysis reaction of tetramethyl germanium, tetramethyl tin, and hydrogen sulfide mixture. Subsequent thermal annealing of as-grown amorphous nanoparticles produced the crystalline orthorhombic phase nanoparticles. All these composition-tuned nanoparticles showed excellent cycling performance of the lithium ion battery. The germanium sulfide nanoparticles exhibit a maximum capacity of 1200 mAh/g after 70 cycles. As the tin composition (x) increases, the capacity maintains better at the higher discharge/charge rate. This novel synthesis method of tin germanium sulfide nanoparticles is expected to contribute to expand their applications in high-performance energy conversion systems.