• Proceedings of the Korean Society For Composite Materials Conference
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• 2005.11a
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• pp.79-82
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• 2005

In this study, mechanical properties of carbon fabrics composite under the thermal shock cycling were evaluated. Due to the interactions between fiber and polymer matrix, it is reasonable to conclude that both thermal cycles of thermal shock result in improvement of interlaminar shear strength(ILSS) for the longer conditioning time duration. The rise in ILSS may be attributed to the improved adhesion by cryogenic compressive stress and also by the post-curing strengthening effect. However, the flexural and tensile strength were decreased with increasing conditioning time of thermal cycle.

• Proceedings of the Korean Radioactive Waste Society Conference
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• 2018.11a
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• pp.125-126
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• 2018

• Journal of the Korean Vacuum Society
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• v.21 no.3
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• pp.178-184
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• 2012

Carbon coils could be synthesized on nickel catalyst layer-deposited silicon oxide substrate using $C_2H_2$ and $H_2$ as source gases and $SF_6$ as an additive gas under thermal chemical vapor deposition system. The characteristics (formation density and morphology) of as-grown carbon coils were investigated as functions of additive gas flow rate and the cycling on/off modulation of $C_2H_2/SF_6$ flows. Even in the lowest $SF_6$ flow rate (5 sccm) in this work, the cycling on/off modulation injection of $SF_6$ flow for 2 minutes could give rise to the formation of nanosized carbon coils, whereas the continuous injection of $SF_6$ flow for 5 minutes could not give rise to the carbon coils formation. With increasing $SF_6$ flow rates from 5 to 30 sccm, the cycling on/off modulation injection of $SF_6$ flow confines the geometry for the carbon coils to the nanosized ones. Fluorine's role of $SF_6$ during the reaction was regarded as the main cause for the confinement of carbon coils geometries to the nano-sized ones.

• Journal of Welding and Joining
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• v.19 no.4
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• pp.406-412
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• 2001

This study is focussed on the numerical prediction of the thermal fatigue life of a ${\mu}BGA$(Micro Ball Grid Array) solder joint. Numerical method is used to perform three-dimensional finite element analysis for Sn-37mass%Pb. Sn-3.5mass%Ag solder alloys during the given thermal cycling. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. In this study, a practical correlation for the prediction of the thermal fatigue life is suggested by using the dimensionless variable $\gamma$. As a result. it could be found that Sn-3.5mass%Ag has longer fatigue life than Sn-37mass%Pb in low cycle fatigue. In addition. the result with ${\gamm}ashow$a good agreement with the FEA results.

• Journal of Welding and Joining
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• v.17 no.6
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• pp.78-83
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• 1999

Solder joint is the weakest part which connects in mechanically and electronically between package body and PCB(Printed Circuit Board). Recently, the reliability of solder joint become the most critical issue in surface mounted technology. The solder joint interconnection between plastic package and PCB is susceptible to shear stress during thermal storage due to the mismatch in coefficient of thermal expansion between plastic package and PCB. A general computational approach to determine the effect of solder joint shape on the fatigue life presented. The thermal fatigue life was estimated from the engelmaier equation which was obtained from the temperature cycling loading($-65^{\circ}C$ to $150^{\circ}C$). As result of the simulation, TSOP structure has the shortest thermal fatigue life and the same structure Copper lead has 2.5 times as much fatigue life as Alloy 42 lead. In BGA structure, fatigue life time extended 80 times when underfill material exists.

• Corrosion Science and Technology
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• v.7 no.2
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• pp.69-76
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• 2008

Common methods for large scale hydrogen production, such as steam reforming and coal gasification, also involve production of carbonaceous gases. It is therefore necessary to handle process gas streams involving various mixtures of hydrocarbons, $H_2$, $H_2O$, CO and $CO_2$ at moderate to high temperatures. These gases pose a variety of corrosion threats to the alloys used in plant construction. Carbon is a particularly aggressive corrodent, leading to carburisation and, at high carbon activities, to metal dusting. The behaviour of commercial heat resisting alloys 602CA and 800, together with that of 304 stainless steel, was studied during thermal cycling in $CO/CO_2$ at $650-750^{\circ}C$, and also in $CO/H_2/H_2O$ at $680^{\circ}C$. Thermal cycling caused repeated scale separation, which accelerated chromium depletion from the alloy subsurface regions. The $CO/H_2/H_2O$ gas, with $a_C=2.9$ and $p(O_2)=5\times10^{-23}$ atm, caused relatively rapid metal dusting, accompanied by some internal carburisation. In contrast, the $CO/CO_2$ gas, with $a_C=7$ and $p(O_2)=10^{-23}-10^{-24}$ atm caused internal precipitation in all three alloys, but no dusting. Inward diffusion of oxygen led to in situ oxidation of internal carbides. The very different reaction morphologies produced by the two gas mixtures are discussed in terms of competing gas-alloy reaction steps.

• BMB Reports
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• v.28 no.4
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• pp.359-362
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• 1995

The highly polymorphic variable number of tandem repeat (VNTR) loci in the human genome are informative markers for the genetic characterization of individuals in the paternity test and forensic science as well as for the study of human disease. In this study, VNTR loci D1S80 and D2S123 have been amplified by PCR and the amplified length polymorphic alleles were detected with a discontinuous vertical PAGE system and silver staining. For explicit DNA typing, PCR optimization, in which amplification efficiencies are similar over a wide range of allele sizes, non-specific amplifications are minimal, and new longer alleles have high amplification efficiency, has been performed by changing the PCR reaction buffer composition and thermal cycling conditions. It turned out that adding an appropriate amount of Tween 20 and NP40 to the PCR reaction buffer and raising the annealing temperature to $68^{\circ}C$ in thermal cycling made it possible for optimal VNTR loci amplification. A modified PAGE system for VNTR separation was established. Under these conditions, new longer alleles in the 01580 locus were discovered and 025123 pattern changes in colorectal tumors were observed. These technical tips are valuable for detecting various amplified fragment length polymorphisms.

• Journal of Welding and Joining
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• v.20 no.2
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• pp.90-94
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• 2002

FC-BGA has advantages over other interconnection methods including high I/O counts, better electrical performance, high throughput, and low profile. But, FC-BGA has a lot of reliability issues. The 2nd level solder joint reliability of the FC-BGA with large chip on laminate substrate was studied in this paper. The purpose of this study is to discuss solder joint failures of 2nd level thermal cycling test. This work has been done to understand the influence of the structure of package, the properties of underfill, the properties and thickness of bismaleimide tiazine substrate and the temperature range of thermal cycling on 2nd level solder joint reliability. The increase of bismaleimide tiazine substrate thickness applied to low modulus underfill was improve of solder joint reliability. The resistance of solder ball fatigue was increased solder ball size in the solder joints of FC-BGA.

• Korean Journal of Materials Research
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• v.4 no.3
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• pp.334-338
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• 1994

This report details the microscopic aspects of grain boundary cracking in Pb-Sn eutecticduring displacement-controlled mechanical tests performed over a range of low frequency ($10^{-3}-10^{-5}$/s)and moderate strain range (0.2 - 1 %) where is the most technologically relevant to solder jointssubjected to thermal cycling. It is shown that intergranular cracking begins with the appearance ofcrack-like features (CLF's), which can be seen due in part because they are associated with grainboundary sliding, and is able to be described by certain stages of isolated crack growth. In the initialstages CLF's are not ture cracks but instead what I shall call "proto-cracks" where grain boundarysliding begins to damage the gram boundary at the surface. At some point during the initiation stagesonce proto-cracks become ture cracks, they develop into isolated cracks and the growth of isolatedcracks is eventually accomplished by coalescence, resulting in 5 stages of cracking.ing in 5 stages of cracking.

• Korean Journal of Materials Research
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• v.4 no.3
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• pp.329-333
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• 1994

A large number of grain boundaries were seen to crack in near-eutectic solder joints of leadless ceramic chip carriers (LLCC's) during thermal cycling at temperature ranges from -$35^{\circ}C$ to +$125^{\circ}C$ with lhr time period. One potential explanation for this type of cracking might be the presence of embrittling species on the boundary. Although there do not appear to be any instances reported in the literature of solders being embrittled by small amounts of contaminating species, the possibility of such an occurrence exists. The potential presence of impurities located at crack surfaces was inspected using Scanning Auger Microprobe(SAM) and it was found that intergranular cracking could be accomplished by the oxidation of the grain boundary. A physical model for fatigue crack growth was introduced, in which grain boundary separation took place under oxidation facilitated by sliding.