• 한방안이비인후피부과학회지
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• 제16권2호
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• pp.189-211
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• 2003

The clinical data and thermographic imaging were analyzed on the 38 cases of Bell's palsy who were treated admission in the Oriental Medicine Hospital of Wonkwang University from January 2002 to May 2003. 38 patients with Bell's palsy were within one week after the onset of the paralysis, and thermal type in the DITI were hypo or hyper generally. Nerve conduction test(ENOG and EMG) examined in two weeks after onset. We studied interaction effect between thermal type and paralysis grade on admission day. We studied each main effect ; paralysis grade on admission day - nerve conduction test, nerve conduction test - thermal type, thermal type - paralysis grade after 4 weeks, paralysis grade on admission day - paralysis grade after 4 weeks, sasang constitution - nerve conduction test. The following results were obtained that interaction effect between thermal type and paralysis grade on admission day showed no significance, each main effect ; paralysis grade on admission day - nerve conduction test, paralysis grade on admission day - paralysis grade after 4 weeks, showed significance, each main effect ; nerve conduction test - thermal type, thermal type - paralysis grade after 4 weeks, sasang constitution - nerve conduction test, showed no significance.

• 천문학논총
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• 제14권2호
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• pp.69-78
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• 1999

We present the results of one-dimensional numerical simulations of SNR evolution in the in­homogeneous medium considering the effects of the evaporation of the cloud and the thermal conduction. We have included the effects of changing evaporation rate as a function of cloud size and the ambient temperature so that the clouds could be evaporated completely before they reach the center of the SNR. The heat conduction markedly changes the density distribution in the remnant interior. To explain the observed morphologies of the centrally peaked X-ray SNRs(for example W44), the maximal thermal conduction is required. However, this is unlikely due to the magnetic field and the turbulent motion. The effects of the evaporation of the cloud and the thermal conduction described here may explain the class of remnants observed to have centrally peaked X-ray emmision.

• 한국초전도ㆍ저온공학회논문지
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• 제4권1호
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• pp.30-34
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• 2002

In this Paper, Insulation of current lead in the conduction-cooled DC reactor for the 1.2kV class 3 high-Tc superconducting fault current limiter(SFCL) is studied. Thermal link which conducts heat energy but insulates electrical energy is selected as a insulating device for the current lead in the conduction-cooled Superconducting DC reactor. It consists of oxide free copper(OFC) sheets, Polyimide films, glass fiberglass reinforced Plastics (GFRP) plates and interfacing material such an indium or thermal compound. Through the test of dielectric strength in L$N_2$, polyimide film thickness of 125 ${\mu}{\textrm}{m}$ is selected as a insulating material. Electrical insulation and heat conduction are contrary to each other. Because of low heat conductivity of insulator and contact area between electrical insulator and heat conductor, thermal resistance of conduction-cooled system is increased. For the reducing of thermal resistance and the reliable contact between Polyimide and OFC, thermal compound or indium can be used As thermal compound layer is weak layer in electrical field, indium is finally selected for the reducing of thermal resistance. Thermal link is successfully passed the test. The testing voltage was AC 2.5kVrms and the testing time was 1 hour.

• 동력기계공학회지
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• 제3권3호
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• pp.14-21
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• 1999

The wave nature of heat conduction has been developed in situations involving extreme thermal gradients, very short times, or temperatures near absolute zero. Under the excitation of a periodic surface heating in a finite medium, the hyperbolic and parabolic heat conduction equations and the damped wave equations in heat flux are presented for comparative analysis by using the Green's function with the integral transform technique. The Kummer transformation is also utilized to accelerate the rate of convergence of these solutions. On the other hand, the temperature distributions are obtained through integration of the energy conservation law with respect to time. For hyperbolic heat conduction, the heat flux distribution does not exist throughout all the region in a finite medium within the range of very short times(${\xi}<{\eta}_l$). It is shown that due to the thermal relaxation time, the hyperbolic heat conduction equation has thermal wave characteristics as the damped wave equation has wave nature.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회B
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• pp.1959-1963
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• 2007

SMES systems need cryogenic cooling systems. Conduction cooling system has more effective, compact structure than cryogen. In general, 2 stage GM cryocoolers are used for conduction cooling of HTS SMES system. 1st stages of cryocoolers are used for the cooling of current leads and radiation shields, and 2nd stages of cryocoolers for HTS coil. For the effective conduction cooling of the HTS SMES system, the temperature difference between the cryocooler and HTS coil should be minimized. In this paper, a cryogenic conduction cooling system for HTS SMES is analyzed to evaluate the performance of the cooling system. The analysis is carried out for the steady state with the heat generation of the HTS coil and effects of the thermal contact resistance. The results show the effects of the heat generation and thermal contact resistance on the temperature distribution.

• 대한기계학회논문집B
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• 제30권8호
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• pp.772-779
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• 2006

Window is a critical component in the design of energy-efficient buildings. To minimize the heat loss, insulation performance of the glazing has to be improved. Manufacturing of vacuum glazing has been motivated by the possibility of making windows of very good thermal insulation properties for such applications. It is made by maintaining vacuum in the gap between two glass panes. Pillars are placed between them to withstand the atmospheric pressure. Edge covers are applied to reduce conduction through the edge. Accurate measurements have been made of the radiative heat transfer, the pillar conduction and the gas conduction using a guarded hot plate apparatus. Vacuum glazing is found to have low thermal conductance roughly below $1W/m^2K$. Among the heat transfer modes of residual gas conduction, conduction through support pillar and the radiative heat transfer between the glass panes, the last one is the most dominant to the overall thermal conductance. Vacuum glazing using very low emittance AI-coated glass has an overall thermal conductance of about $0.7W/m^2K$.

• 한국압력기기공학회 논문집
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• 제14권1호
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• pp.8-14
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• 2018

Printed circuit heat exchangers (PCHEs) are widely used with an increasing demand for industrial applications. PCHEs are capable of operating at high temperatures and pressure. We consider a PCHE as a candidate intermediate heat exchanger type for a high temperature gas-cooled reactor (HTGR). For conventional application using stainless steels, design and manufacturing of PCHEs are well established. For applications to HTGR, knowledge of longitudinal conduction and deformation of channel is required to estimate design margin. This paper analyzes the effects of longitudinal conduction and deformation of channel on thermal performance using a code internally developed for design and analysis of PCHEs. The code has a capability of two dimensional simulations. Longitudinal conduction is estimated using the code. In HTGR operating condition, about ten percent of design margin is required to compensate thermal performance. The cross-sectional images of PCHE channels are obtained using an optical microscope. The images are processed with computer image process technique. We quantify the deformation of channel with dimensional parameters. It is found that the deformation has negative effect on structural integrity. The deformation enhances thermal performance when the shape of channel is straight in laminar flow regime. It reduces thermal performance in cases of a zigzag channel and turbulent flow regime.

• 한국산업정보학회:학술대회논문집
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• 한국산업정보학회 1997년도 추계학술대회 발표논문집:21세기를 향한 정보통신 기술의 전망
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• pp.451-462
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• 1997

A 2-dimensional numerical analysis is presented for thermal-electron heat conduction effects upon the electron transport and the drain current-voltage characteristics of submicron GaAs MESFETs, based on the use of a nonstationary hydrodynamic transport model. It is shown that for submicron GaAs MESFETs, electron heat conduction effects are significant on their internal electronic properties and also drain current-voltage characteristics. Due to electron heat conduction effects, the electron energy is greatly one-djmensionalized over the entire device region. Also, the drain current decreases continuously with increasing thermal conductivity in the saturation region of large drain voltages above 1 V. However, the opposite trend is observed in the linear region of small drain voltages below 1 V. Accordingly, for a large thermal conductivity, negative differential resistance drain current characteristics are observed with a pronounced peak of current at the drain voltage of 1 V. On the contrary, for zero thermal conductivity, a Gunn oscillation characteristic is observed at drain voltages above 2 V under a zero gate bias condition.

• 한국지반공학회:학술대회논문집
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• 한국지반공학회 2008년도 추계 학술발표회
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• pp.1487-1493
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• 2008

The frost heaving is related with thermal conduction rate and permeability. If the thermal conduction rate can be controlled, it is effective to prevent from frost heaving. If soil mixed with shredded tire which has relatively lower thermal conduction rate than soil, it helps preventing from frost heaving. However, in this case, the shear strength can get weak. In this study, we compared thermal conduction rate of soil and shredded tire, and test uniaxial compression strength of soil which is mixed with shredded tire and cement in different ratio.

• 전자공학회논문지SC
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• 제43권5호
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• pp.60-67
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• 2006

우주 비행체 전자장비의 신뢰도를 예측하고 최적화하기 위해 탑재장치 내 부품의 온도 예측이 필수적으로 요구된다. 본 논문에서는 전자장비 부품의 온도 예측방법에 관해 기술하고 있다. 본 예측 방법은 PCB 기판의 열전도도를 등방성모델로 설정하여 등가 열전도도를 계산하고 열력 모델을 이용하여 열 저항 행렬을 생성하였으며, 중첩의 원리를 이용하여 각 부품들의 온도를 예측하였다. 또한 본 논문의 온도 예측방법을 이용하여 전장품 소자의 열해석 결과와 상용 프로그램을 이용한 온도 계산 결과를 비교 분석하였다.