• 제목/요약/키워드: thermal circuit

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Development of a Material Mixing Method for Topology Optimization of PCB Substrate (PCB판의 위상 최적화를 위한 재료혼합법의 개발)

  • Han, Seog-Young;Kim, Min-Sue;Hwang, Joon-Sung;Choi, Sang-Hyuk;Park, Jae-Yong;Lee, Byung-Ju
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.16 no.1
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    • pp.47-52
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    • 2007
  • A material mixing method to obtain an optimal topology for a structure in a thermal environment was suggested. This method is based on Evolutionary Structural Optimization(ESO). The proposed material mixing method extends the ESO method to a mixing several materials for a structure in the multicriteria optimization of thermal flux and thermal stress. To do this, the multiobjective optimization technique was implemented. The overall efficiency of material usage was measured in terms of the combination of thermal stress levels and heat flux densities by using a combination strategy with weighting factors. Also, a smoothing scheme was implemented to suppress the checkerboard pattern in the procedure of topology optimization. It is concluded that ESO method with a smoothing scheme is effectively applied to topology optimization. Optimal topologies having multiple thermal criteria for a printed circuit board(PCB) substrate were presented to illustrate validity of the suggested material mixing method. It was found that the suggested method works very well for the multicriteria topology optimization.

Steady-state Thermal Analysis of 5 kW IPMSM Using Thermal Equivalent Circuit (열등가회로를 이용한 5 kW 급 영구자석 동기전동기의 정상상태 열 특성 해석)

  • Kim, Tae Hyun;Yoo, Young Bum;Na, Jong Seung;Ryu, Kyongtae;Moon, Yoon Jae;Lee, Jae Heon;Lee, Ju;Park, Chan Bae;Moon, Seung Jae
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.38 no.11
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    • pp.951-956
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    • 2014
  • Steady-state thermal analysis was performed on a thermal equivalent circuit to determine the heat generation during operation of an interior permanent magnet synchronous motor (IPMSM). New machines must be compact and light and produce high torque density under extreme environmental conditions. Thermal analysis of an IPMSM is particularly important because excessive heat generated from the core and magnet reduces the IPMSM's output and has adverse effects on the durability. Therefore, steady-state thermal analysis of an IPMSM was performed for changes in the design variables using a thermal equivalent circuit. The changed variables were the axis length and thickness of the housing. The results of this method were compared with those of the finite element method to verify the accuracy and reliability.

A Study on the Induction Heating Analysis of Round bar for TR forging (TR단조를 위한 환봉의 유도가열 해석에 관한 연구)

  • Song, M.C.;Park, D.S.;Lee, M.G.;Lee, K.B.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2009.10a
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    • pp.194-197
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    • 2009
  • The TR forging is a kind of continuous grain flow forging. The preform of crank shaft for TR forging process was a round bar with a ring groove. In the first stage, the preform was partly heated by induction heating and then forged by vertical and horizontal force in sequence. In this study, the simulation process of induction heating was proposed to evaluate the temperature distribution of preform for TR forging. The equivalent circuit method was adopted to find coil current of the preform with a various dimensions and power levels. With these results, the coupled electromagnetic and transient thermal analysis for induction heating was performed to evaluate the temperature distribution at the preform of crank shaft during induction heating process. This FE analysis technique with equivalent circuit method was verified by comparing the analysis results with the experimental results.

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The Thermal and Circuits Design of an LED Bulb Considering Temperature Property (온도 특성을 고려한 LED 전구의 방열 및 회로 설계)

  • Song, Sang-Bin;Yeo, In-Seon
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.56 no.7
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    • pp.1261-1267
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    • 2007
  • Although LEDs have been used in various applications with improving the brightness and luminous efficacy, the electrical and optical characteristics of high power LED varies at different temperature and starting time. In this paper, optimal heat sink and apparatus design were conducted using IR camera and ICEPAK on the LED bulb consisting with fourteen LED array. The temperatures of heat sink and LED device of the designed LED bulb without cooling pan were $74^{\circ}C\;and\;96.8^{\circ}C$, respectively, showing in good themal characteristics. For high efficiency driving circuit of LED array adopted optimal heat sink design, driving circuits of constant voltage and current circuits were suggested and fabricated. As a result the efficacy of all driving circuits showed more than 20 lm/W. Also, the constant current circuits are suitable for signal lamp, hallway lamp, and flash lamp having short operating time(about 30 min). On the other hand, a reading light and indoor lamp having long operating time can be controlled by constant voltage circuit.

A Study on the Measurement Circuit System of RI Gauge (RI 계기의 측정회로 시스템에 관한 연구)

  • 김기준
    • Proceedings of the Korea Society for Industrial Systems Conference
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    • 1999.05a
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    • pp.217-222
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    • 1999
  • In this study an objection, to be needed at public works, is to develop a measurement circuit of a gauage using radioisotope for compaction control. The developed gauage consists of measuring circuits for gamma-rays and thermal neutrons, a high voltage supply unit, and a microprocessor. To obtain meaningful numbers of pulse counts, parallel five and two circuits are provided for gamma-rays and thermal neutrons, respectively. Also, to minimize effects of natural environmental radiation and electrical noise, circuits are electrostatically shielded and pulses made by ripples are eliminated by taking frequency of high voltage supplied to the circuit and pulse height of ripples into consideration.

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Copper thickness and thermal reliability of microvias produced by laser-assisted seeding (LAS) process in printed circuit board (PCB) manufacture

  • Leung, E. S.W.;Yung, W. K.C.
    • International Journal of Quality Innovation
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    • v.2 no.2
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    • pp.69-92
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    • 2001
  • The laser-assisted seeding (LAS) process has potential to replace conventional electroless copper plating in Printed Circuit Board (PCB) manufacturing since it combines the steps of laser drilling and plating into one single process. In the LAS process, the single extra LAS step can metallize a microvia. Thus, the process steps can be greatly reduced and the productivity enhanced, but also the high aspect ratio microvias can be metallized. The objectives of this paper are to study the LAS copper thickness within PCB microvias and the thermal reliability of the microvias produced by this process. It was found that results were satisfactory in both the reliability test and also the LAS copper thickness which both comply with IPC standard, the copper thickness produced by the LAS process is sufficient for subsequent electro-plating process. The reliability of the microvias produced by LAS process is acceptable which are free from any voids, corner cracks, and distortion in the plated copper.

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A Development of Electronic Type Relay for Low Voltage Circuit Breaker based on Digital Signal Processing (디지털 신호 처리 기반 저압 차단기용 전자식 계전기 개발)

  • Park, Byung-Chul;Shon, Jong-Man;Song, Sung-Kun;Shin, Joong-Rin
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.27 no.5
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    • pp.81-88
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    • 2013
  • A low voltage circuit breaker protects electrical equipments from over current and short faults of system by cutting the power supply. The breaker use a thermal magnetic type trip device from the past. In recent years, electronic type relays are applied due to useful functions and services. The purpose of this development is full digitalizing of relay functions of a low voltage breaker. It includes separation of current sensor from current transformer, digital signal processing, high speed relaying, and voltage measuring for power meter. The suggestions are tested and implemented by making prototype and testing its all relay functions.

A Design of bias circuit in temperature independent voltage detect circuit (온도에 의존하지 않는 전압 감시회로에서의 바이어스 회로의 설계)

  • 문종규;백종무
    • Journal of the Korean Institute of Telematics and Electronics C
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    • v.35C no.9
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    • pp.49-56
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    • 1998
  • In this paper, a design of bias circuit in temperature independent voltage detect circuit is proposed. In order to realize this intention, we are used the differences in temperature coefficient of thermal voltage, resistor and transistor forward voltage(V$\sub$BE/) which is consisted in comparator. That is, It is realized by compensating the difference of temperature coefficient due to using components with each different temperature coefficient. As well, reference voltage of the circuit is accomplished by the difference of transistor forward voltage($\Delta$V$\sub$BE/) in comparator. In using reference voltage, resistor and V$\sub$BE/ Multiplier, we can design detect voltage of the circuit. In order to test operation of proposing circuit, we manufactured IC. Then, we measured operating characteristics and capability of the circuit by using HP4145B and temperature chamber. The result, we could obtain the good variation of temperature from -0.01 %/$^{\circ}C$ to -0.025 %/$^{\circ}C$.

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Analysis of Voltage Drop and Thermal Characteristics for Poor Connections at Electrical Connector of Circuit Breaker of Small Size Pulverizer below 5.5kW (5.5kW이하의 소형분쇄기 차단기 접속부의 접촉불량에 의한 전압강하 및 열적 특성 분석)

  • Kim, Sang Chul
    • Journal of the Korean Society of Safety
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    • v.30 no.3
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    • pp.26-31
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    • 2015
  • This paper describes the characteristics of voltage drop and thermal for poor connection on electrical connector of circuit breaker in control box of small size pulverizer. In order monitor, we did the changes of RMS in voltage and temperature value with video and made normal state over $2.5N{\cdot}m$ and poor connections state below $0.2N{\cdot}m$ by screw gage. In case of voltage signal, the voltage drop was increased when the current was increased due to poor connections. In case of temperature signal, the temperature difference indicates ten times at 5A and fourteen times at 15A in the normal state. According to increase thermal energy, the insulation of electrical wiring and connector of circuit breaker can be carbonized. The results of this study will be useful to the development of preventive devices and system for electric fire by poor connection at small size pulverizer.

A study of DSC using Ultrasonic and Thermal treatment on nano-crystalline $TiO_{2}$ surface (염료감응형 태양전지 $TiO_{2}$ 광전극 표면의 초음파 열처리에 관한 연구)

  • Hong, Ji-Tae;Choi, Jin-Young;Seo, Hyun-Woong;Kim, Jong-Lak;Kim, Hee-Je
    • 한국신재생에너지학회:학술대회논문집
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    • 2007.06a
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    • pp.317-319
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    • 2007
  • Recently, there were many researches for efficiency improvement of DSC. Among of these works, research of surface treatment is still a prerequisite for electron diffusion, light-harvesting and surface state of $DSC^{4)}$. Using of the surface treatment, it can be raise up porosity of $TiO_{2}$ nano-crystalline structure on $photo-electrode^{5)}$. There are chemical, physical, electrical and optical methods which raise up its porosity. In this paper, we have designed and manufactured MOPA-type ultrasonic circuit (100W, frequency and duty variable). Manufactured ultrasonic circuit to use to force cavity density and power into $TiO_{2}$ paste. Then, we have optimized forcing time, frequency and duty of ultrasonic irradiation for surface treatment of photo-electrode of DSC. In I-V characteristic test of DSC, ultrasonic and thermal treated DSC shows 19% improved its efficiency against established DSC.

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