• Journal of the Korean Society for Precision Engineering
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• v.17 no.2
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• pp.130-136
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• 2000

Generally, the build-up printed circuit board manufactured by the sequential process with etching, plating, drilling etc. requires many types of equipments and lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing prototype in the developing stage. In this study, we introduce a screen printing technology to prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as the formation of liquid resin thin layer, the solidification by UV/IR light, and via filling with conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with to the conventional process.

• The Transactions of the Korean Institute of Electrical Engineers
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• v.43 no.2
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• pp.206-215
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• 1994

A method for simulating general characteristics and temperature characteristics of discharging SCR of the capacitor discharge impulse magnetizer-magnetizing fixture system using SPICE is presented. This method has been developed which can aid the design, understanding and inexpensive, time-saving of magnetizing circuit. As the detailed characteristic of magnetizing circuit can be obtained, the efficient design of the magntizing circuit which produce desired magnet will be possible using our SPICE modeling. Especially, computation of the temperature rise of discharging SCR is very important since it gives some indication of thermal characteristic of discharging circuit. It is implemented on a 486 personal computer, and the modeling results are checked against experimental measures. The experimental results have been achived using 305[V] and 607[V] charging voltage, low-energy capacitor discharge impulse magnetizer-magnetizing fixture of air cleaner DC motor.

• International Journal of Air-Conditioning and Refrigeration
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• v.6
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• pp.1-13
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• 1998

The basic heat transfer process that occurs in a building can best be illustrated by an electrical circuit network. Present paper reports the dynamic simulation of annual energy consumption in an office building by the thermal resistance capacitance network method. Unsteady thermal behaviors and annual energy consumption in an office building were examined in detail by solving the simultaneous circuit equations of thermal network. The results are used to evaluate the accuracy of the modified BIN method for the energy consumption analysis of a large building. Present thermal resistance-capacitance method predicts annual energy consumption of an office building with the same accuracy as that of response factor method. However, the modified BIN method gives 15% lower annual heating load and 25% lower cooling load than those from the present method. Equipment annual energy consumptions for fan, boiler and chiller in the HVAC system are also calculated for various control systems as CAV, VAV, FCU+VAV and FCU+CAV. FCU+CAV system appears to consume minimum annual energy among them.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.60 no.12
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• pp.2311-2317
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• 2011

In this paper, we study the temperature change of a ${\mu}$-bolometer focal plane array with a capacitive transimpedance amplifier bias cancellation circuit. Thermal analysis is essential to understand the performance of a ${\mu}$-bolometer focal plane array, and to improve the temperature stability of a focal plane array characteristics. In this study, the thermal analyses of a ${\mu}$-bolometer and its two reference detectors are carried out as a function of time. The analyses are done with the $30{\mu}m$ pitch $320{\times}240$ focal plane array operating of 60 Hz frame rate and having a columnwise readout. From the results, the temperature increase of a ${\mu}$-bolometer in FPA by an incident IR is estimated as $0.689^{\circ}C$, while the temperature increase by a pulsed bias as $7.1^{\circ}C$, which is about 10 times larger than by IR. The temperature increase of a reference detector by a train of bias pulses may be increased much higher than that of an active ${\mu}$-bolometer. The suppression of temperature increase in a reference bolometer can be done by increasing the thermal conductivity of the reference bolometer, in which the selection of thermal conductivity also determines the range of CTIA output voltage.

• Journal of the Korean Society of Safety
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• v.27 no.4
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• pp.20-25
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• 2012

The purpose of this study is to analyze the thermal characteristics and to study fire hazard of electric leakage by iron power accumulated on circuit breaker in an iron processing factory. The thermal characteristics were analyzed while current was applied to the powder for ten minutes. Results showed that temperature of iron powder at 100 mA is $160^{\circ}C$ and at 175mA is $240^{\circ}C$. The sparks have occurred as iron powder drops between two(hot line and neutral line) wires and then iron powder explosion occurred while dropping continuously the iron powder on two lines. Those who work in the iron processing industry need to periodically remove and maintain the iron powder. The thermal characteristics in this paper can be used for electrical fire investigation and for basic data of thermal characteristic of leakage current through iron powder at iron processing factories.

• Transactions of the Korean hydrogen and new energy society
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• v.32 no.5
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• pp.347-355
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• 2021

This paper is a study on the thermal design of printed circuit heat exchanger (PCHE) to supply cryogenic high pressure liquid hydrogen stored from hydrogen liquefaction process by using computational fluid dynamics (CFD). This PCHE should be thermally designed to raise the temperature of cryogenic liquid hydrogen to a desired temperature and also to be anti-icing to avoid any local freezing in hot channel. This research presents the effect of inlet velocity and inlet temperature of hydrogen, and the effect of flow configurations of co/counter-flow on thermal design of PCHE heat exchanger based on various CFD simulation analysis.

• Proceedings of the KIEE Conference
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• 2004.07c
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• pp.1772-1774
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• 2004

Because the physics occurring during an interruption process is not well known, it is not easy to analyze the characteristics of a self-blast circuit breaker neither theoretically nor experimentally. Fortunately the available computational power and the numerical method improved recently make it possible to predict an interruption process as precisely and fast as possible. Therefore many researches using computational methods have been done for the interruption process of interrupters and applied to extend the information such as thermal and dielectric reignition. In this paper, we have simulated the interruption process of SF6 self-blast circuit breakers with the arc plasma during the fault interruption of a 10 kA current. The CFD program used here is coupled with the electromagnetic field analysis, the radiation model and the effects of turbulence. Through this work, we have get further information about the thermal performance as well as the behavior of the arc. The results have been compared with the measured arc voltage.

• Journal of Electrical Engineering and Technology
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• v.6 no.2
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• pp.270-274
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• 2011

This paper presents a parameterized simulation program with integrated circuit emphasis (SPICE) model of a two-level microbolometer based on negative-temperature-coefficient thin films, such as vanadium oxide or amorphous silicon. The proposed modeling begins from the electric-thermal analogy and is realized on the SPICE modeling environment. The model consists of parametric components whose parameters are material properties and physical dimensions, and can be used for the fast design study, as well as for the co-design with the readout integrated circuit. The developed model was verified by comparing the obtained results with those from finite element method simulations for three design cases. The thermal conductance and the thermal capacity, key performance parameters of a microbolometer, showed the average difference of only 4.77% and 8.65%, respectively.

• Transactions of the Korean Society of Mechanical Engineers
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• v.17 no.2
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• pp.438-444
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• 1993

The circuit board of an electronic equipment were simulated with a vertical channel which had thermal blocks protruded from one of the channel walls. A rought front plate was made of a circuit board attached with short wires to simulate the back side of a printed circuit board. Natural convection experiments were carried out to study the effects of channel space and rough front plate and to find the suitable characteristic value after the fourth row. The effect of a rough front plate was negligble. There were negligible effects of the channel space on the first and second heaters. Heat transfer coefficients after the third row decreased as the channel space decreased. Heat transfer coefficients were almost constant for larger than 20 mm channel space. A characteristic length was suggested to non-dimensionalize Nu and Ra numbers in a vertical channel with protruded heaters. A correlation was obtained using the new characteristic lengths.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.30 no.10 s.253
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• pp.942-949
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• 2006

A lumped model is proposed to predict liquid ejection characteristics of a thermally driven inkjet print head. The model is based on a two-dimensional heat conduction equation, an empirical pressure-temperature equation and a nonlinear hydraulic flow-pressure equation. It has been simulated through the construction of an equivalent R-C circuit, and subsequently analyzed using SIMULINK and a circuit simulation tool, PLECS. Using the model, heating and cooling characteristics of the head are predicted to be in agreement with the IR temperature measurements. The effects of the head geometry on the drop ejection are also analyzed using the nonlinear hydraulic model. The present model can be used as a design tool for a better design of thermal inkjet print heads.