• 한국생산제조학회지
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• 제19권6호
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• pp.746-752
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• 2010

Rib structure has been used to bed and column of machine tool to heighten weight stiffness ratio, cost performance and weight saving. In this paper the bed rib structure was estimated with thermal characteristics. Using superposition principle, machine tool designer can describe every complicated heat generation in the machine tool thermal source. As thermal characteristics, thermal deformation of guide rail and column and Maximum-minimum temperature variation were selected. The size, configuration and direction against the thermal loading surface operated to the thermal characteristics. The DB chart was made following rib structure estimating thermal characteristics. With superposition principle and DB chart, machine tool designer can prognosticate the thermal characteristics without FEM analysis to every bed rib structure.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2003년도 춘계학술대회 논문집
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• pp.494-499
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• 2003

This paper concerns the static, dynamic and thermal characteristics analysis of a high-speed spindle system for horizontal machining centers with 45mm x50,000rpm. The spindle system is designed based on the angular contact ceramic ball bearings, built-in motor, oil-air lubrication method and oil jacket cooling method. The structural and thermal analysis models of spindle system are constructed by the finite element method. The static and dynamic characteristics are estimated based on the static deformation, modal parameter, mode shape and frequency response function, and the thermal characteristics are estimated based on the temperature rise, temperature distribution and thermal deformation. The analysis results illustrate that the designed spindle system has excellent structural and thermal stabilities

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.37-41
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• 2002

Thermal characteristics of hydrostatic guideway is largely depended on the temperature of supplied oil. For improving the positioning accuracy of hydrostatic guideway, relationship between setting temperature of oil cooler and thermal characteristics is analyzed, and influence of thermal characteristics on positioning accuracy is also analyzed experimental1y in this paper. Laser scale which has 0.01 $\mu\textrm{m}$ of resolution is used as feed-back unit. From the experimental results, it is confirmed that positioning error and repeatability is minimize upto 0.21 $\mu\textrm{m}$ and 0.18 $\mu\textrm{m}$ when the temperature of supplied oil is setting equal to temperature of atmosphere, and also confirmed that thermal deformation, which occurs by the temperature deviation between table and rail or scale supporter, works as limit of repeatability in long time operation.

• 한국미생물·생명공학회지
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• 제19권1호
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• pp.100-108
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• 1991

Molecular characteristics and improving methods for thermal stability of enzyme have been considered. Intrinsic and extrinsic stabilizing mechanisms are two governing principles for enhanced thermal stability of enzyme in molecular basis. Factors contributing to the former and the latter mechanisms may be involved in the enhanced thermal stability of enzyme complementarily. Also, the methods for improving thermal stability of enzyme which comprise reaction in organic solvent system, chemical modification, immobilization, sequential unfolding and refolding, gene manipulation techniques and enzyme-antibody complexing are reviewed.

• 한국전기전자재료학회논문지
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• 제29권2호
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• pp.79-83
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• 2016

This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If thhe distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.

• 설비공학논문집
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• 제15권11호
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• pp.918-927
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• 2003

This study is to analyze thermal characteristics of the basement structures with a non-thermal insulation and various thermal insulations. From the results through the field experiments and computer simulations, the thermal bridges and heat loss is found in non-insulation structure of the basement under the definite depth of ground level. Therefore, the thermal insulation structure should be installed for preventing the heat loss in the basement.

• 수산해양기술연구
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• 제43권4호
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• pp.362-369
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• 2007

This paper was studied on the characteristics of acid resistance and thermal shock for epoxy coatings in the strong acidic environment. The exhaust gas system, such as a air preheater, desulfurization equipment, for industrial boiler is damaged by dew point corrosion. To protect the acid corrosion, the coating using nonmetal was applied. The electrochemical polarization test, acid resistance and thermal shock test for epoxy coatings were carried out. And the acid resistance and thermal shock characteristics, aspect, and electrochemical anti-corrosion characteristics for epoxy coatings in the strong acidic environment were considered. The main results are as followings: As the epoxy glass flake coating by acidic thermal shock was damaged to the crack, blistering and elution etc., the current density of epoxy glass flake coating is high. But the damage of epoxy metal complex coating by acidic thermal shock was not occurred. Therefore the characteristics of acid resistance and thermal shock for epoxy metal complex coating is better than those for epoxy glass flake coating.

• 항공우주시스템공학회지
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• 제13권1호
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• pp.18-28
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• 2019

초고속 비행체는 발사 및 재진입 시 공력 가열에 의해 높은 열 하중을 받는다. 초고속 비행체의 외피 구조물인 열방어 시스템 패널은 기계적으로 구속되어 있기 때문에 고온 가열 시 열 좌굴이 발생할 수도 있다. 이는 초고속 비행체의 유동장에 변화를 주어 공력특성을 불안정하게 한다. 따라서 열방어 시스템 패널은 초고속 비행에 의한 공력가열 시 비행안정성을 유지하기 위해 열 좌굴을 방지하도록 설계되어야 한다. 본 논문에서는 운용 시 안팎에 큰 온도차가 존재하는 열방어 시스템 패널에 대해 유한차분법을 사용하여 열전달 특성을 분석하였으며, 리츠 법을 사용하여 열 좌굴 특성에 대한 근사적 모델을 제안하였다. 또한 정의된 근사적 모델의 정확도를 검증하기 위해 유한요소 해석결과와 비교하였다. 마지막으로, 수립된 근사 기법을 바탕으로 열방어 시스템 패널의 좌굴 발생 온도에 대한 매개변수 분석을 수행하였다.

• Preventive Nutrition and Food Science
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• 제21권4호
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• pp.348-354
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• 2016

This study investigated the physicochemical characteristics of black garlic (BG) after different thermal processing steps. Compared with fresh garlic (FG), the moisture content and pH in BG decreased significantly, while the ash content and browning intensity increased during thermal processing. The total mineral and the free sugar contents were significantly higher than that of the BG2 and BG4 samples, respectively. The free sugar content increased by 16-fold in the BG cloves compared with that of FG, while the amino acid content increased during the first stage of thermal processing, and subsequently decreased. The thiosulfinate content in all samples decreased to during thermal processing. The pyruvic acid content initially increased and then decreased during thermal processing. These results contribute to our understanding of the role of thermal processing in the quality formation of BG.

• Transactions on Electrical and Electronic Materials
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• 제18권2호
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• pp.59-61
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• 2017

This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If the distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.