• Title/Summary/Keyword: thermal characteristics

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Thermal Characteristic Estimation of NC Machining Center Bed following Rib Structure (리브 구조에 따른 머시닝센터 베드의 열적 특성 평가)

  • Kim, Yang-Jin
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.19 no.6
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    • pp.746-752
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    • 2010
  • Rib structure has been used to bed and column of machine tool to heighten weight stiffness ratio, cost performance and weight saving. In this paper the bed rib structure was estimated with thermal characteristics. Using superposition principle, machine tool designer can describe every complicated heat generation in the machine tool thermal source. As thermal characteristics, thermal deformation of guide rail and column and Maximum-minimum temperature variation were selected. The size, configuration and direction against the thermal loading surface operated to the thermal characteristics. The DB chart was made following rib structure estimating thermal characteristics. With superposition principle and DB chart, machine tool designer can prognosticate the thermal characteristics without FEM analysis to every bed rib structure.

Static/Dynamic/Thermal Characteristics Analysis of a High-Speed Spindle System with 50,000rpm (50,000rpm급 초고속 주축계의 정적/동적/열적 특성 해석)

  • 김석일;조재완;이원재;이용희
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2003.04a
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    • pp.494-499
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    • 2003
  • This paper concerns the static, dynamic and thermal characteristics analysis of a high-speed spindle system for horizontal machining centers with 45mm x50,000rpm. The spindle system is designed based on the angular contact ceramic ball bearings, built-in motor, oil-air lubrication method and oil jacket cooling method. The structural and thermal analysis models of spindle system are constructed by the finite element method. The static and dynamic characteristics are estimated based on the static deformation, modal parameter, mode shape and frequency response function, and the thermal characteristics are estimated based on the temperature rise, temperature distribution and thermal deformation. The analysis results illustrate that the designed spindle system has excellent structural and thermal stabilities

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Thermal Characteristics of Hydrostatic Guideway in Ultra Precision Positioning (초정밀위치결정을 위한 유정압안내면의 온도특성 분석)

  • 박천홍;오윤진;황주호;이득우
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.05a
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    • pp.37-41
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    • 2002
  • Thermal characteristics of hydrostatic guideway is largely depended on the temperature of supplied oil. For improving the positioning accuracy of hydrostatic guideway, relationship between setting temperature of oil cooler and thermal characteristics is analyzed, and influence of thermal characteristics on positioning accuracy is also analyzed experimental1y in this paper. Laser scale which has 0.01 $\mu\textrm{m}$ of resolution is used as feed-back unit. From the experimental results, it is confirmed that positioning error and repeatability is minimize upto 0.21 $\mu\textrm{m}$ and 0.18 $\mu\textrm{m}$ when the temperature of supplied oil is setting equal to temperature of atmosphere, and also confirmed that thermal deformation, which occurs by the temperature deviation between table and rail or scale supporter, works as limit of repeatability in long time operation.

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Some Molecular Characteristics and Improving Methods for Thermal Stability of Enzyme (효소단백질 열안정성의 분자구조적 특성 및 증진기법)

  • 김남수;김수일
    • Microbiology and Biotechnology Letters
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    • v.19 no.1
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    • pp.100-108
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    • 1991
  • Molecular characteristics and improving methods for thermal stability of enzyme have been considered. Intrinsic and extrinsic stabilizing mechanisms are two governing principles for enhanced thermal stability of enzyme in molecular basis. Factors contributing to the former and the latter mechanisms may be involved in the enhanced thermal stability of enzyme complementarily. Also, the methods for improving thermal stability of enzyme which comprise reaction in organic solvent system, chemical modification, immobilization, sequential unfolding and refolding, gene manipulation techniques and enzyme-antibody complexing are reviewed.

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Study on Thermal Characteristics of Smart LED Driver ICs Package (일체형 스마트 LED Driver ICs 패키지의 열 특성 분석)

  • Kang, Ey Goo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.29 no.2
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    • pp.79-83
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    • 2016
  • This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If thhe distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.

Thermal Characteristics with Various Thermal Insulation Types in Basement Structures (지하층 구조체의 단열재 설치방법에 따른 열전달 특성)

  • 이재윤;조동우
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.15 no.11
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    • pp.918-927
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    • 2003
  • This study is to analyze thermal characteristics of the basement structures with a non-thermal insulation and various thermal insulations. From the results through the field experiments and computer simulations, the thermal bridges and heat loss is found in non-insulation structure of the basement under the definite depth of ground level. Therefore, the thermal insulation structure should be installed for preventing the heat loss in the basement.

Study on the characteristics of acid resistance and thermal shock for epoxy coatings (에폭시계 코팅재의 내산열충격 특성에 관한 연구)

  • Lee, Sang-Yeal;Yun, Byoung-Du
    • Journal of the Korean Society of Fisheries and Ocean Technology
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    • v.43 no.4
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    • pp.362-369
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    • 2007
  • This paper was studied on the characteristics of acid resistance and thermal shock for epoxy coatings in the strong acidic environment. The exhaust gas system, such as a air preheater, desulfurization equipment, for industrial boiler is damaged by dew point corrosion. To protect the acid corrosion, the coating using nonmetal was applied. The electrochemical polarization test, acid resistance and thermal shock test for epoxy coatings were carried out. And the acid resistance and thermal shock characteristics, aspect, and electrochemical anti-corrosion characteristics for epoxy coatings in the strong acidic environment were considered. The main results are as followings: As the epoxy glass flake coating by acidic thermal shock was damaged to the crack, blistering and elution etc., the current density of epoxy glass flake coating is high. But the damage of epoxy metal complex coating by acidic thermal shock was not occurred. Therefore the characteristics of acid resistance and thermal shock for epoxy metal complex coating is better than those for epoxy glass flake coating.

Thermal Buckling Characteristics for Thermal Protection System Panel Using Ritz Method (리츠 법을 이용한 열방어 시스템 패널의 열 좌굴 특성 연구)

  • Lee, Heesoo;Kim, Yongha;Park, Jungsun
    • Journal of Aerospace System Engineering
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    • v.13 no.1
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    • pp.18-28
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    • 2019
  • High speed vehicles are subjected to high thermal loadings due to aerodynamic heating during ascent and reentry. Since a thermal protection system panel is mechanically constrained, it may cause thermal buckling under excessive thermal loadings. The thermal buckling could disturb the field of flow and make aerodynamic characteristics unstable. It is thus necessary to design the thermal protection system panel to prevent thermal buckling. This study defines the analytical model of temperature distribution using the finite difference method for the thermal protection system panel with large temperature differences inside and outside. This paper proposes the approximate model of the thermal buckling characteristics for the thermal protection system panel through the use of the Ritz method. The validity of the present method was verified by comparing the results of the finite element analysis. Furthermore, this research performs the parametric analysis of the thermal buckling characteristics for the thermal protection system panel by using the approximate model.

Physicochemical Characteristics of Black Garlic after Different Thermal Processing Steps

  • Kang, Ok-Ju
    • Preventive Nutrition and Food Science
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    • v.21 no.4
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    • pp.348-354
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    • 2016
  • This study investigated the physicochemical characteristics of black garlic (BG) after different thermal processing steps. Compared with fresh garlic (FG), the moisture content and pH in BG decreased significantly, while the ash content and browning intensity increased during thermal processing. The total mineral and the free sugar contents were significantly higher than that of the BG2 and BG4 samples, respectively. The free sugar content increased by 16-fold in the BG cloves compared with that of FG, while the amino acid content increased during the first stage of thermal processing, and subsequently decreased. The thiosulfinate content in all samples decreased to during thermal processing. The pyruvic acid content initially increased and then decreased during thermal processing. These results contribute to our understanding of the role of thermal processing in the quality formation of BG.

Study on Thermal Analysis for Optimization LED Driver ICs

  • Chung, Hun-Suk
    • Transactions on Electrical and Electronic Materials
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    • v.18 no.2
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    • pp.59-61
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    • 2017
  • This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If the distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.