• Steel and Composite Structures
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• v.33 no.1
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• pp.81-92
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• 2019

The present paper addresses a refined plate theoryin order to describe the response of anti-symmetric cross-ply laminated plates subjected to a uniformlydistributed nonlinear thermo-mechanical loading. In the present theory, the undetermined integral terms are used and the variables number is reduced to four instead of five or more in other higher-order theories. The boundary conditions on the top and the bottom surfaces of the plate are satisfied; hence the use of the transverse shear correction factors isavoided. The principle of virtual work is used to obtain governing equations and boundary conditions. Navier solution for simply supported plates is used to derive analytical solutions. For the validation of the present theory, numerical results for displacements and stressesare compared with those of classical, first-order, higher-order and trigonometricshear theories reported in the literature.

• Steel and Composite Structures
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• v.42 no.3
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• pp.397-405
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• 2022

The existing researches on the dynamics of the fluid-conveying pipes only focus on stability and vibration problems, and there is no literature report on the wave propagation of the fluid-conveying pipes. Therefore, the purpose of this paper is to explore the propagation characteristics of longitudinal and flexural waves in the fluid-conveying pipes. First, it is assumed that the material properties of the fluid-conveying pipes vary based on a power function of the thickness. In addition, it is assumed that the material properties of both the fluid and the pipes are closely depended on temperature. Using the Euler-Bernoulli beam equation and based on the linear theory, the motion equations considering the thermal-mechanical-fluid coupling is derived. Then, the exact expressions of phase velocity and group velocity of longitudinal waves and bending waves in the fluid-conveying pipes are obtained by using the eigenvalue method. In addition, we also studied the free vibration frequency characteristics of the fluid-conveying pipes. In the numerical analysis, we successively studied the influence of temperature, functional gradient index and liquid velocity on the wave propagation and vibration problems. It is found that the temperature and functional gradient exponent decrease the phase and group velocities, on the contrary, the liquid flow velocity increases the phase and group velocities. However, for vibration problems, temperature, functional gradient exponent parameter, and fluid velocity all reduce the natural frequency.

• Progress in Superconductivity and Cryogenics
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• v.8 no.3
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• pp.23-26
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• 2006

For mechanical and electrical stability and environment protection. Cu and stainless steel stabilizers are laminated to a Ag layer to produce a composite neutral-axis(N-A) architecture in which the YBCO layer is centered between the oxide buffered metallic substrate and stabilizer strip lamination. This architecture allows the wire to meet operational requirements including stresses at cryogenic temperature. winding tensions as well as mechanical bending requirements including thermal and electrical stability under fault current conditions. We have experimentally studied mechanical properties of the laminated stainless steel and Cu stabilizers on YBCO coated conductors. We have laminated YBCO coated conductors by continuous dipping soldering process. We have investigated lamination interface between solder and stabilizer of the YBCO coated conductor. We evaluated bonding properties. tensile / shear bonding strength. and peeling strength laminated YBCO coated conductors.

• Progress in Superconductivity and Cryogenics
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• v.9 no.3
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• pp.9-12
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• 2007

In this study. we searched for the mechanical and electrical properties of laminated coated conductors with stabilizer tape. Stabilizer tape plays a role for mechanical and electrical stability and environmental protection. Cu material stabilizer was laminated to Ag capping layer on SmBCO conductor layer. This architecture allows the wire to meet operational requirements including the stressless at cryogenic temperature and winding tension as well as mechanical bending requirements including thermal and electrical stability under fault current conditions. First, we have experimentally studied mechanical bonding properties of the laminated Cu stabilizers on SmBCO coated conductors. We have laminated SmBCO coated conductors by continuous dipping soldering process, Second, we have investigated electrical properties of the SmBCO coated conductors with stabilizer lamination. We evaluated bonding properties, peeling strength and critical current for laminated SmBCO coated conductors with Cu stabilizers.

• Journal of the Korean Society for Precision Engineering
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• v.14 no.11
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• pp.69-76
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• 1997

The rotating bending fatigue tests were performed using the specimens taken from Cr-Mo-V steel, widely sued in thermal power plant turbines, at various temperatures such as room temperature, 300 .deg. C, 425 .deg. C and 550 .deg. C. The characteristics of fatigue crack propagation were examined and analyzed by using fracture mechanics parameter. The plastic replica method was also applied in order to measure the crack length on the basis of serial observation of fatigue crack propagation behavior on the defected specimen surface. The fatigue crack propagation behavior of Cr-Mo-V steel was investigated within the frame work of elastic-plastic fracture mechanics. The propagation law of fatigue crack is obtained uniquely by using the term .sigma. $^{n}$ sub a/where .sigma. $_{a}$ is the service stress, a is the crack length and n is a constant. The values of constant n are nearly equal to 2.48, 2.60 and 8.61 at room temperature, 300 .deg. C and 425 .deg. C.

• Journal of Surface Science and Engineering
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• v.57 no.3
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• pp.192-200
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• 2024

Cu as a heat exchanger tube is an important component in thermal fluid transfer. However, Cu tubes are exposed to stress in certain environments, leading to stress corrosion cracking (SCC). In this study, the effect of Sn addition on microstructure and corrosion characteristics was examined. The microstructural examination revealed the presence of columnar crystal and a grain refinement due to the addition of Sn. Electrochemical measurements showed that the 5 wt.% NH₃ environment was the most vulnerable environment to Cu corrosion, and the corrosion current density increased as stress increased. The immersion test exhibited the formation of Cu2O and Cu(OH)₂ corrosion product in 3.5 wt.% NaCl and 5 wt.% NH₃ environments, respectively. Results indicated that Sn addition to Cu was an important factor in improving the mechanical strength.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.39-46
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• 2021

The quantitative measurement of interfacial adhesion energy (Gc) of multilayer thin films for Cu interconnects was investigated using a double cantilever beam (DCB) and 4-point bending (4-PB) test. In the case of a sample with Ta diffusion barrier applied, all Gc values measured by the DCB and 4-PB tests were higher than 5 J/㎡, which is the minimum criterion for Cu/low-k integration without delamination. However, in the case of the Ta/Cu sample, measured Gc value of the DCB test was lower than 5 J/㎡. All Gc values measured by the 4-PB test were higher than those of the DCB test. Measured Gc values increase with increasing phase angle, that is, 4-PB test higher than DCB test due to increasing plastic energy dissipation and roughness-related shielding effects, which matches well interfacial fracture mechanics theory. As a result of the 4-PB test, Ta/Cu and Cu/Ta interfaces measured Gc values were higher than 5 J/㎡, suggesting that Ta is considered to be applicable as a diffusion barrier and a capping layer for Cu interconnects. The 4-PB test method is recommended for quantitative adhesion energy measurement of the Cu interconnect interface because the thermal stress due to the difference in coefficient of thermal expansion and the delamination due to chemical mechanical polishing have a large effect of the mixing mode including shear stress.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.19 no.3 s.73
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• pp.271-282
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• 2006

The behavior of the concrete slabs on grade considering the horizontal resistance at the slab bottom, which exists due to the shear resistance of the foundation and the friction between the slab and the foundation, has been investigated when the slabs-on-grade are subjected to the thermal load. Analytical formulations have been developed to include the effect of the horizontal resistance at the slab bottom employing the thin plate on an elastic foundation that is widely used for the analysis of concrete slabs-on-grade and rigid pavement systems. Finite element formulations have then been developed using the plate bending elements and the flat shell elements. The solutions from the analytical and numerical models have been compared and showed very good agreement. The sensitivity of the horizontal resistance to the stresses of the concrete slab has been investigated with various values of the slab thickness, elastic modulus, and vortical stiffness of the foundation when subjected to the temperature gradient between the top and bottom of the slab and the uniform temperature drop throughout the slab depth. The analysis results show that the horizontal resistance at the plate bottom can significantly affect the stresses of the slab when the thermal loads are applied.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.17-27
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• 2011

This paper describes an experimental study and finite element analysis (FEA) carried out for investigating thermal deformation behavior of solders, resulting from temperature change in the solder. With such a goal in mind, a shear specimen that was composed of two metal bars having different coefficient of thermal expansion and solder blocks placed between two bars was designed and fabricated. Two different types of solder blocks, eutectic solder (Sn/36Pb/ 2Ag) and lead-free solder (Sn/3.0Ag/0.5Cu) were tested as well. Fringe patterns for several temperature steps were recorded and analyzed for three temperature cycles using a real-time moir$\acute{e}$ setup. The experimental data was verified with FEA and used to evaluate the suitability for numerous solder constitutive models available in literatures. FEA employing Anand material model suggested by Darveaux et al. and Chang et al. were found to be in an excellent agreement with the experimental results for the eutectic solder and the lead-free solder, respectively. In addition, numerical predictions on bending displacement, shear strain and viscoplastic distortion energy are documented and viscoplastic deformation behavior of two types of solder material are compared.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.21 no.1
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• pp.21-26
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• 2011

Ni-YSZ (Yttria Stabilized Zirconia) composite powders were fabricated by glycine nitrate process. The prepared powders were sintered at $1300{\sim}1400^{\circ}C$ for 4 h in air and reduced at $1000^{\circ}C$ for 2 h in a nitrogen and hydrogen atmosphere. The microstructure, electrical conductivity, thermal expansion and mechanical properties of the Ni-YSZ cermets have been investigated with respect to the volume contents of Ni. A porous microstructure consisting of homogeneously distributed Ni and YSZ phases together with well-connected grains was observed. It was found that the open porosity, electrical conductivity, thermal expansion and bending strength of the cermets are sensitive to the volume content of Ni. The Ni-YSZ cermet containing 40 vol% Ni was ascertained to be the optimum composition. This composition offers sufficient open porosity of more than 30 %, superior electrical conductivities of 917.4 S/cm at $1000^{\circ}C$ and a moderate average thermal expansion coefficient of $12.6{\times}10^{-6}^{\circ}C^{-1}$ between room temperature and $1000^{\circ}C$.