• Journal of the Korean Chemical Society
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• v.57 no.1
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• pp.109-114
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• 2013

The effects of aluminum nanoparticles (AlNs) on the thermal decomposition of ammonia perchlorate (AP) were investigated by DSC, TG-DSC and DSC-TG-MS-FTIR. Addition of AlNs resulted in an increase in the temperature of the first exothermic peak of AP and a decrease in the second. The processing of non-isothermal data at various heating rates with and without AlNs was performed using Netzsch Thermokinetics. The dependence of the activation energy calculated by Friedman's isoconversional method on the conversion degree indicated the decomposition process can be divided into three steps. They were C1/D1/D1 for neat AP, determined by Multivariate Non-linear Regression, and changed to C1/D1/F2 after addition of AlNs into AP. The isothermal curves showed that the thermal stability of AP in the low temperature stage was improved in the presence of AlNs.

• Bulletin of the Korean Chemical Society
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• v.19 no.3
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• pp.291-295
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• 1998

Various enaminonitriles-terminated reactive polymer precursors containing rigid aromatic and flexible alkyl units were prepared from the corresponding diamines and 1-chloro-1-phenyl-2,2-dicyanoethene (1). All the enaminonitriles-terminated precursors were characterized by spectroscopies and elemental analysis. They were highly soluble in DMF and NMP, and partially soluble in common organic solvents such as THF and acetone. They showed a large exotherm around 350 ℃ attributable to the thermal polymerization by crosslinking of the dicyanovinyl group. Upon heating the precursors, heat-resistant and insoluble network polymers were obtained. Thermogravimetric analyses of the precursors containing rigid aromatic moiety exhibited thermal stability with a 10% weight loss around 420-480 ℃ and 75-88% residual weight at 500 ℃ under nitrogen.

• Applied Chemistry for Engineering
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• v.30 no.3
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• pp.371-378
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• 2019

Graphene nanoplatelet (GnP)/reused phenolic foam (re-PF)/wood composite boards were fabricated with different GnP content as 5, 10 and 20 w/w% to investigate the effect of GnP on thermal- and flame retardant properties of wood-based composite boards. The thermal- and flame retardant properties of fabricated composite boards were investigated by thermogravimetric analysis (TGA) and limiting oxygen index (LOI), respectively. The thermal stability of the composite boards increased proportionally with respect to the amount of GnP, and the char yield of these boards increased up to 22% compared to that of the pure wood board. The LOI values of composite boards were about 4.8~7.8% higher than those of using pure wood boards. It was also confirmed that the flame retardant properties of composite boards were remarkably improved by the addition of re-PF and GnP. These results were because of the fact that the re-PF and GnP with a high thermal stability delayed the initial thermal degradation temperature of composite boards and made their char layers denser and thicker which led the overall combustion delay effect of the composite board. Especially, GnP as a carbon-based material, facilitated the char layer formation and increased remarkedly the char yield, which showed higher effect on flame retardant properties than those of the re-PF.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.376-376
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• 2012

Semiconductor nanowires (NWs) are future building block for nano-scale devices. Especially, Ge NWs are fascinated material due to the high electrical conductivity with high carrier mobility. It is strong candidate material for post-CMOS technology. However, thermal stability of Ge NWs are poor than conventional semiconductor material such as Si. Especially, when it reduced size as small as nano-scale it will be melted around CMOS process temperature due to the melting point depression. Recently, Graphene have been intensively interested since it has high carrier mobility with single atomic thickness. In addition, it is chemically very stable due to the $sp^2$ hybridization. Graphene films shows good protecting layer for oxidation resistance and corrosion resistance of metal surface using its chemical properties. Recently, we successfully demonstrated CVD growth of monolayer graphene using Ge catalyst. Using our growth method, we synthesized Ge/graphene core/shell (Ge@G) NW and conducted it for highly thermal stability required devices. We confirm the existence of graphene shell and morphology of NWs using SEM, TEM and Raman spectra. SEM and TEM images clearly show very thin graphene shell. We annealed NWs in vacuum at high temperature. Our results indicated that surface melting phenomena of Ge NWs due to the high surface energy from curvature of NWs start around $550^{\circ}C$ which is $270^{\circ}C$ lower than bulk melting point. When we increases annealing temperature, tip of Ge NWs start to make sphere shape in order to reduce its surface energy. On the contrary, Ge@G NWs prevent surface melting of Ge NWs and no Ge spheres generated. Furthermore, we fabricated filed emission devices using pure Ge NWs and Ge@G NWs. Compare with pure Ge NWs, graphene protected Ge NWs show enhancement of reliability. This growth approach serves a thermal stability enhancement of semiconductor NWs.

• Bulletin of the Korean Chemical Society
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• v.35 no.10
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• pp.2911-2916
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• 2014

The gas phase structures, energetics, and interconversion pathways of five lowest energy conformers of acetylcholine were examined employing the B3LYP, MP2, and CCSD(T) methods in conjunction with diverse basis sets including the correlation consistent aug-cc-pVDZ and aug-cc-pVTZ basis sets. It is found that use of adequate basis set containing proper polarization and diffuse functions capable of describing the floppy potential energy surface of acetylcholine is important in correctly predicting the relative stability of these conformers. The interconversion pathways and barrier heights between these conformers were elucidated by examining the potential energy surface for torsional motion, which also manifested the presence of chiral conformations of acetylcholine corresponding to the original conformations. On the basis of high level electronic energy calculations and thermal contribution analysis, four lowest energy conformers appear to be populated in the energy range of less than 1 kcal/mol at room temperature.

• Journal of the Korean Applied Science and Technology
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• v.20 no.4
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• pp.353-357
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• 2003

Sodium azide (SA) is commonly used as propellant for inflating automatic safety bags and other chemical manufacturing purposes. The investigation of potentially thermal hazard of sodium azide and its mixture with polymers are very important because it can occur an expected traffic accident so we took a experiment s using different scanning calorimeter (DSC) in nitrogen atmosphere. The decomposition temperature were about $350{\sim}450^{\circ}C$. We could find not only exothermic reaction was remarkably decreased in mixture s of acrylonitrile-butadiene-styrene (ABS) and polyvinyl chloride (PVC), but also increasing mixed rate of ABS, polyvinyl alcohol (PVA) and polymethyl methacrylate (PMMA) decreased thermal decomposition heat.

• Korean Journal of Materials Research
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• v.13 no.1
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• pp.1-5
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• 2003

Uniform polycrystalline $CoSi_2$layers have been grown in situ on a polycrystalline Si substrate at temperature near $625^{\circ}C$ by reactive chemical vapor deposition of cyclopentadienyl dicarbonyl cobalt, Co(η$^{5}$ -C$_{5}$ H$_{5}$ )(CO)$_2$. The growth behavior and thermal stability of $CoSi_2$layer grown on polycrystalline Si substrates were investigated. The plate-like CoSi$_2$was initially formed with either (111), (220) or (311) interface on polycrystalline Si substrate. As deposition time was increasing, a uniform epitaxial $CoSi_2$layer was grown from the discrete $CoSi_2$plate, where the orientation of the$ CoSi_2$layer is same as the orientation of polycrystalline Si grain. The interface between $CoSi_2$layer and polycrystalline Si substrate was always (111) coherent. The growth of the uniform $CoSi_2$layer had a parabolic relationship with the deposition time. Therefore we confirmed that the growth of $CoSi_2$layer was controlled by diffusion of cobalt. The thermal stability of $CoSi_2$layer on small grain-sized polycrystalline Si substrate has been investigated using sheet resistance measurement at temperature from $600^{\circ}C$ to $900^{\circ}C$. The $CoSi_2$layer was degraded at $900^{\circ}C$. Inserting a TiN interlayer between polycrystalline Si and $_CoSi2$layers improved the thermal stability of $CoSi_2$layer up to $900^{\circ}C$ due to the suppression of the Co diffusion.

• Bulletin of the Korean Chemical Society
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• v.21 no.6
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• pp.557-561
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• 2000

Various enaryloxynitriles-terminated reactive polymer precursors containing rigid aromatic units were prepared from various diamines and 1-(p-formylphenyl)-1-phenyl-2,2-dicyanoethene (1). Arylate end-capped model compounds linked with azomethine bond were also prepared by reacting p-formylphenyl benzoate with diamines to compare the curing ability. The oligomers were highly soluble in polar aprotic solvents such as N,N-dimethylformamide, dimethylsulfoxide and N-methyl-2 -pyrrolidinone. They generally showed an exothermic curing process between $280-350^{\circ}C$, attributable to the thermal crosslinking of the dicyanovinyl group in DSC analysis, and no weight loss at curing temperature. Upon heating the polymer precursors, heat-resistant and insoluble network polymers were obtained. Thermogravimetric analyses of the precursors containing rigid aromatic units showed thermal stability with a 77-92% residual weight at $500^{\circ}C$ under nitrogen.

• Carbon letters
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• v.9 no.4
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• pp.308-315
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• 2008

In the present study, fast isothermal stabilization processes for rayon precursor fabrics were performed at $350^{\circ}C$ and $400^{\circ}C$ within 3 minutes and the chemical and physical characteristics of the stabilized fabrics were investigated. In addition, rayon precursor fabrics were pre-treated with three different phosphorous-based flame retardants and then stabilized. The effect of flame retardants on the chemical composition, thermal shrinkage, weight change, thermal stability and XRD results was examined, comparing with those of the precursor fabrics. The result showed that the stabilization of rayon fabrics was most effective as the stabilization temperature was $350^{\circ}C$, the stabilization time was 3 min, and the pre-treatment with phosphoric acid of 1 vol%. The carbon contents of stabilized rayon fabrics were increased with increasing stabilization temperature and time, whereas the oxygen contents were decreased. Also, it is likely that the pre-treatment with phosphoric acid plays a role in retarding the change of chemical structure of rayon fabric. The XRD result was quite consistent with the result showing the effect of phosphoric acid on the chemical composition, thermal shrinkage and weight reduction of rayon fabric.

• The Korean Journal of Ceramics
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• v.3 no.2
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• pp.92-95
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• 1997

Because of the novel characteristics such as chemical stability, hardness, electrical resistivity and thermal conductivity, diamond-like carbon (DLC) film is a suitable material for the passivation layers. For this purpose, using the PECVD, DLC films were synthesized at room temperature. The adhesion and the hardness of the DLC films deposited on Si an SiO2 substrate were measured. The resistivity of 5.3$\times$$10^8$$\Omega$.cm was measured by automatic spreading resistance probe analysis method. The thermal conductivities of different DLC films were measured and compared with that of phospho silicate glass (PSG) film which is commonly used as passivation layers. The thermal conductivity of DLC film was improved by increasing hydrogen flow rate up to 90 sccm and was better than that of PSG film. The patterning techniques of the DLC film developed using the RIE and the lift-off method to form 5$\mu\textrm{m}$ line. Finally, the thermal characteristics of the power transistor with the DLC film as passiviation layer was analyzed.